ExaMAX HIGH-SPEED BACKPLANE SYSTEMS

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Oswin Garrison
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1 ExaMX HIGH-SPEE CKPLNE SYSTEMS

ExaMX HIGH-SPEE CKPLNE SYSTEMS ExaMX high-speed backplane systems deliver 28 Gbps of electrical performance while offering an easy migration path to 56 Gbps. choice of 28 Gbps performance on a 2.

iscrete guidance modules Meets Telcordia GR-1217 CORE specification 2.

2 ExaMX HIGH-SPEE CKPLNE SYSTEMS ExaMX high-speed backplane systems deliver 28 Gbps of electrical performance while offering an easy migration path to 56 Gbps. choice of 28 Gbps performance on a 2.00 mm column pitch, or 56 Gbps performance on a 3.00 mm column pitch, gives designers the option of optimizing density or minimizing board layer count for high-speed backplane applications. iscrete guidance modules Meets Telcordia GR-1217 CORE specification 2.4 mm mating surface area (contact wipe) Meets and exceeds OIF CEI-28G-LR specification for 28 Gbps standards ddresses both 85 Ω and 100 Ω applications Optional 80 power modules 3.00 mm pitch system for 56 Gbps performance Lowest mating force on the market with excellent contact normal force 2.00 mm pitch system for 28 Gbps performance 56 Gbps 28 Gbps *ExaMX is a trademark of FCI

OPTIMIZE FOR ENSITY N PERFORMNCE HIGH RELIILITY ESIGN FOR RUGGE PPLICTIONS Meets industry specifications such as PCI

differential pair design: Industry s lowest mating force with excellent contact normal force Two reliable points of

4 mm contact wipe eam-on-beam contact interface minimizes residual stub two reliable points of contact 72-pair design:

incorporates a one-piece embossed ground structure: Increased isolation significantly reduces crosstalk individual

modules for blind mating Ground placement engineered for 92 Ω impedance and addresses both 85 Ω and 100 Ω applications

guidance modules that hold maximum weight in a space-saving design, and allow for self-capture, selfalignment and

staggered differential pair design High power modules deliver bulk current to mating power components at 80 per module

performance Targeted performance for return loss compliance in 85 Ω & 100 Ω systems Future-proof design for easy

on 2.00 mm pitch; single or double track on 3.

3 OPTIMIZE FOR ENSITY N PERFORMNCE HIGH RELIILITY ESIGN FOR RUGGE PPLICTIONS Meets industry specifications such as PCI Express, Intel OPI & VPI, SS, ST, Fibre Channel, Infiniand and Ethernet Enables 28 Gbps electrical performance on 2.00 mm column pitch and 56 Gbps on 3.00 mm column pitch Exceeds OIF CEI-28G-LR specification for 28 Gbps standards Individual signal wafers in a staggered, differential pair design: Industry s lowest mating force with excellent contact normal force Two reliable points of contact, even when subjected to angled mating Meets Telcordia GR-1217 CORE specification 2.4 mm contact wipe eam-on-beam contact interface minimizes residual stub two reliable points of contact 72-pair design: 6-pair x 12 column Hermaphroditic mating interface: 40-pair design: 4-pair x 10 column Ensures stub-free mating Wafer incorporates a one-piece embossed ground structure: Increased isolation significantly reduces crosstalk individual signal wafers Provides reliable mating and alignment Thick wall housings available to maximize robustness guidance modules for blind mating Ground placement engineered for 92 Ω impedance and addresses both 85 Ω and 100 Ω applications alanced differential pairs are arranged in columns with zero skew lind mate capable, with built-in macro and micro guidance modules that hold maximum weight in a space-saving design, and allow for self-capture, selfalignment and mating without damage Press-fit tails provide a reliable electrical connection between the connector and the board staggered differential pair design High power modules deliver bulk current to mating power components at 80 per module optional 80 a power modules TECHNOLOGY CENTERS VNCE INTERCONNECT ESIGN Systems engineered for maximum density and performance Targeted performance for return loss compliance in 85 Ω & 100 Ω systems Future-proof design for easy migration to 56 Gbps systems Unique contact geometry results in lowest mating force on the market Single track routing on 2.00 mm pitch; single or double track on 3.00 mm pitch TERSPEE CONSULTING dvanced support for full system and cost optimization PC layout and trace routing strategies for optimized performance esign assistance from consulting review to full turn-key design PC materials expertise for optimized cost and performance Full system Signal / Power Integrity analysis and design

