Signal integrity & simulation considerations in VPX backplane designs
|
|
- Myron Norman
- 5 years ago
- Views:
Transcription
1 Signal integrity & simulation considerations in VPX backplane designs Ovidiu Mesesan Embedded Tech Trends, Jan 22-23
2 Connectorization & standardization Advances and challenges in connector technology 2
3 Connector issues Passivity, causality, footprints design & optimization 3
4 Channel simulation & design Connectors as part of the channel model 5 Aggressors scenario Aggressor 2 Aggressor 3 Aggressor 5 Aggressor 4 Victim Pair Aggressor on L /9/ on L /9/ on L /9/ on L /9/ on L /9/ on L /9/3.75 BGA vias Switch card Megtron 6 VPX mated connectors models D7/E7 E7/F7 A7/B7 A7/B7 D9/E9 E9/F9 Slot 6 A9/B9 A9/B9 B8/C8 C8/D8 E8/F8 G8/H8 Alan 4.26 L L L18 Backplane Megtron 6 4.8/6/4.8 L L L These are 3 separate connector models & footprint models G8/H8 E8/F8 Slot 2 Conn 1 C8/D8 B8/C8 G8/H8 E8/F8 Slot 4 Conn 2 C8/D8 B8/C8 G8/H8 E8/F8 Slot 12 Conn 3 C8/D8 B8/C8 Ovidiu 5.17 on L /4.5/4.25 BGA vias 3.86 on L16 4/4/4 5.5 on L18 5/4.75/5 Tachyon 1G Payload card Nelco 4-13SI Payload card FR48HR Payload card Chris Nancy Derek 4
5 S-parameters S-parameters cascading issues (the good, the bad and the ugly) Scattering transfer parameters Everybody s doing it! (Αριστοτέλης, "Tὰ μετὰ τὰ φυσικά, cca 33 BCE) The totality is not, as it were, a mere heap, but the whole is something besides the parts. (Aristotle, "Metaphysics, Book VIII, 145a.9) (Heidi Barnes, cca 28 CE) 5
6 Channel simulation Simulations assumptions A simulation can only be as good as the models and assumptions that are being used in the process! Image courtesy of Polar Instruments (Spur Electron Limited, Havant, Hampshire, UK) Image courtesy of Taconic Advanced Dielectric Division 6
7 Channel design SI flow 7
8 Backplane channel measurements Measurements and why good launches are necessary Differential Insertion Loss of worst case Data Plane channel Sdd21 (IL) de-embedded ILmax(f) (IEEE) Sdd21 (IL) not de-embedded -4-6 db GHz Return Loss of worst case Data Plane channel GHz Insertion Loss Deviation for worst case de-embedded Data Plane channel GHz ILD(f) Sdd11 (RL) de-embedded RLmax(f) (IEEE) Sdd11 (RL) not de-embedded ILDmax(f) (IEEE) ILDmin(f) (IEEE) db -45 db 8
9 Channel co-design (& co-simulation!) (or Why Nancy, Alan, Derek, Chris & Ovidiu shouldn t have a Mexican standoff ) Insertion Loss:Elma 1G BASE KR Long BP Derek s existing design Insertion Loss: Elma 1G BASE KR Long BP Recommended A Derek s improved design -1 5 Insertion Loss Deviation:Elma 1G BASE KR Long BP -1 5 Insertion Loss Deviation: Elma 1G BASE KR Long BP Recommended A 5.GHz GHz Range: 4.47 db Range: 1.83 db -6 Simulated Link-Sdd56 Simulated Link LS IL Mask High IL Mask Low Return Loss:Elma 1G BASE KR Long BP Simulated Link-Sdd55 Return Loss Mask IL Deviation Simulated-Sdd56 IL Deviation High IL Deviation Low Insertion Loss and Crosstalk:Elma 1G BASE KR Long BP Next1x1, Next2x1, Next3x1, Fext1x1, Fext3x1 5.GHz -6 Simulated Link-Sdd56 Simulated Link LS IL Mask High IL Mask Low Return Loss: Elma 1G BASE KR Long BP Recommended A Simulated Link-Sdd55 Return Loss Mask -3-4 IL Deviation Simulated-Sdd56 IL Deviation High IL Deviation Low Insertion Loss and Crosstalk: Elma 1G BASE KR Long BP Recommended A Next1x1, Next2x1, Next3x1, Fext1x1, Fext3x1 5.GHz GHz GHz Sdd56 TotalXTK:RMS Sdd56 TotalXTK:RMS
10 Channel co-design Improvements vias on daughtercards and backplane Differential Insertion and Return Loss: New Backplane RT-2 Via Model sdd12 sdd
11 Channel co-design Improvements for a common goal 11
12 Questions? Thank you for your time! Ovidiu Mesesan Embedded Tech Trends 218 Austin, Texas
MDI for 4x25G Copper and Fiber Optic IO. Quadra (CFP4 proposal) Connector System
MDI for 4x25G Copper and Fiber Optic IO Quadra (CFP4 proposal) Connector System Nov 7, 2011 Nathan Tracy, TE Connectivity Tom Palkert, Molex 4x25Gb/s MDI Potential Requirements Critical Needs: Excellent
