Enabling the 27 nm node via a grazing incidence collector integrated into the DPP source for EUVL HVM

Transcription

1 Enabling the 27 nm node via a grazing incidence collector integrated into the DPP source for EUVL HVM G. Bianucci * Media Lario Technologies, Località Pascolo, I Bosisio Parini, ITALY * giovanni.bianucci@media-lario.com, Phone: Page 1

2 Outline MLT core capabilities and manufacturing technology closing the HVM gap Field-installed evolutionary performance of Grazing Incidence Collectors Current collector integration into XTREME Technologies DPP source enabling 100 W IF for 27 nm node IF Thermal management of Grazing Incidence Collector fully aligned to the source power scaling roadmap Page 2

3 MLT closing the HVM gap The challenge for EUVL is to scale to higher throughput and lower CoO. The challenge is greater at the source and collector: Higher power loading More precise optical performance Source and collector system IF aperture Scanner Illuminator PO box Wafer handling Reticle handling Overlay Reticle CD = 27 nm Source+DMT Collector Page 3

4 MLT Reflective optical components & subsystems MLT is a fully integrated designer and manufacturer of reflective optical components & subsystems, from design to qualification Radio telescopes X-ray telescopes EUVL collectors Other applications MLT develops p and manufactures customized designs g to meet application pp requirements q Product design Optical Thermo-mechanical Mandrel mfg Optics mfg In-house polishing HSFR < 0.2 nm Figure < 40 nm Replication 800 mm HSFR < 0.3 nm Figure < 40 nm Metrology Reflective layers EUVL: Ru, Mo/Si X-ray: W/Si, Pt/C B/30 interferometer B/10 profilometer EUV reflectometer VIS optical qualif. System integration EUVL collectors X-ray telescopes Page 4

5 Every system in the field has MLT GI Collectors CONTINUOUS LEARNING AND VALIDATION SINCE 2005 Increased collection efficiency from 12% to 24% Thicker reflective layer coatings enabling 1-year lifetime Increased thermal management from 1 kw to 6 kw collector power loading MLT collector demonstrated 1-year lifetime Normalized Ru reflectivity Alpha collector 100% 80% Leading edge: highest erosion 60% Trailing edge: little erosion 40% Corthout et al SPIE % Zink et al EUVL Symposium % Normalized Ru thickness 0.9 Page 5 1.0

6 Shipped three 100 WIF capable 9-shell GI Collectors to date Design capable of meeting 27 nm node optical and power requirements 2 more 9-shell collectors will ship in 2010 Page 6

7 Today s 9-shell GIC capable of meeting 100 W IF requirements Continuous improvement of optical performance since first prototype unit (process & design) Collector CE * Correction for PSF ** Effective CE #1 (3 shells) 9 % - - #2 (3 shells) 9 % 64 % 6 % #3 24 % 65 % 16 % #4 24 % 81 % 19 % #5 25 % 82 % 20 % * Measured data ** Derived from PSF optical measurements and ray-tracing calculations Improvement Thickness graded Ruthenium reflective layer and latest XTREME Technologies DMT support 1-year lifetime goal Thickness graded Ru coating 6 kw integrated cooling enables 100 W IF d 2 Ru d 1 α2 Plasma α 1 Page 7

8 9-shell GIC integrated and operated in XT DPP source Graph shows collector s thermal response during 4-hour source operation at 15 W IF Field tests are providing first validation of the 27 nm node / 100 W IF design objectives Latest shipped collector now integrated in source docked to scanner ~ 4 hours Courtesy of XTREME Technologies Source at 15 W IF Source OFF Page 8

9 GIC aligned with source power scaling roadmap Performance Year TBD Technology node 32 nm 27 nm 22 nm 16 nm TBD IF peak power 10 W 100 W 250 W 350 W 500 W IF average power 10 W 100 W 170 W 190 W 250 W Collector power loading capability 1 kw 6 kw 10 kw 12 kw 15 kw Collector power loading design aligned with HVM source power requirements Page 9

10 Grazing Incidence Collector product roadmap 5-year field tested experience providing exclusive learning and validation for HVM Current Pre-HVM collector capable of meeting 27 nm node / 100 W IF requirements MLT aligned with HVM source power scaling roadmap with extendible cooling design ALPHA Pre-HVM HVM nm 27 nm 22 nm 16 nm ALPHA Sn-DPP CE 12% 1 kw Cooling G1 ALPHA Xe-DPP CE 12% 3 kw Cooling G1 ALPHA Sn-DPP CE 12% 1 kw Cooling G2 SFET Xe-DPP CE 12% - - Pre-HVM Sn-DPP CE 24% 6 kw Cooling G3 HVM - CE 24% 10 kw Cooling G4 HVM - CE 24% 12 kw Cooling G4 HVM - CE 24% 15 kw Cooling G4 Page 10

11 Summary The current EUV Lithography challenge is greater for the source and collector, and Media Lario Technologies mission is to: Maintain the collector out of the critical path Partake to HVM economic viability (CoO) Power alignment and Lifetime MLT, with > 5-year Grazing Incidence Collector field-installed experience and product validation, Has designed, manufactured and shipped multiple 9-shell collectors capable of meeting 100 W IF 9-shell collector tested with XTREME Technologies DPP source and integrated in the scanner MLT GIC thermal management roadmap on track and aligned to meet the 500 W peak power and 250 W average power at IF Page 11

12 Acknowledgements MLT thanks and acknowledges XTREME Technologies, ASML, and the end-users for the continued support and informative and constructive exchange, and the development and manufacturing team at MLT Page 12