Strengthening the leadership

Transcription

1 Strengthening the leadership Press conference, SEMICON West 2005 Martin van den Brink, Executive Vice President ASML / Slide 1

2 Safe Harbor Safe Harbor Statement under the U.S. Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements that are subject to risks and uncertainties including, but not limited to: economic conditions, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), competitive products and pricing, manufacturing efficiencies, new product development, ability to enforce patents, the outcome of intellectual property litigation, availability of raw materials and critical manufacturing equipment, trade environment, and other risks indicated in the risk factors included in ASML s Annual Report on Form 20-F and other filings with the U.S. Securities and Exchange Commission. / Slide 2

3 Contents ASML: Technology and Market leadership ASML immersion: Leading the world in the transition from dry to wet Another first: The highest NA at full field in the industry / Slide 3

4 ASML s position in the industry Market share leadership Best in execution: Profitability for ASML and its customers Technology leadership Value of Ownership Leadership / Slide 4

5 Market share through technology 12 & ArF 60% 50% Reliable introduction Robust production KrF & Step & Scan ASML Market Share ($) 40% 30% 20% Cost effective 6 & early i-line 8 & I-line 10% 0% Source: ASML / Slide 5

6 Market share evaluation ASML #1 for 3 rd year in a row 60% ASML Market Share ($) 50% 40% 30% 20% 10% results: 20 >50% revenue and >40% unit shipments #1 in 200mm, 300mm, KrF and ArF #1 in all regions except Japan 0% Source: ASML / Slide 6

7 Contents ASML: Technology and market leader ASML immersion: Leading the world in the transition from dry to wet Another first: The highest NA at full field in the industry / Slide 7

8 Leading the world in the transition from dry to wet 1 st image on AT:1150i 16 customers test AT:1150i 1 st generation 2 nd generation AT:1150i shipped to Albany 1 st XT:1250i 1 st immersion Chips 3 rd generation 1 st XT:1400i Q Q Q Q Q / Slide 8 Q Q Q Q Q1 2006

9 Three unique advantages of ASML immersion Dual Stage TWINSCAN platform: Measure dry/expose wet in parallel at 122 wph Immersion shower head: Water containment under all process conditions Field immersion experience: Since September 2004 over 3 equipment generations / Slide 9

10 Dual Stage TWINSCAN platform Immersion shower head Dry alignment Dry wafer mapping (focus & levelling) Immersion exposure / Slide 10

11 Dual Stage TWINSCAN platform Measure dry/expose wet in parallel at 122 wph Expose Position Lens Metrology Position Focus Align Unload Load Metrology Position Expose Position Dry focus: additional wet single stage overhead Unload Load Dry Metrology O Time Line for Expose 1 Wafer Cycle O 1 Wafer Cycle with dual immersion stage Swap Wet/dry change Load Dry Metrology O Expose O Unload Time Line for 1 Wafer Cycle single immersion stage / Slide 11

12 Three unique advantages of ASML immersion Dual Stage TWINSCAN platform: Measure dry/expose wet in parallel at 122 wph Immersion shower head: Water containment under all process conditions Field immersion experience: Since September 2004 over 3 equipment generations / Slide 12

13 Immersion shower head design principles Productivity Maximize scan speed Containment Minimize evaporation Of Water Prevent Drying stains Overlay Defects / Slide 13

14 Immersion shower head design Lens Lens lens For hydrophilic* materials water is only partly confined Meniscus becomes unstable limiting scan speed Droplets are left on the wafer *Water likes to stick to it / Slide 14

15 Immersion shower head design Lens Lens lens For hydrophobic* materials the free meniscus is stable even at high scan speed, however Droplets are left on the wafer *water easily rolls off / Slide 15

16 Immersion shower head design S S Lens Lens lens Lowering the immersion hood enabled by using a servo controlled gap control stabilizes the meniscus for all materials Supports accurate wafer positioning during scanning But droplets are still left behind / Slide 16