More informationChannels for Consideration by the Signaling Ad Hoc
Channels for Consideration by the Signaling Ad Hoc John D Ambrosia Tyco Electronics Adam Healey, Agere Systems IEEE P802.3ap Signaling Ad Hoc September 17, 2004 Two-Connector Topology N2 H B September,
More informationSignal Integrity Analysis for 56G-PAM4 Channel of 400G Switch
Signal Integrity Analysis for 56G-PAM4 Channel of 400G Switch Sophia Feng/Vincent Wen of Celestica sopfeng@celestica.com Asian IBIS Summit Shanghai, PRC November 13, 2017 Agenda Background 200GBASE-KR4
More informationVerification of ICN Usability in Characterizing System Crosstalk
Asian IBIS Summit Shanghai, P.R. China November 9, 212 Verification of ICN Usability in Characterizing System Crosstalk Dongxiaoqing, Huangchunxing www.huawei.com HUAWEI TECHNOLOGIES CO., LTD. ICN Definition
More informationInterconnect for 100G serial I/O ports
Interconnect for 100G serial I/O ports Tom Palkert, Greg Walz 1 2016 Molex All Rights Reserved. Unauthorized Reproduction/Distribution is Prohibited. Revised: May, 2017 Today @ 25Gbps lanes I/O Channel
More informationEXAMAX HIGH SPEED BACKPLANE CONNECTOR SYSTEM Innovative pinless connector system delivering superior electrical performance at speeds 25 to 56Gb/s
EXAMAX HIGH SPEED BACKPLANE Innovative pinless connector system delivering superior electrical performance at speeds 5 to 5Gb/s SUPPORTS MANY INDUSTRY STANDARD SPECIFICATIONS; MIGRATION PATH TO HIGHER
More informationGT Micro D High Speed Characterization Report For Differential Data Applications. Micro-D High Speed Characterization Report
GT-14-19 Micro D For Differential Data Applications GMR7580-9S1BXX PCB Mount MWDM2L-9P-XXX-XX Cable Mount Revision History Rev Date Approved Description A 4/10/2014 C. Parsons/D. Armani Initial Release
More informationAirMax VSe High Speed Backplane Connector System
AirMax VSe High Speed Backplane Connector System July 2012 FCI Customer Presentation For External Use Where will AirMax VSe connectors be used & Why? More bandwidth density is being demanded from equipment
More informationModeling of Connector to PCB Interfaces. CST User Group Meeting, September 14, 2007 Thomas Gneiting, AdMOS GmbH
Modeling of Connector to PCB Interfaces CST User Group Meeting, September 14, 2007 Thomas Gneiting, AdMOS GmbH thomas.gneiting@admos.de Table of Content Introduction Parametric CST model of connector to
More informationFeasibility of 30 db Channel at 50 Gb/s
Feasibility of 30 db Channel at 50 Gb/s Ali Ghiasi Ghiasi Quantum LLC 50 GbE & NGOATH Plenary Mee>ng March 16, 2016 List of supporters q Upen Reddy Kare> Cisco q Vipul BhaN Inphi q James Fife - etoups
More informationVPX30 Backplanes. OpenVPX Backplanes 3U VPX30 KEY FEATURES
VPX30 Backplanes VPX30 KEY FEATURES Compliant to latest VITA 65 specifications Various OpenVPX profiles contact Pixus for details 2, 3, 5, 6, 8, 9, 12, and 18 slots standard (contact Pixus for other sizes
More information100GbE Architecture - Getting There... Joel Goergen Chief Scientist
100GbE Architecture - Getting There... Joel Goergen Chief Scientist April 26, 2005 100GbE Architecture - Getting There Joel Goergen Force10 Networks joel@force10networks.com Subject : 100GbE Architecture
More information40 GbE Over 4-lane 802.3ap Compliant Backplane
40 GbE Over 4-lane 802.3ap Compliant Backplane, Intel Contributors: Ted Ballou, Intel Ilango Ganga, Intel Robert Hays, Intel IEEE 802.3 HSSG November 2007 Agenda 40 GbE proposition 40 GbE system configuration
More informationSAS-2 Internal Channel Modeling (05-276r0) Barry Olawsky Hewlett Packard r0 SAS-2 Channel Modeling 1
SAS-2 Internal Channel Modeling (05-276r0) Barry Olawsky Hewlett Packard 05-276r0 SAS-2 Channel Modeling 1 Project Goals Provide industry with data to better understand customer (hp and other OEMs) applications.
