100GEL C2M Channel model Study TP0-TP1a
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1 1/34 100GEL C2M Channel model Study TP0-TP1a Toshiyasu Ito November 2018, Bangkok, Thailand IEEE Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interface Task Force
2 2/34 Contents Purpose - Simulation Conditions - Simulation Result - Comparison between φ0.2mm and φ0.3mm of TH Conclusion Appendix - Comparison Insertion Loss - PCB and Connector model touch stone files
3 3/34 Purpose 1) This is a study of 100G/Lane Chip to Module for Yamaichi connectors. 2) The connectors are CFP2, CFP8, DSFP, OSFP, QSFP and QSFP-DD. 3) This study was inspected including mating looseness and influence of TH. 4) Offers of touch stone files are all connector model. Each connector touch stone files are calculated from mass production Yamaichi connector s 3D model. - Connector types CFP2, CFP8, DSFP, OSFP, QSFP and QSFP-DD - Prepared Simulation Channel Connector only - with Normal mating position - with Worst mating position 16 inch VSR channel (with φ0.3mm via.) - with Normal mating position - with Worst mating position 16 inch VSR channel (with φ0.2mm via.) - with Normal mating position - with Worst mating position
![- Mating stroke works as a Stub. Normal Mating Stroke [mm] Worst Mating Stroke CFP2 0.65 0.9 CFP8 0.65 0.9 DSFP 0.75 1.06 OSFP 0.64 0.](/docs-images/95/126257060/images/4-2.jpg "98 QSFP 0.80 1.10 QSFP- DD Legacy PAD=0.80 Additional PAD=0.85 Legacy PAD=1.10 Additional PAD=1.")
4 4/34 - Simulation Conditions of connector :Mating Stroke - The mating stroke was calculated when the Locking structure of module and cage were hit. - Worst Mating stroke was calculated by R.S.S.(Root Sum) - Mating strokes of each connectors are shown below. - Mating stroke works as a Stub. Normal Mating Stroke [mm] Worst Mating Stroke CFP CFP DSFP OSFP QSFP QSFP- DD Legacy PAD=0.80 Additional PAD=0.85 Legacy PAD=1.10 Additional PAD=1.20 Lock Tab of Cage Lock Wall of Module Hit here Signal Direction
5 5/34 - Simulation Conditions of connector : Host and Module Board Host board: 1.5mm Line from the soldering PAD of connector. tan δ of Board is zero and Line loss is zero. Module board: They are shown the figures below. tan δ of Board is zero and Line loss is zero. Via of board: There are no Via of each boards for simulation model of connectors. Plug connector Module board Host Board Module Board Soldering PAD CFP2,CFP8 DSFP,OSFP,QSFP QSFP-DD Mating PAD Additional PAD Legacy PAD Line Trace=1.5mm Line Trace=1.5mm Via + Line Trace=1mm Line Trace=1.5mm
6 6/34 - Simulation Conditions of Channel Model Simulation Channel Model Loss Budget TP0 to TP1a Megtoron6 PCB Loss Module Board(No Cap) Host Board(Include 2TH) Yamaichi Connector Simulation Model Channel Model loss budget is considered at IEEE Channel Model is all Simulation data. Each connector touch stone files are calculated from mass production Yamaichi connector s 3D model.
![[mm] Host Board Layer stack-up and routing Connector is](/docs-images/95/126257060/images/7-3.jpg "Surface mount TH Dimension φ0.3 Section B-B TH Stub :0.")
7 7/34 - Simulation Conditions of Channel Model : Host Board [mm] Host Board Module Board Megtoron6 SL Section Size Eps:3.4 tanδ0.004 Host Board model including 2*TH. [mm] Host Board Layer stack-up and routing Connector is Surface mount TH Dimension φ0.3 Section B-B TH Stub :0.178 mm 10 layer 28 layers Back drill
8 8/34 - Simulation Result: CFP2 (Top Channel / Connector only) Normal Mating Worst Mating * This S-parameter is shown connector only. * Channel mapping for 10ch is refer to following. * Crosstalk is 2 NEXT and 9 FEXT for Top ch. And 7 NEXT for Bottom ch. * Bottom channel, 4ch and 8ch simulation files also available. See detail to page 28. RX Side TX Side
9 9/34 - Simulation Result: CFP2 (Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown the Channel model.
10 10/34 - Simulation Result: CFP8 (Top Channel / Connector only) Normal Mating Worst Mating * This S-parameter is shown connector only. * Channel mapping is refer to following. * Crosstalk is 2 NEXT and 7 FEXT. * Bottom channel simulation files also available. See detail to page 29. RX Side TX Side
11 11/34 - Simulation Result: CFP8 (Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown the Channel model.
12 12/34 - Simulation Result: DSFP (Top Channel / Connector only) Normal Mating Worst Mating * This S-parameter is shown connector only. * Channel mapping is refer to following. * Crosstalk is 1 NEXT and 2 FEXT * Bottom channel simulation files also available. See detail to page 30. RX Side TX Side
13 13/34 - Simulation Result: DSFP (Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown the Channel model.
14 14/34 - Simulation Result: OSFP (Top Channel / Connector only) Normal Mating Worst Mating * This S-parameter is shown connector only. * Channel mapping is refer to following. * Crosstalk is 4 NEXT and 7 FEXT * Bottom channel simulation files also available. See detail to page 31. RX Side TX Side
15 15/34 - Simulation Result: OSFP (Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown the Channel model.
