Digitization of non-volatility Jean-Pascal BOST, CEO
|
|
- Marjory Greene
- 5 years ago
- Views:
Transcription
1 D a t a - e f f i c i e n t w o r l d Digitization of non-volatility Jean-Pascal BOST, CEO
2 Lab spin-off Incorporated people IP Fabless Non volatile Semiconductor IP emram erram
3 Where does it hurt? End users want to have the cake and eat it too: IP providers shall respond envram demand driven by: eflash, OTP, esram, logic(partial) replacement Ultra low power demand Cost management (vs eflash and at system level with rearchitecture) 10/2/2017 3
4 Full solutions with evaderis Connected Object Powered by evaderis Long lifetime wearable medical analysis SENSE COM STORE PROCESS Long lifetime smart vision (automotive, smarts cities...) Enable On Thing Machine learning Artificial intelligence 10X extended lifetime 10X energy saving More processing TCO, QoS Sensor/data fusion, micro storage (industry ) 10/2/2017 4
5 evaderis 2012 bet: 1 st mover Technology/Standalone Providers (Everspin, TDK, Crossbar, ) Material/Process R&D Standalone Indus Standalone Prod Foundries (GF, Samsung, TSMC, SMIC ) Embedded Indus Embedded Prod IP Providers (embedded) (ARM, Kilopass, evaderis ) Enable innovative NVRAM IP ecosystem Design Automation Physical Design System Design and Software for IoT Ecosystem will require IP company around Build a team, an expertise Develop dedicated non-volatile design tools and flows (Design Automation) Develop and prototype first non-volatile designs (Physical and System Design) Settle system and software level approach for ultra low power IoT, mobile As a 1 st mover, to be the leading company offering energy efficient IP solutions 10/2/2017 5
6 Value proposition (1/2) Subsystem Processor IP (non volatile) Software IP (drivers, apps) Memory IP (non volatile compilers) evaderis-powered Customer chip Power (active & standby) Flexibility (hardware & software) Costs (density & process) 10/2/2017 6
7 Value proposition (2/2) Customer chip Standard IP evaderis Non volatile IP CPU MEM1 CPU MEM1 MEM2 USB WIFI MEM2 USB WIFI Energy consomption: x Energy consomption: x/10 to x/ /2/2017 7
8 Assets 6 patents on disruptive architectures and designs Design database (analog, digital/software in esttram/40nm technology) Design tools enabling industrial outputs (Callisto Framework): o o o o o o o Add-ons to commercial-production tools Manage new physical phenomena's/impacts from device up to application Enable fast and accurate simulations, analysis with automation and modeling Java-based big data approach for fast products analysis and optimization Easy migration from one technology to an other (esttram, ereram) Easy migration from one foundry to an other (GF, TSMC, Samsung, SMIC, ) Generate IPs and compilers aligned with standardization (plug and play) 10/2/2017 8
9 NV Macro to NV Platform CPU MEM3 MEM1 MEM2 PMU CLK BIAS UART GPIO ADC TIMERS RF Current approach eflash macro replacement Limited or no digital views Limit system optimization Increase risk of errors at system level Not compatible with (all) customer s EDA tools New features Load/restore context at system bus level (thru bus, word by word) 10/2/2017 9
10 NV Macro to NV Platform CPU MEM1 MEM2 UART GPIO New features Slow (compared to SRAM) NVRAM working memory No need to load states, just restore MEM3 PMU CLK BIAS ADC TIMERS RF New requirements Manage efficiently memory hierarchy eflash, NVRAM, SRAM New digital controllers or software In data or control logic path with frequents R/W access Need more data, more accurate timing, power...for optimized system design Enter the SRAM (logic) world with multiple instances: move toward memory generators Multiple blocks: start to share dedicated BIAS block at system level for area/power optimization Faster reboot from previous states start to put the pressure on the CLK wake up time 10/2/
11 NV Macro to NV Platform CPU MEM3 MEM1 MEM2 PMU CLK BIAS UART GPIO ADC TIMERS RF New features High-speed NV SRAM working memory Load states shadowed (in RAM, local), just restore Requirements New digital controllers or software for NV SRAM management In data or control logic path with CPU f R/W access Need even more data, more accurate timing, power...for optimized system and processing design Enter the SRAM (logic) world with multiple instances: move even more toward memory generators 10/2/
12 NV Macro to NV Platform CPU MEM3 MEM1 MEM2 PMU CLK BIAS UART GPIO ADC TIMERS RF New features Instant-on peripherals Massive parallel save/load configurations New requirements Generate dedicated NV-logic libraries/cells to store non-volatile local configurations High digital flexibility (different sizes, functions...) need a logic synthesis friendly approach Library generation aligned with 3 rd part standard cells formats (again, timing, power...) and constraints (layout...) Power management/reset (PMU) update for wake-up and save sequences with non-volatile logic cells and memory (rush currents, islands, priorities...) BIAS shared with memories and multiple logic cells Fast wake-up CLK 10/2/