More informationCEI-28G-VSR Channel Simulations, Validation, & Next Steps. Nathan Tracy and Mike Fogg May 18, 2010
CEI-28G-VSR Channel Simulations, Validation, & Next Steps Nathan Tracy and Mike Fogg May 18, 21 Summary of Contribution Updated information showing Tyco Electronics 25/28Gbps first generation modular interconnect
More informationA novel method to reduce differential crosstalk in a highspeed
DesignCon 5 A novel method to reduce differential crosstalk in a highspeed channel Kunia Aihara, Hirose Electric kaihara@hirose.com Jeremy Buan, Hirose Electric jbuan@hirose.com Adam Nagao, Hirose Electric
More informationSAS-2 Zero-Length Test Load Characterization (07-013r7) Barry Olawsky Hewlett Packard (8/2/2007)
SAS-2 Zero-Length Test Load Characterization (07-013r7) Barry Olawsky Hewlett Packard (8/2/2007) 07-013r7 SAS-2 Zero-Length Test Load Characterization 1 Zero-Length Test Load Provides ideal connection
More informationA Design of Experiments for Gigabit Serial Backplane Channels
DesignCon 2008 A Design of Experiments for Gigabit Serial Backplane Channels Mr. Jack Carrel, Xilinx jack.carrel@xilinx.com (972) 246-0239 Mr. Bill Dempsey, Redwire Enterprises billd@redwireenterprises.com
More informationI N T E R C O N N E C T A P P L I C A T I O N N O T E. STRADA Whisper 4.5mm Connector Enhanced Backplane and Daughtercard Footprint Routing Guide
I N T E R C O N N E C T A P P L I C A T I O N N O T E STRADA Whisper 4.5mm Connector Enhanced Backplane and Daughtercard Footprint Routing Guide Report # 32GC001 01/26/2015 Rev 3.0 STRADA Whisper Connector
More informationVPX60 Backplanes. OpenVPX Backplanes 6U VPX60 KEY FEATURES
VPX60 Backplanes VPX60 KEY FEATURES Compliant to latest VITA 65 specifications Various OpenVPX profiles contact Pixus for details 6U backplane design 2, 5, 6, 8, 9, 10, 17 and other slot sizes standard
More informationVPX307 Backplanes. OpenVPX Backplanes 3U VITA 67 VPX307 KEY FEATURES
VPX307 Backplanes VPX307 KEY FEATURES Compliant to latest VITA 65 and VITA 67.x specifications Various OpenVPX profiles contact Pixus for details Various slot sizes and configurations available 3U backplane
More informationEDA365. DesignCon Impact of Backplane Connector Pin Field on Trace Impedance and Vertical Field Crosstalk
DesignCon 2007 Impact of Backplane Connector Pin Field on Trace Impedance and Vertical Field Crosstalk Ravi Kollipara, Rambus, Inc. ravik@rambus.com, (650) 947-5298 Ben Chia, Rambus, Inc. Dan Oh, Rambus,
More informationcpci Series (2mm) Connectors
cpci Series (2mm) s Interchangeable with cpci COTS Systems Hi-Rel and Space Grade Versions Standard 2mm Footprint of cpci PICMG 2.0 Immune to Shock and Vibration LCP Insulator meets NASA Outgassing Requirements
More informationHigh Speed and High Power Connector Design
High Speed and High Power Connector Design Taiwan User Conference 2014 Introduction High speed connector: Electrically small Using differential signaling Data rate >100Mbps High power connector: Static
More informationThank you for downloading this product training module produced by 3M Electronic Solutions Division for Mouser. In this presentation, we will discuss
1 Thank you for downloading this product training module produced by 3M Electronic Solutions Division for Mouser. In this presentation, we will discuss a new 2mm hard metric connector that has been designed
More informationGEN-3 OpenVPX BACKPLANES
BENEFITS High performance 10 Gen-3 backplanes compatible with 40 Gb Ethernet (40 GBase-KR4), InfiniBand QDR (10 ), Infiniband FDR- 10 (10.3 ), and PCI Express (PCIe) Gen-3 (8 ) on OpenVPX data plane and
More informationGen-3 OpenVPX Backplanes
Data Sheet Gen-3 OpenVPX Backplanes This product family is part of the industry-leading Atrenne Computing Solutions product line of high performance chassis and backplanes. Features VITA 65 OpenVPX-compliant
More informationCOM Analysis on Backplane and Cu DAC Channels