16 16/34 - Simulation Result: QSFP (Top Channel / Connector only) Normal Mating Worst Mating * This S-parameter is shown connector only. * Channel mapping is refer to following. * Crosstalk is 4 NEXT and 3 FEXT * Bottom channel simulation files also available. See detail to page 32. RX Side TX Side
17 17/34 - Simulation Result: QSFP (Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown the Channel model.
18 - Simulation Result: QSFP-DD (Legacy Top Channel / Connector only) 18/34 Normal Mating Worst Mating * This S-parameter is shown Legacy Top channel and connector only. * Channel mapping is refer to following. * Crosstalk is 8 NEXT and 7 FEXT * Bottom channel simulation files also available. See detail to page 33~34. RX Side TX Side
19 19/34 - Simulation Result: QSFP-DD (Additional Top Channel / Connector only) Normal Mating Worst Mating * This S-parameter is shown Additional Top channel and connector only. * Channel mapping is refer to following. * Crosstalk is 8 NEXT and 7 FEXT * Bottom channel simulation files also available. See detail to page 33~34. RX Side TX Side
20 20/34 - Simulation Result: QSFP-DD (Legacy Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown Legacy Top channel of channel model. RX Side TX Side
21 21/34 - Simulation Result: QSFP-DD (Additional Top Channel / Channel model) Normal Mating Worst Mating * This S-parameter is shown Additional Top channel of channel model. RX Side TX Side
![22/34 - Comparison between φ0.2mm and φ0.3mm of TH All unit [mm] Model changed TH impedance was inspected. PCB Condition TH Dimension φ0.](/docs-images/95/126257060/images/22-1.jpg "2 [ohm] Channel Model TDR Host Board CN Module Board Via Φ0.3 Via Φ0.2 [ohm] TH part Via Φ0.3 Via Φ0.2 Section A-A *Impedance was changed from S parameter in ADS.")
22 22/34 - Comparison between φ0.2mm and φ0.3mm of TH All unit [mm] Model changed TH impedance was inspected. PCB Condition TH Dimension φ0.2 [ohm] Channel Model TDR Host Board CN Module Board Via Φ0.3 Via Φ0.2 [ohm] TH part Via Φ0.3 Via Φ0.2 Section A-A *Impedance was changed from S parameter in ADS.
23 23/34 - Comparison of ILD:Connector, Mating Stroke and TH DIA 0.3mm φ TH 0.2mm φ TH Normal Mating Stroke Worst Mating Stroke Normal Mating Stroke Worst Mating Stroke CFP2_TOP CFP2_BOTTOM CFP8_TOP CFP8_BOTTOM DSFP_TOP DSFP_BOTTOM OSFP_TOP OSFP_BOTTOM QSFP_TOP QSFP_BOTTOM QSFP-DD_Legacy top QSFP-DD_Additional top QSFP-DD_Additional bottom QSFP-DD_Legacy bottom
24 24/34 Conclusion 1) Connector SI performance on both nominal and worst mating position were simulated for CFP2,CFP8,DSFP,QSFP,QSFP-DD and OSFP module form factor. 2) Worst mating position showed some performance degradation specially at higher than 35GHz on all module form factors. This condition should be incorporated into the 112G channel study. 3) Via. size makes impact to the ILD result 4) Yamaichi continues connector performance improvement study to make all module form factors work on 112G channel. 5) For more information, please contact, Hiroaki Kukita: (Japan, SI Engineer) Toshiyasu Ito: (Japan) Takeshi Nishimura (Nish) : takeshin@yeu.com (USA) David Binder : david.binder@yamaichi.de (Germany)
25 APPENDIX 25/34
26 26/34 Comparison of Insertion Loss Normal Mating Worst Mating
27 27/34 PCB model touchstone files Module Board and Host Board(φ0.3mm / φ0.2mm) Module Board : Module Board.s4p Megtoron6 PCB Loss Host Board : Host Board_2via0.3.s4p (via φ0.3mm) Host Board_2via0.2.s4p (via φ0.2mm) Module Board(No Cap) Host Board(Include 2*TH) Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
28 28/34 Connector simulation model touchstone files CFP2 Connector Connector only All touch stone is used at 10ch. Red touch stone is used at 8ch. is used at 4ch. Channel model Host Board via diameter is 0.3mm. Please use in combination a connector and board touch stone file (P25) at channel model of φ0.2. Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
29 29/34 Connector simulation model touchstone files CFP8 Connector Connector only Channel model Host Board via diameter is 0.3mm. Please use in combination a connector and channel model of φ0.2. board touch stone file (P25) at Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
30 30/34 Connector simulation model touchstone files DSFP Connector Connector only Channel model Host Board via diameter is 0.3mm. Please use in combination a connector and channel model of φ0.2. board touch stone file (P25) at Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
31 31/34 Connector simulation model touchstone files OSFP Connector Connector only Please use in combination a connector and board touch stone file (P25) at channel model of φ0.2. Channel model Host Board via diameter is 0.3mm. Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
32 32/34 Connector simulation model touchstone files QSFP Connector Connector only Channel model Host Board via diameter is 0.3mm. Please use in combination a connector and channel model of φ0.2. board touch stone file (P25) at Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
33 33/34 Connector simulation model touchstone files QSFP-DD Connector (1) Connector only Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
34 34/34 Connector simulation model touchstone files QSFP-DD Connector (2) Channel model Please use in combination a connector and channel model of φ0.2. board touch stone file (P25) at Maximum Frequency = 70GHz / 10MHz Step Minimum Frequency = 0Hz
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