4 ExaMX PERFORMNCE CHRTS ExaMX high-speed backplane systems achieve return loss compliance in both 85 Ω and 100 Ω systems, the result of targeting the middle ground performance specification of 92 Ω, as well as specific attention to controlling reflections at all geometric transitions in the connector. y minimizing internal reflections, ExaMX is able to meet return loss specifications in 85 Ω and 100 Ω systems, as demonstrated in the figures below. 0 ExaMX Return Loss 85 Ω System (PCIe Gen 4) 0 ExaMX Return Loss 100 Ω System (OIF CEI-28G) Freq, GHz Freq, GHz ExaMX Impedance (15 ps Risetime 10-90%) Time, nsec Contact Insertion & Contact Force Insertion epth (mm) Mating Force: Tip Lead-in Geometry Mating Force: 2.3 mm Reliable Wipe istance Contact Normal Force Unmating Force *PCIe is a registered trademark of PCI-SIG. ExaMX PERFORMNCE SPECIFICTIONS The ExaMX contact system achieves two reliable points of contact at all times and minimizes residual stub for improved signal integrity performance, while providing low mating force and excellent contact normal force. Signal wafers incorporate a one-piece, embossed ground structure which improves crosstalk performance mm column pitch: 28 Gbps 3.00 mm column pitch: 56 Gbps Skew: 0 sec, equalized through differential pair NEXT / FEXT: < 100 psec (20-80%) Normal force: 30 g (end of life) Mating force: 0.36 N max per contact Unmating force: 0.12 N min per contact Current rating: 0.5 per signal contact (0 < 30 C temp rise above ambient) -55 C to +85 C operating temperature MFG: Class II 4-gas; Cycles: 200 Manufacturing friendly 0.36 mm PTH for signals and 0.50 mm for grounds

CKPLNE ROMP Samtec currently offers a 2.

Current add-on features include 80 power modules and discrete guidance modules for blind mating.

making it easy to start building into new and existing applications.

Keying for proper mating ExaMX IRECT MTE ORTHOGONL Shorter signal path for improved signal

system airflow ExaMX MI-PLNE ORTHOGONL Eliminates traces on the mid-plane with two connectors

sides of the mid-plane ExaMX COPLNR ypass the backplane with a direct connection between the

to right-angle ExaMX and cable-to-cable applications Supports new high frequency system

with all ExaMX connectors Industry leading Eye Speed cable provides increased flexibility and

5 CKPLNE ROMP Samtec currently offers a 2.00 mm pitch traditional ExaMX system in 72-pair and 40-pair designs. Current add-on features include 80 power modules and discrete guidance modules for blind mating. These current offerings make up half of the systems in the ExaMX high-speed backplane roadmap, making it easy to start building into new and existing applications. TRITIONL ExaMX WITH ITIONL FETURES Staging Guidance Thick walls for a more rugged solution Keying for proper mating ExaMX IRECT MTE ORTHOGONL Shorter signal path for improved signal integrity performance Requires fewer connectors by eliminating the mid-plane board Improves system airflow ExaMX MI-PLNE ORTHOGONL Eliminates traces on the mid-plane with two connectors sharing one footprint irect connection between vertical cards and horizontal cards on opposite sides of the mid-plane ExaMX COPLNR ypass the backplane with a direct connection between the front and rear cards ExaMX CLE SYSTEM Cable-to-board press-fit, cable to vertical ExaMX, cable to right-angle ExaMX and cable-to-cable applications Supports new high frequency system architectures Enables fly over and fly under applications for fewer layer counts Intermateable with all ExaMX connectors Industry leading Eye Speed cable provides increased flexibility and routability IN EVELOPMENT Coplanar Mid-Plane Orthogonal irect Mate Orthogonal Cable System dd-on Power Modules & iscrete Guidance Modules Contact Samtec for information on 2 and 3-pair configurations and 3.00 mm pitch versions Traditional ExaMX