COM Analysis on Backplane and Cu DAC Channels Ali Ghiasi Ghiasi Quantum LLC IEEE 802.3cd Task Force Mee@ng Whistler May 25, 2016 Overview q Follow on the Macau presenta@on q Inves@ga@ng COM analysis on
More informationRevolutionary High Performance Interconnect Which Maximizes Signal Density
Revolutionary High Performance Interconnect Which Maximizes Signal Density Tom Cohen and Gautam Patel Teradyne Connection Systems 44 Simon St. Nashua, New Hampshire 03060 Phone: 603-791-3383, 603-791-3164
More informationStatus Update - SDD21 & SDD11/22 Model Development
Status Update - SDD21 & SDD11/22 Model Development John DAmbrosia, Tyco Electronics Matt Hendrick, Intel January 2005 1 Acknowedgements Rich Mellitz, Intel Steve Krooswyk, Intel Mike Altmann, Intel Yves
More informationT10 Technical Committee From: Barry Olawsky, HP Date: 13 January 2005 Subject: T10/05-025r1 SFF8470 Crosstalk Study
To: T10 Technical Committee From: Barry Olawsky, HP (barry.olawsky@hp.com) Date: Subject: T10/ Revision History Revision 0 (5 January 2005) First revision Revision 1 () Second revision Further clarify
More informationPCI Express Gen 4 & Gen 5 Card Edge Connectors
PCI Express Gen 4 & Gen 5 Card Edge Connectors Product Presentation Amphenol Information Communications ava and Commercial Products Agenda 1. Value Proposition 2. Product Overview 3. Signal Integrity Performance
More informationDesign Test Deploy
Design Test Deploy 9-22-10 www.meritec.com 0142835 Table of Contents Overview2 Housing4-7 Hardware8-10 Wafers11-13 Wafer-Wafer Cables14-18 Wafer-I/O19-21 The 3 Dimensions of 22-25 Off-the-Shelf Product
More informationDesign Test Deploy
Design Test Deploy 9-22-10 www.meritec.com 0142835 Table of Contents Overview2 Housing4-7 Hardware8-10 Wafers11-13 Wafer-Wafer Cables14-18 Wafer-I/O19-21 The 3 Dimensions of 22-25 Off-the-Shelf Product
More informationEXAMINING THE IMPACT OF SPLIT PLANES ON SIGNAL AND POWER INTEGRITY
EXAMINING THE IMPACT OF SPLIT PLANES ON SIGNAL AND POWER INTEGRITY Jason R. Miller, Gustavo J. Blando, Roger Dame, K. Barry A. Williams and Istvan Novak Sun Microsystems, Burlington, MA 1 AGENDA Introduction
More information802.3cb PMD and Channel. Anthony Calbone 3/14/2016
802.3cb PMD and Channel Anthony Calbone 3/14/2016 Overview The presentation introduces a single link segment for each 2.5 Gb/s and 5 Gb/s for 802.3cb This link segment is described for two different reference
More informationI N T E R C O N N E C T A P P L I C A T I O N N O T E. STEP-Z Connector Routing. Report # 26GC001-1 February 20, 2006 v1.0
I N T E R C O N N E C T A P P L I C A T I O N N O T E STEP-Z Connector Routing Report # 26GC001-1 February 20, 2006 v1.0 STEP-Z CONNECTOR FAMILY Copyright 2006 Tyco Electronics Corporation, Harrisburg,
More informationBoard Design Guidelines for PCI Express Architecture
Board Design Guidelines for PCI Express Architecture Cliff Lee Staff Engineer Intel Corporation Member, PCI Express Electrical and Card WGs The facts, techniques and applications presented by the following
More informationName No. Geometry 7-3 1) Two similar polygons are shown. Find the values of x, y, and z
Name No. Geometry 7-1 1) The sides of a triangle with perimeter 55 are in the ratio of 2:4:5. Find the length of the shortest side. 1) Two similar polygons are shown. Find the values of x, y, and z Name
More informationDifferential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75
Differential Return Loss for Annex 120d Addressing to Comments i-34, i-74, i-75 Richard Mellitz, Samtec Adee Ran, Intel March 2017 IEEE802.3 Plenary, Vancouver, BC, Canada 1 IEEE P802.3bs 200 Gb/s and
More informationSegments Proofs Reference
Segments Proofs Reference Properties of Equality Addition Property Subtraction Property Multiplication Property Division Property Distributive Property Reflexive Property The properties above may only
More informationUnderstanding 3M Ultra Hard Metric (UHM) Connectors
3M Electronic Solutions Division 3MUHMWEBID_100809 Understanding 3M Ultra Hard Metric (UHM) Connectors Enabling performance of next generation 2 mm Hard Metric systems 3M Electronic Solutions Division