13 NV Macro to NV Platform CPU MEM3 MEM1 MEM2 PMU CLK BIAS UART GPIO ADC TIMERS RF New features Full Instant-on system and Normally-off Massive parallel save/load intermediate processing states: advanced check pointing mechanism New requirements Generate dedicated NV-logic libraries/cells to store non-volatile local processing states Dedicated software to manage the NV technology at system level (check pointing, memory alloc...) High digital flexibility (different sizes, functions...) need a logic synthesis friendly approach Library generation aligned with 3 rd part standard cells formats (again, timing, power...) and constraints (layout...); even more critical than for configuration -> part of data/control path. Power management/reset (PMU) update for wake-up and save sequences with non-volatile logic cells and memory (rush currents, islands, priorities...) 10/2/
14 Challenges Generate digital views for production Enable non-volatile low power flow for system design 10/2/
15 Silicon to System Design evaderis covers all emram related topics from raw silicon data up to digital design MRAM digitization MRAM (MTJ) SPICE/Compact model development Advanced emram-based IP design (not only memory) Physical IP view generation (enable compatibility for digital EDA tools) Dedicated and optimized system design and software development 10/2/
16 Activities Memory compiler friendly, support across multiple simulators... Memory level, register level, RNG... MCU (RTL) level, memory controller, energy management unit, biasing, DFT unit... Intelligent memory allocation, instant-on function, checkpointing... Silicon 2 Digital SPICE Development Physical Design System Design Software Development Design Automation Framework to enable Non-Volatile Digital Flows at SoC level Powered by evaderis Feedback IP update Demo Chip (MCU-like) Multifunctional/application IoT board to demonstrate, benchmark and analyze the gains at application level (partnership) Demo Board Development Application Development 10/2/
17 Framework for emram design Apps Prod (production, QA) Resistive Memory Core (RMC) Framework NVRAM Library Generator NVRAM Data Design Analytics NVRAM Compiler Generator Non-Volatile logic Kit (NVK) Generator Software Development Kit Apps Dev (design optimization) NVRAM Cockpit NVRAM Yield Analyser NV System Impact Analysis NVRAM Simulation Optimizer Device2System Optimization Loop Powered by evaderis Dedicated Design Automation Framework For emram (erram compatible) 10/2/
18 FDSOI and emram A powerful combo at system level: Standard system Standby power (BB) FDSOI Active Power (scaling) Low power system Standby Power (Instant-on/Normally-off) emram Dynamic Power (BB density, locality) Power-misery system 10/2/
19 Thank you! Q&A:
Maximize energy efficiency in a normally-off system using NVRAM. Stéphane Gros Yeter Akgul
Maximize energy efficiency in a normally-off system using NVRAM Stéphane Gros Yeter Akgul Summary THE COMPANY THE CONTEXT THE TECHNOLOGY THE SYSTEM THE CO-DEVELOPMENT CONCLUSION May 31, 2017 2 Summary
More informationemram: From Technology to Applications David Eggleston VP Embedded Memory
emram: From Technology to Applications David Eggleston VP Embedded Memory 10,000 foot view What are we trying to achieve? 2 Memory is Know Remembering. Think Events 3 Memory is Code Persistence. Data State
More informationSOLVING MANUFACTURING CHALLENGES AND BRINGING SPIN TORQUE MRAM TO THE MAINSTREAM
SEMICON Taipei SOLVING MANUFACTURING CHALLENGES AND BRINGING SPIN TORQUE MRAM TO THE MAINSTREAM Joe O Hare, Marketing Director Sanjeev Aggarwal, Ph.D., VP Manufacturing & Process Everspin Company Highlights
More informationRevolutionizing RISC-V based application design possibilities with GLOBALFOUNDRIES. Gregg Bartlett Senior Vice President, CMOS Business Unit
Revolutionizing RISC-V based application design possibilities with GLOBALFOUNDRIES Gregg Bartlett Senior Vice President, CMOS Business Unit RISC-V: Driving New Architectures and Multi-core Systems GF Enabling
More informationSoitec ultra-thin SOI substrates enabling FD-SOI technology. July, 2015
Soitec ultra-thin SOI substrates enabling FD-SOI technology July, 2015 Agenda FD-SOI: Background & Value Proposition C1- Restricted July 8, 2015 2 Today Ultra-mobile & Connected Consumer At Any Time With
More informationSiFive Freedom SoCs: Industry s First Open-Source RISC-V Chips
SiFive Freedom SoCs: Industry s First Open-Source RISC-V Chips Yunsup Lee Co-Founder and CTO High Upfront Cost Has Killed Innovation Our industry needs a fundamental change Total SoC Development Cost Design
More informationLet s first take a look at power consumption and its relationship to voltage and frequency. The equation for power consumption of the MCU as it
