Power Management & Multimarket

Transcription

1 Protection Devices TVS (Transient Voltage Suppressor) ESD102-U1-02ELS Uni-directional, 3.3 V, 0.4 pf, 0201, RoHS ESD102-U1-02ELS Data Sheet Revision 1.2, Final Power Management & Multimarket

2 Edition Published by Infineon Technologies AG Munich, Germany 2015 Infineon Technologies AG All Rights Reserved. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

3 Product Overview 1 Product Overview 1.1 Features ESD / transient protection of high speed data lines according to: IEC (ESD): ±20 kv (air / contact) IEC (EFT): ±2.5 kv / 50 A (5/50 ns) IEC (surge): ±3 A (8/20 μs) Uni-directional working voltage: V RWM = 3.3 V Ultra low capacitance: C L = 0.4 pf (typical) Very low clamping voltage: V CL = 8 V (typical) at I PP = 16 A Low reverse current: I R = 1 na (typical) Very low dynamic resistance: R DYN = 0.19 Ω (typical) Pb-free (RoHS compliant) and halogen free package, very small form factor 0.62 x 0.32 x 0.31 mm Application Examples USB 3.0, 10/100/1000 Ethernet, Firewire, DVI, HDMI, S-ATA, DisplayPort Mobile HDMI Link, MDDI, MIPI, SWP / NFC 1.3 Product Description Pin 1 marking (lasered) Pin 1 Pin 1 Pin 2 Pin 2 a) Pin configuration b) Schematic diagram PG-TS(S)LP-2_Single_Diode_PinConf_and_SchematicDiag.vsd Figure 1 Pin Configuration and Schematic Diagram Table 1 Part Information Type Package Configuration Marking code ESD102-U1-02ELS TSSLP line, uni-directional F Final Data Sheet 3 Revision 1.2,

4 Maximum Ratings 2 Maximum Ratings Table 2 Maximum Rating at T A = 25 C, unless otherwise specified Parameter Symbol Values Unit ESD air discharge 1) ESD contact discharge 1) Peak pulse current 2) V ESD ±20 ±20 I PP ±3 A Operating temperature T OP -55 to 125 C Storage temperature T stg -65 to 150 C 1) V ESD according to IEC ) Stress pulse: 8/20μs current waveform according to IEC Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. kv 3 Electrical Characteristics at T A = 25 C, unless otherwise specified Figure 2 Definitions of Electrical Characteristics Final Data Sheet 4 Revision 1.2,

5 Electrical Characteristics at T A = 25 C, unless otherwise specified Table 3 DC Characteristics at T A = 25 C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Reverse working voltage V RWM 3.3 V Pin 1 to Pin 2 Trigger voltage V t1 6.2 Holding voltage V h Pin 1 to Pin 2, I R = 10 ma Reverse current I R 1 50 na V R = 3.3 V, from Pin 1 to Pin 2 Table 4 AC Characteristics at T A = 25 C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Line capacitance C L pf V R = 0 V, f = 1 MHz pf V R = 0 V, f = 1 GHz Series inductance L S 0.2 nh Table 5 ESD and Surge Characteristics at T A = 25 C, unless otherwise specified Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Clamping voltage 1) V CL 8 V I TLP = 16 A, t p = 100 ns, from Pin 1 to Pin 2 11 I TLP = 30A, t p = 100 ns from Pin 1 to Pin 2 Forward clamping voltage 1) V FC 6 I TLP = 16 A, t p = 100 ns, from Pin 2 to Pin 1 9 I TLP = 30 A, t p = 100 ns, from Pin 2 to Pin 1 Dynamic resistance 1) R DYN 0.19 Ω t p = 100 ns from Pin 1 to Pin Ω t p = 100 ns from Pin 2 to Pin 1 1) Please refer to Application Note AN210[1]. TLP parameter: Z 0 = 50 Ω, t p = 100ns, t r = 0.6 ns. Final Data Sheet 5 Revision 1.2,

6 Typical Characteristics at T A =25 C, unless otherwise specified 4 Typical Characteristics at T A =25 C, unless otherwise specified I R [A] V R [V] Figure 3 Reverse leakage current, I R = (V R ) I R [A] T A [ C] Figure 4 Reverse current I R = f(t A ), V R = 3.3 V Final Data Sheet 6 Revision 1.2,

7 Typical Characteristics at T A =25 C, unless otherwise specified I F [A] V F [V] Figure 5 Forward current, I F = (V F ) C L [pf] V R [V] Figure 6 Line capacitance C L = f(v R ), f = 1MHz, from pin 1 to pin 2 Final Data Sheet 7 Revision 1.2,