More informationHigh Speed Characterization Report. DVI-29-x-x-x-xx Mated With DVI Cable
High Speed Characterization Report DVI-29-x-x-x-xx Mated With DVI Cable REVISION DATE: 07-18-2004 TABLE OF CONTENTS Introduction... 1 Product Description... 1 Overview... 2 Results Summary... 3 Time Domain
More informationNGAuto Channel Modeling and Analysis
NGAuto Channel Modeling and Analysis Eric DiBiaso (TE Connectivity), Bert Bergner (TE Connectivity), Chris Mandel (TE Connectivity) Supporters: IEEE 802.3ch Multi-Gig Automotive Ethernet PHY Task Force
More informationDesign Guidelines for 100 Gbps - CFP2 Interface
2014.01.16 AN-684 Subscribe This document shows an example layout design that implements a 4 x 25/28 Gbps CFP2 module interface that meets the insertion and return loss mask requirements proposed in the
More informationSolder tail tin lead (60-40) per Mil-P Contact spacing. 125 signal 25 ground (top shield) Contact current rating. 95 signal 19 ground
HYPERTAC 2MM 2mm Connectors Interchangeable with cpci COTS Systems Hypertac contacts provide high reliability Standard 2mm footprint Immune to shock & vibration High-temp LCP insulator meets NASA outgassing
More informationInterference-Aware Real-Time Flow Scheduling for Wireless Sensor Networks
Interference-Aware Real-Time Flow Scheduling for Wireless Sensor Networks Octav Chipara, Chengjie Wu, Chenyang Lu, William Griswold University of California, San Diego Washington University in St. Louis
More informationIntegrating ADS into a High Speed Package Design Process
Integrating ADS into a High Speed Package Design Process Page 1 Group/Presentation Title Agilent Restricted Month ##, 200X Agenda High Speed SERDES Package Design Requirements Performance Factor and Design
More informationLink Segment Considerations Industrial Applications IEEE Mb/s Single Twisted Pair Ethernet Study Group. San Antonio, Texas November 2016
Link Segment Considerations Industrial Applications IEEE 802.3 10 Mb/s Single Twisted Pair Ethernet Study Group San Antonio, Texas November 2016 Chris DiMinico MC Communications/Cu-Test/Panduit cdiminico@ieee.org
More informationInfiniBand Trade Association
InfiniBand Trade Association Revision 1.06 4/11/2017 IBTA VNA MOI for FDR and EDR Cable Tests This material is provided for reference only. The InfiniBand Trade Association does not endorse the vendors
More information3M TM VCP TM Package Stripline Two Port Characterization. David A. Hanson Division Scientist 3M Microelectronic Packaging
3M TM VCP TM Package Stripline Two Port Characterization David A. Hanson Division Scientist 3M Microelectronic Packaging 3M 21 2 Background To support the requirements of 2.5GBs and 1GBs data communication
More informationCIS-331 Exam 2 Fall 2015 Total of 105 Points Version 1
Version 1 1. (20 Points) Given the class A network address 117.0.0.0 will be divided into multiple subnets. a. (5 Points) How many bits will be necessary to address 4,000 subnets? b. (5 Points) What is
More informationApplication Note. PCIE-RA Series Final Inch Designs in PCI Express Applications Generation GT/s
PCIE-RA Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2012, Inc. COPYRIGHTS, TRADEMARKS, and PATENTS Final Inch is a trademark of, Inc.
More informationConstruction 10: Book I, Proposition 31
The Visual Constructions of Euclid Book I 63 Construction 10: Book I, Proposition 31 Through a given point to draw a straight line parallel to a given straight line. B C I.31:3. Let be the given point,
More informationREFERENCE DESIGN Quad-SFP Host Adapter
Reference Design: HFRD-32.0 Rev. 2; 11/08 REFERENCE DESIGN Quad-SFP Host Adapter AVAILABLE Quad-SFP Host Adapter Table of Contents 1 Overview...2 2 Obtaining Additional Information...2 3 Typical Use...3
More informationApplication Note. PCIE-EM Series Final Inch Designs in PCI Express Applications Generation GT/s
PCIE-EM Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2015, Inc. COPYRIGHTS, TRADEMARKS, and PATENTS Final Inch is a trademark of, Inc.