ExaMX HEER & RIGHT-NGLE RECEPTCLE ETF-R ETM C C (2.60).102 (4.00).157 C (1.30).051 (1.00).039 (3.60).14 (3.60).142 (6.70).264 (11.65).459 (4.60).181 (4.60).181 (7.30).287 (9.00).354 (7.

05 mm nominal housing-to-housing gap NO. OF PIRS PER COLUMN C 4 6 (19.90).783 (23.90).941 (17.90).705 (25.10).988 (28.00) 1.102 (35.60) 1.402 (15.60).614 (22.80).898 NO.

50 mm Required distance to daughtercard ETF No.

0787") -S = 30 µ" (0.76 µm) Gold in contact area, Matte Tin on tail ETM No.

6 ExaMX HEER & RIGHT-NGLE RECEPTCLE ETF-R ETM C C (2.60).102 (4.00).157 C (1.30).051 (1.00).039 (3.60).14 (3.60).142 (6.70).264 (11.65).459 (4.60).181 (4.60).181 (7.30).287 (9.00).354 (7.30).287 (1.20).048 (9.00).354 (0.34) (1.20) (0.19).007 (0.34).013 (0.19).007 (4.00) (2.00).0787 (1.20).048 (0.19).007 (0.34).013 (9.20).362 (9.20) mm nominal housing-to-housing gap NO. OF PIRS PER COLUMN C 4 6 (19.90).783 (23.90).941 (17.90).705 (25.10).988 (28.00) (35.60) (15.60).614 (22.80).898 NO. OF PIRS PER COLUMN C 4 6 (19.90).783 (23.90).941 (18.00).709 (22.00).866 (22.50).886 (29.70) (15.60).614 (22.80).898 ETF-R / ETM PRT NUMERS mm Required distance to daughtercard ETF No. of Pairs Per Column Columns Column Pitch Plating R 1-4 = 4 Pairs per Column -6 = 6 Pairs per Column -10 = Ten Rows (-4 only) -12 = Twelve Rows (-6 only) -2.0 = 2.00 mm (.0787") -S = 30 µ" (0.76 µm) Gold in contact area, Matte Tin on tail ETM No. of Pairs Per Column Columns Column Pitch Plating VT 1-4 = 4 Pairs per Column -6 = 6 Pairs per Column -10 = Ten Rows (-4 only) -12 = Twelve Rows (-6 only) -2.0 = 2.00 mm (.0787") -S = 30 µ" (0.76 µm) Gold in contact area, Matte Tin on tail PPLICTION TOOLING For vertical connectors only. Right-angle connectors do not require special insertion tooling, they are designed for flat rock insertion Part Number: CT-PT-ETM-X-XX-2.0-VT x 10 Tool 6 x 12 Tool PIRS PER COLUMN