8 Typical Characteristics at T A =25 C, unless otherwise specified 80 Scope: 6 GHz, 20 GS/s V CL [V] V CL-max-peak = 81 [V] V CL-30ns-peak = 7 [V] t p [ns] Figure 7 Clamping voltage (ESD): V CL = f(t), 8 kv positive pulse from pin 1 to pin Scope: 6 GHz, 20 GS/s V CL [V] V CL-max-peak = -72 [V] V CL-30ns-peak = -3 [V] t p [ns] Figure 8 Clamping voltage (ESD): V CL = f(t), 8 kv negative pulse from pin 1 to pin 2 Final Data Sheet 8 Revision 1.2,

9 Typical Characteristics at T A =25 C, unless otherwise specified 100 Scope: 6 GHz, 20 GS/s 80 V CL [V] V CL-max-peak = 104 [V] V CL-30ns-peak = 9 [V] t p [ns] Figure 9 Clamping voltage (ESD): V CL = f(t), 15 kv positive pulse from pin 1 to pin Scope: 6 GHz, 20 GS/s -20 V CL [V] V CL-max-peak = -98 [V] V CL-30ns-peak = -7 [V] t p [ns] Figure 10 Clamping voltage (ESD): V CL = f(t), 15 kv negative pulse from pin 1 to pin 2 Final Data Sheet 9 Revision 1.2,

10 Typical Characteristics at T A =25 C, unless otherwise specified ESD102-U1-02ELS R DYN R DYN = 0.19 Ω 10 I TLP [A] Equivalent V IEC [kv] R DYN = 0.23 Ω V TLP [V] Figure 11 Clamping voltage (TLP): I TLP = f(v TLP ) [1], pin 1 to pin 2 Final Data Sheet 10 Revision 1.2,

11 Typical Characteristics at T A =25 C, unless otherwise specified Insertion Loss ( S 21 ) [db] ESD102-B1-02ELS Frequency [GHz] Figure 12 Insertion loss vs. frequency in a 50 Ω system Final Data Sheet 11 Revision 1.2,

12 Application Information 5 Application Information Application_ESD102-U1-02ELS.vsd Figure 13 Single line, uni-directional ESD / Transient protection[2] Final Data Sheet 12 Revision 1.2,

13 Package Information 6 Package Information 6.1 TSSLP-2-3 Top view Bottom view 0.32±0.05 Figure 14 Pin 1 marking 0.05 MAX. 1) Dimension applies to plated terminals TSSLP-2-3 Package outline (dimension in mm) ) 0.26± ) 0.2 ± ±0.05 TSSLP-2-3, -4-PO V Copper Solder mask Stencil apertures Figure 15 TSSLP-2-3 Footprint (dimension in mm) TSSLP-2-1,-2-FP V02 4 Ey Tape type Punched Tape Embossed Tape Ex Ey Pin 1 marking Figure 16 Ex TSSLP-2-3 Packing (dimension in mm) Deliveries can be both tape types (no selection possible). Specification allows identical processing (pick & place) by users. TSSLP-2-3, -4-TP V03 Type code 1 Pin 1 marking TSSLP-2-3, -4-MK V01 Figure 17 TSSLP-2-3 Marking example Table 1 Part Information on Page 3 Final Data Sheet 13 Revision 1.2,

14 References References [1] On-chip ESD protection for integrated circuits, Albert Z. H. Wang, ISBN: [2] Infineon AG - Application Note AN210: Effective ESD Protection Design at System Level Using VF-TLP Characterization Methodology [3] Infineon AG - Recommendations for PCB Assembly of Infineon TSLP and TSSLP Package Final Data Sheet 14 Revision 1.2,

15 Revision History: Revision 1.1, Page or Item Subjects (major changes since previous revision) Revision 1.2, All Layout change Trademarks of Infineon Technologies AG AURIX, BlueMoon, COMNEON, C166, CROSSAVE, CanPAK, CIPOS, CoolMOS, CoolSET, CORECONTROL, DAVE, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPACK, EconoPIM, EiceDRIVER, EUPEC, FCOS, HITFET, HybridPACK, ISOFACE, I²RF, IsoPACK, MIPAQ, ModSTACK, my-d, NovalithIC, OmniTune, OptiMOS, ORIGA, PROFET, PRO-SIL, PRIMARION, PrimePACK, RASIC, ReverSave, SatRIC, SIEGET, SINDRION, SMARTi, SmartLEWIS, TEMPFET, thinq!, TriCore, TRENCHSTOP, X-GOLD, XMM, X-PMU, XPOSYS. Other Trademarks Advance Design System (ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, PRIMECELL, REALVIEW, THUMB of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS, FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC (Visa Holdings Inc.). EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC, NUCLEUS of Mentor Graphics Corporation. Mifare of NXP. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. murata of MURATA MANUFACTURING CO., MICROWAVE OFFICE (MWO) of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Sattelite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG, PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS, WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update Final Data Sheet 15 Revision 1.2,

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