More informationVertical Conductive Structures
Vertical Conductive Structures A new Interconnect Technique Agenda The need for an alternative PCB technology Introduction of VeCS Technology comparison Cost comparison State of VeCS technology Application
More informationEdges and Switches, Tunnels and Bridges. David Eppstein Marc van Kreveld Elena Mumford Bettina Speckmann
Edges and Switches, Tunnels and Bridges David Eppstein Marc van Kreveld Elena Mumford Bettina Speckmann Cased drawing Let D be a non-planar drawing of a graph G. A cased drawing D of G is a drawing where
More informationMC92610, Gbaud Reference Design Platform An 8-Slot Full-Mesh or Fabric Backplane Reference Design
Freescale Semiconductor White Paper BR1570 Rev. 1, 03/2005 MC92610, 3.125 Gbaud Reference Design Platform An 8-Slot Full-Mesh or Fabric Backplane Reference Design by: SerDes Applications Team Abstract
More information100BASE-T1 EMC Test Specification for ESD suppression devices
IEEE 100BASE-T1 EMC Test Specification for ESD suppression devices Version 1.0 Author & Company Dr. Bernd Körber, FTZ Zwickau Title 100BASE-T1 EMC Test Specification for ESD suppression devices Version
More informationBuilding Roads. Page 2. I = {;, a, b, c, d, e, ab, ac, ad, ae, bc, bd, be, cd, ce, de, abd, abe, acd, ace, bcd, bce, bde}
Page Building Roads Page 2 2 3 4 I = {;, a, b, c, d, e, ab, ac, ad, ae, bc, bd, be, cd, ce, de, abd, abe, acd, ace, bcd, bce, bde} Building Roads Page 3 2 a d 3 c b e I = {;, a, b, c, d, e, ab, ac, ad,
More information100Gb/s Backplane/PCB Ethernet Two Channel Model and Two PHY Proposal
100Gb/s Backplane/PCB Ethernet Two Channel Model and Two PHY Proposal IEEE P802.3bj 100Gb/s Backplane and Copper Cable Task Force Newport Beach Rich Mellitz, Intel Corporation Kent Lusted, Intel Corporation
More informationEBX and EBX Express Specification
PC/104 Embedded Consortium www.pc104.org EBX and EBX Express Specification (Embedded Board, expandable) Version 3.0 October 23, 2008 EBX Specification Version 3.0 October 23, 2008 IMPORTANT INFORMATION
More informationMaximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing. Elvino da Silveira
Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing Elvino da Silveira Agenda Introductions & Trends Consumer products driving AMOLED Adoption! Lithography Challenges Devices
More information10GBASE-KR for 40G Backplane
1GBASE-KR for 4G Backplane Nov 7 Technology Hiroshi Takatori Hiroshi.Takatori@.us 1 Outline This contribution discusses, - Performance based on 1GBASE-KR Std - Theoretical Limit (Saltz SNR) and Time Domain
More informationSimulation Results for 10 Gb/s Duobinary Signaling
Simulation Results for 10 Gb/s Duobinary Signaling Populating the Signaling Ad Hoc Spreadsheet IEEE 802.ap Task Force Atlanta March 15-17, 2005 802.AP Backplane Ethernet Contributors Vitesse Majid Barazande-Pour
More informationGEN-2 / GEN-1 OpenVPX BACKPLANES
BENEFITS GEN-2 / GEN-1 VPX data/expansion plane support for Gen-2, backplanes compatible with: Serial RapidIO (SRIO) Gen-2 InfiniBand DDR PCI Express (PCIe) Gen-2 VPX data/expansion plane support for Gen-1,
More informationTale of a Differential Pair Measurement
Tale of a Differential Pair Measurement Gustavo J. Blando, (Oracle Corporation) Eben Kunz (Oracle Corporation), Istvan Novak (Oracle Corporation) 1 SPEAKER Gustavo J. Blando Senior Principal Engineer,
More informationTB Paladin Connector Design Guidelines. Revision A
Paladin Connector Design Guidelines Specification Revision Status Revision SCR No. Description Initial Date A S5664 New Release J.Dunham 4/4/17 Table of Contents Specification Revision Status... 1 1 Introduction...
More informationMaximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing. Elvino da Silveira
Maximizing Cost Efficiencies and Productivity for AMOLED Backplane Manufacturing Elvino da Silveira Agenda Introductions & Trends Consumer products driving AMOLED Adoption! Lithography Challenges Devices
More informationOperation Manual for VXC4000 VXC4000 V
Variable Crosstalk Coupler VXC4000 Operation Manual for VXC4000 K VXC4000 V Rev 1.0 August 2015 Introduction... 2 Safety Instruction... 2 1. General... 4 Features... 4 2. Connectors & Switches... 5 2 1
More informationOptical Component Environmental Test System OCETS Plus Series
COMMUNICATIONS TEST & MEASUREMENT SOLUTIONS Optical Component Environmental Test System OCETS Plus Series Key Features High Return Loss option (HiRL) monitors RL up to 70 db Up to 210 device channels (420
More informationSEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation GT/s
SEAM-RA/SEAF-RA Series Final Inch Designs in PCI Express Applications Generation 3-8.0 GT/s Copyrights and Trademarks Copyright 2011 Samtec, Inc. Developed in conjunction with Teraspeed Consulting Group
More informationChecking VPX Compatibility in 7 Simple Steps
Acromag, Incorporated 30765 S Wixom Rd, PO Box 437, Wixom, MI 48393-7037 USA Tel: 248-295-0310 Fax: 248-624-9234 www.acromag.com Checking VPX Compatibility in 7 Simple Steps Will Acromag s VPX4810 work
More informationVPX Cable Assemblies. Cables with shroud. Wafer to wafer
The VPX cabling system is the industry s fi rst direct cabling system for the VPX architecture. Compliant to the latest VITA 46 specifi cations, the cabling system can be used for IO to bulkhead connectors,
More informationAmphenol. Printed Circuit Board Technology NAFI + UHD CONNECTORS STANDARD. RELIABLE. PROVEN.
Amphenol Printed Circuit Board Technology NAFI + UHD CONNECTORS STANDARD. RELIABLE. PROVEN. UHD FEATURES & BENEFITS 0.100 x 0.050 staggered grid - High density optimizes trace routing through the backplane
More informationValidation of Quasi-Analytical and Statistical Simulation Techniques for Multi-Gigabit Interconnect Channels
DesignCon 2010 Validation of Quasi-Analytical and Statistical Simulation Techniques for Multi-Gigabit Interconnect Channels Chad Morgan, Tyco Electronics chad.morgan@tycoelectronics.com, 717-649-4129 Abstract
More informationpickeringtest.com Digital I/O Module With Power Distribution
40-228 Digital I/O Module With Power Distribution Versatile Breadboard With Prototype Area Built-In Digital I/O, -Bits Out, -Bits In TTL Outputs Suitable for Driving External Logic Open Collector Outputs
More informationcpci SERIES Ruggedized cpci (2 mm) Connectors
cpci SERIES Ruggedized cpci (2 mm) Connectors Hyperboloid Technology Smiths Connectors offers an extensive range of superior contact technologies suitable for standard and custom solutions. Hypertac (HYPERboloid
More informationCurrent Practices Model Anatomy
Current Practices Model Anatomy Aniruddha Kundu Intel Corporation 11-16-2004 IEEE 802.3ap Back Plane Ethernet TF November, 2004 1 Contributors: Jeff Lynch, Praveen Patel: IBM John D Ambrosia: Tyco Electronics
More informationCIS-331 Final Exam Spring 2015 Total of 115 Points. Version 1
Version 1 1. (25 Points) Given that a frame is formatted as follows: And given that a datagram is formatted as follows: And given that a TCP segment is formatted as follows: Assuming no options are present
More informationD C. Directional Coupler. Directional Coupler. Product Code System. Product Code System
Product Code System Product Code System D C 1. Input Connector Type 3. 1. Start Frequency 4. I/O Port Type 7. Type Input Connector Type (db) Start Frequency I/O Port Type Type 16 SMA50 17 SMA75 28 BNC50
More informationModeling and Analysis of Crosstalk between Differential Lines in High-speed Interconnects
1293 Modeling and Analysis of Crosstalk between Differential Lines in High-speed Interconnects F. Xiao and Y. Kami University of Electro-Communications, Japan Abstract The crosstalk between a single-ended
More informationMULTIGIG RT 2, RT 2-R, and RT 3 Signal Connectors
MULTIGIG RT 2, RT 2-R, and RT 3 Signal Connectors Application Specification 114-163004 21 MAR 18 Rev A Abstract This specification covers the requirements for application of MULTIGIG RT 2, RT 2-R, and
More informationCIS-331 Exam 2 Spring 2016 Total of 110 Points Version 1
Version 1 1. (20 Points) Given the class A network address 121.0.0.0 will be divided into multiple subnets. a. (5 Points) How many bits will be necessary to address 8,100 subnets? b. (5 Points) What is
More informationSouthwest Microwave, Inc. Tempe, Arizona, USA +1 (480) mm (V) Series DC to 67.