7 ExaMX HIGH POWER MOULES EPTS POSITION 1 (SEE CHRT) (2 REQ ) POSITION 2 (SEE CHRT) (2 REQ ) EPTS CONTCT LENGTH CLLOUT & "X" SETCK IMENSION PIN STGING POSITION 1 POSITION 2 POSITION 3 POSITION (.175) (TYP) (.409) EPTT (.453) 3.00 (.118) (1.220) LEING EGE OF CONTCT (.545) X (4 PLCS) (SEE CHRT) (.626) POSITION 4 (SEE CHRT) (2 REQ ) POSITION 3 (SEE CHRT) (2 REQ ) POSITION 2 POSITION LONG LONG LONG LONG 1.10 LONG LONG SHORT SHORT LONG SHORT SHORT LONG LONG SHORT SHORT SHORT SHORT SHORT SHORT LONG SHORT SHORT SHORT SHORT (.644) POSITION 3 POSITION 4 EPTS / EPTT PRT NUMERS EPTS No. of Positions -2 = 4 Positions Plating -P = Palladium with Flash Gold on contacts, Matte Tin on tail VT Pin Staging -01 through -06 (see chart) EPTT No. of Positions -2 = 4 Positions Plating -P = Palladium with Flash Gold on contacts, Matte Tin on tail Height = 11.5 mm (.724) 8.60 (.339) R 7.05 (.278) (.431) 7.25 (.285) (1.252) (2 PLCS) (1.179) REF (.579) 6.00 (.236) (.699) (.438) ExaMX ISCRETE GUINCE MOULES 3.40 (.134) (.851) 4.00 (.157) (2 PLCS) EGF 7.05 (.278) (1.252) (2 PLCS) (1.179) REF EGM M5 X 0.8-6g M5 X 0.8-6g 8.60 (.339) (.724) (.431) 7.25 (.285) (.579) 4.00 (.157) (2 PLCS) 8.35 (.329) 8.35 (.329) External Threading 7.40 (.291) 7.40 (.291) 3.10 (.122) 3.10 (.122) 3.40 (.134) 6.00 (.236) (.699) (.438) 3.87 (.152) (.851) (.996) (.996) (.852) (.852) 2.75 (.108) 2.75 (.108) 7.30 (.287) (.732) 7.30 (.287) (.732) 7.45 (.293) 7.45 (.293) M3 X 0.5-6H X 3.0 EEP(.049) w/0.3 x 45 CHMFER MIN.197 MIN Internal Threading M3.5 X 0.6-6H INTERNL M3.5 X 0.6-6H THRE INTERNL [.197] MINIMUM THRE- EPTH 5.00 [.197] MINIMUM EPTH LENGTH EGF / EGM PRT NUMERS EGF R (0.720) (0.577) (0.996) (0.852) EGM Orientation Threading Length 20 -VT = Vertical -R =Right-angle (in development) -1 = External -2 = Internal (-25.3 length only) = 18.3 mm = 25.3 mm

EXPERIENCE ExaMX IN 3 Samtec s augmented reality app highlights the intricate design of the ExaMX high-speed backplane system. 1. ownload the free Samtec Reality pp from the pp Store 2. Open the pp 3.

8 EXPERIENCE ExaMX IN 3 Samtec s augmented reality app highlights the intricate design of the ExaMX high-speed backplane system. 1. ownload the free Samtec Reality pp from the pp Store 2. Open the pp 3. Point your device's camera at the target to the right W O R L W I E L O C T I O N S 33 Locations 4,000+ ssociates Signal Integrity Group Teraspeed Consulting Samtec Cable Samtec Optical Group Samtec Microelectronics Signal Integrity Group Samtec Huizhou Samtec Tool Signal Integrity Group Samtec US Samtec Costa Rica Samtec Penang Samtec Johor Sales Samtec Singapore Manufacturing Support UNITE STTES NORTHERN CLIFORNI SOUTHERN CLIFORNI SOUTH MERIC UNITE KINGOM GERMNY FRNCE ITLY NORIC/LTIC ENELUX ISREL INI USTRLI / NEW ZELN SINGPORE JPN SHNGHI SHENZHEN TIWN HONG KONG KORE SUEN SERVICE JUNE 2016

ExaMAX High Speed Backplane Connector System Innovative pinless connector system delivering superior electrical performance at speeds 25Gb/s to 56Gb/s

ExaMAX High Speed Backplane Connector System Innovative pinless connector system delivering superior electrical performance at speeds 25Gb/s to 56Gb/s Innovative pinless connector system delivering superior electrical performance at speeds 5Gb/s to 5Gb/s SUPPORTS MANY INDUSTRY STANDARD SPECIFICATIONS; MIGRATION PATH TO HIGHER BANDWIDTH APPLICATIONS ExaMAX