17 Immersion shower head design S S Lens Lens lens To contain water at full scan speed and also confine droplets an air curtain is introduced: no water droplets left on the wafer Immersion shower head works with all materials / Slide 17

18 Immersion shower head: Maximum process choice for customers Supports hydrophilic and phobic material standard ArF resists and developer solvable top coats Minimizing impact on track process flow dry process track modules BARC Coat Develop TARC TC remove total immersion resist w/o topcoat dry resist with developer soluble topcoat dry resist with hydrophobic topcoat / Slide 18

19 Three unique advantages of ASML immersion Dual Stage TWINSCAN platform: Measure dry/expose wet in parallel at 122 wph Immersion shower head: Water containment under all process conditions Field immersion experience: Since September 2004 over 3 equipment generations / Slide 19

20 7 ASML immersion tools installed worldwide systems shipped until end Q2-05 a mix of 1150i, 1250i and 1400i / Slide 20

21 3 rd generation tool XT:1400i has been shipped Dry Focus (µm) Wet nm 1:1 L&S through focus, annular NA=0.93 sigma 0.94/0.74 / Slide 21

22 Excellent immersion overlay X Y 8 nm wafer number / Slide 22

23 Dramatic improvements in immersion defect levels defect count wet equals dry by end defects/cm processed wafers bare wafers dry baseline 0.01 Q Q Q Q Q Q Q Q / Slide 23

24 Contents ASML: Technology and market leader ASML immersion: Leading the world in the transition from dry to wet Another first: The highest NA at full field in the industry / Slide 24

25 Leading the world in the transition from dry to wet 1 st image on AT:1150i 16 customers test AT:1150i 1 st generation 2 nd generation AT:1150i shipped to Albany 1 st XT:1250i 1 st immersion chips 3 rd generation 4 th generation 1 st XT:1400i XT:1700i Q Q Q Q Q / Slide 25 Q Q Q Q Q1 2006

26 Introducing TWINSCAN XT:1700i: New features 45nm volume production Illuminator with increased σ range and polarization 122wph dual stage immersion TP Catadioptric lens design with 1.2 NA at 26 x 33mm field 4 th generation immersion tool / Slide 26

27 Hyper NA lens: in-line catadioptric design type 40% less material and 15% more NA compared to refractive designs Rectangular scan field supporting focus drilling and maximum productivity Same image orientation as refractive lenses: reticle compatibility Small incidence angles on coatings compared to folded designs allowing extendibility to higher apertures > 1.3 High mechanical stability like refractive designs / Slide 27

28 Hyper NA lens: Polarization to maximize contrast Contrast Polarized Unpolarized Half pitch [nm] Constructive interference 100% contrast Polarization improves image contrast and exposure latitude enhances resolution with 5 nm / Slide 28

29 55nm Combined Polarization and Immersion boost DOF above 1 micron! Dry: DoF 480nm NA = 0.93, Dipole-35deg σ=0.97/0.81 X-polarization k1=0.265 F = -240 nm F = 0 nm F = 240 nm Wet: DoF 1100nm F = -525 nm F = -225 nm F = 0 nm F = 225 nm F = 525 nm / Slide 29

30 XT:1700i for 45nm Volume Production 0.8 Depth of Focus [µm] NA 1.07 NA 1.0 NA 0.93 NA Resolution half-pitch [nm] Polarized Dipole Illumination 1:1 Dense Lines using 6% att-psm Full resist model 6% att-psm Mask with Polarized Dipole illumination ± 2% dose error, 2nm mask error, ±10% CD variation limit / Slide 30

31 TWINSCAN 300mm throughput advantage Dry Immersion Throughput (WPH) / Slide 31 Updated june 1

32 Summary XT:1700i Highest NA in the industry: 1.2 Volume production at 45 nm with 122 wph Maximum field size of 26mm by 33mm Fourth generation immersion tool / Slide 32

33 / Slide 33