The Performance Leader in Microwave Connectors 1.85 mm (V) Series DC to 67.0 GHz Connectors Supplement to Catalog Southwest Microwave, Inc. Tempe, Arizona, USA +1 (480) 78-0201 infompd@southwestmicrowave.com
More informationInfiniBand Trade Association
InfiniBand Trade Association Revision 1.02 4/11/2017 IBTA 32 Port VNA MOI for FDR and EDR Cable Tests This material is provided for reference only. The InfiniBand Trade Association does not endorse the
More informationIntroducing MULTIGIG RT 2-R. Ruggedized Connectors for VPX Applications
Introducing for VPX Applications High Speed Copper Cables associated VPX SOLUTIONS MEZALOK Mezzanine (Compliant to VITA 61) Utilizes the proven, reliable MIL-55302 Mini-Box contact interface, with four
More information100G Signaling Options over Backplane Classes
100G Signaling Options over Backplane Classes IEEE P802.3bj January 2012 Newport Beach FutureWei Hiroshi Takatori Hiroshi.Takatori@huawei.com Contributors and Supporters Albert Vareljian Sanjay Kasturia,
More informationPCI Express 4-Port Industrial Serial I/O Cards
PCI Express 4-Port Industrial Serial I/O Cards The PCIe-400i and PCIe-400i-SI PCI Express 4-port industrial serial I/O cards are plug & play high-speed serial I/O expansion cards for the PCI Express bus.
More informationDemonstration of Technical & Economic Feasibility. Brian Seemann Xilinx
Demonstration of Technical & Economic Feasibility Results are presented which demonstrate the technical and economic feasibility of backplane signaling at 5+ and 1+ Gigabits/second Brian Seemann Xilinx
More informationConnector Models Are they any good?
DesignCon 2012 Connector Models Are they any good? Jim Nadolny, Samtec jim.nadolny@samtec.com Leon Wu, Samtec leon.wu@samtec.com Abstract Channel simulations are only as accurate as the models used to
More informationPCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation GT/s
PCIEC PCI Express Jumper High Speed Designs in PCI Express Applications Generation 3-8.0 GT/s Mated with PCIE-RA Series PCB Connectors Copyrights and Trademarks Copyright 2015, Inc. COPYRIGHTS, TRADEMARKS,
More informationMECT Series Final Inch Designs in SFP+ Applications. Revision Date: August 20, 2009
MECT Series Final Inch Designs in SFP+ Applications Revision Date: August 20, 2009 Copyrights and Trademarks Copyright 2009 Samtec, Inc. Developed in conjunction with Teraspeed Consulting Group LLC COPYRIGHTS,
More informationSignal Integrity in Embedded Computer Applications
Signal Integrity in Embedded Computer Applications "SI for Embedded" by EyeKnowHow 02.03.2010 1 Agenda 1) Introduction 2) Crosstalk 3) Inter Symbol Interference (ISI) 4) Power Integrity 5) Resources "SI
More informationSTRADA WHISPER. Backplane Connector DATA COMMUNICATIONS /// STRADA WHISPER BACKPLANE CONNECTOR
STRADA WHISPER Backplane Connector INTRODUCING STRADA Whisper Backplane Connector Blinding Speeds The STRADA Whisper backplane family was designed with your end customer s need for high-performing, high-bandwidth
More informationEasyCable CompactPCI Backplane
Description The Elma Bustronic CompactPCI backplane series is designed to be fully compliant with PICMG standards. The EasyCable line features power nuts along the side of the backplane for easy and convenient
More informationATCA Platform Considerations for Backplane Ethernet. Aniruddha Kundu Michael Altmann Intel Corporation May 2004
ATCA Platform Considerations for Backplane Ethernet Aniruddha Kundu Michael Altmann Intel Corporation May 2004 IEEE 802.3ap Back Plane Ethernet TF Interim meeting May 2004 1 Introduction This presentation
More informationAdvances in Measurement Based Transient Simulation
Time Domain Simulation in ADS, Slide - 1 Advances in Measurement Based Transient Simulation Presented by GigaTest Labs Gary Otonari and Orlando Bell March, 2008 1 Time Domain Simulation in ADS, Slide -
More information