1 The C8051F91x/0x product family is designed to dramatically increase battery lifetime which is the number one requirement for most battery powered applications. The C8051F91x has the industry s lowest
More informationDesignWare IP for IoT SoC Designs
DesignWare IP for IoT SoC Designs The Internet of Things (IoT) is connecting billions of intelligent things at our fingertips. The ability to sense countless amounts of information that communicates to
More informationSynopsys Design Platform
Synopsys Design Platform Silicon Proven for FDSOI Swami Venkat, Senior Director, Marketing, Design Group September 26, 2017 2017 Synopsys, Inc. 1 Synopsys: Silicon to Software Software Application security
More informationHigh Performance Mixed-Signal Solutions from Aeroflex
High Performance Mixed-Signal Solutions from Aeroflex We Connect the REAL World to the Digital World Solution-Minded Performance-Driven Customer-Focused Aeroflex (NASDAQ:ARXX) Corporate Overview Diversified
More information.org. IoT Development Platform
1.org IoT Development Platform 2 Q&A How many ARM cores shipped in 2012? 8,700,000,000 Per Day: 23,835,616 Per Hour: 993,151 Per Minute: 16,553 Per Second: 276 2002 1+ billion 2011 billion 2020 25+ 150+
More informationemram: Winning the IoT and AI Applications MRAM Developer s Day August 6th Santa Clara, CA Michael Mendicino VP Product Management; Leading Edge CMOS
emram: Winning the IoT and AI Applications MRAM Developer s Day August 6th Santa Clara, CA Michael Mendicino VP Product Management; Leading Edge CMOS Knowing what will drive growth and how we meet it Growth
More informationProven 8051 Microcontroller Technology, Brilliantly Updated
Proven 8051 Microcontroller Technology, Brilliantly Updated By: Tom David, Principal Design Engineer, Silicon Labs Introduction The proven 8051 core received a welcome second wind when its architecture
More informationOberon M2M IoT Platform. JAN 2016
Oberon M2M IoT Platform JAN 2016 www.imgtec.com Contents Iot Segments and Definitions Targeted Use Cases for IoT Oberon targeted use cases IoT Differentiators IoT Power Management IoT Security Integrated
More informationPut on the Future: Wearable Technology
Put on the Future: Wearable Technology.Press Contact Andes Technology Corporation Marcom Manager Janine Hsu ext. 614 Mobil: 886-932-315015 E-mail: Janine@andestech.com Web: Sep. 2013 1. Introduction While
More informationCan MRAM be a factor for HPC?
IC Power Consumption ITRS roadmap (W/cm2) Can MRAM be a factor for HPC? 1. Introduction 2. Can MRAM help? 3. Which MRAM? Logic is the major issue! Memory Wall High Performance Computing Current HPC! Pétaflops
More informationEmbedded Hardware and Software
Embedded Hardware and Software Saved by a Common Language? Nithya A. Ruff, Director, Product Marketing 10/11/2012, Toronto Synopsys 2012 1 Synopsys Industry Leadership $1,800 $1,600 $1,400 $1,200 $1,000
More informationPlace Your Logo Here. K. Charles Janac
Place Your Logo Here K. Charles Janac President and CEO Arteris is the Leading Network on Chip IP Provider Multiple Traffic Classes Low Low cost cost Control Control CPU DSP DMA Multiple Interconnect Types
More informationASYNC Rik van de Wiel COO Handshake Solutions
ASYNC 2006 Rik van de Wiel COO Handshake Solutions Outline Introduction to Handshake Solutions Applications Design Tools ARM996HS Academic Program Handshake Solutions Started as research project in Philips
More informationNew Mul(- Time Programmable Embedded NVM IP Provides SoC Designers New Architecture Op(ons
New Mul(- Time Programmable Embedded NVM IP Provides SoC Designers New Architecture Op(ons Kilopass Corporate Overview Logic NVM Innovator Proven & Patented Embedded NVM in CMOS Broadly Adopted Key Markets
More informationIntel Research mote. Ralph Kling Intel Corporation Research Santa Clara, CA
Intel Research mote Ralph Kling Intel Corporation Research Santa Clara, CA Overview Intel mote project goals Project status and direction Intel mote hardware Intel mote software Summary and outlook Intel
More informationCustom Silicon for all
Custom Silicon for all Because Moore s Law only ends once Who is SiFive? Best-in-class team with technology depth and breadth Founders & Execs Key Leaders & Team Yunsup Lee CTO Krste Asanovic Chief Architect
More informationDr. Ajoy Bose. SoC Realization Building a Bridge to New Markets and Renewed Growth. Chairman, President & CEO Atrenta Inc.
SoC Realization Building a Bridge to New Markets and Renewed Growth Dr. Ajoy Bose Chairman, President & CEO Atrenta Inc. October 20, 2011 2011 Atrenta Inc. SoCs Are Driving Electronic Product Innovation
More informationBluetooth Smart Development with Blue Gecko Modules. Mikko Savolainen October 2015
Bluetooth Smart Development with Blue Gecko Modules Mikko Savolainen October 2015 Agenda Bluetooth & the IoT BGM111 Bluetooth Smart Module Blue Gecko Bluetooth Smart Software Software Development Flow
More informationConnect your IoT device: Bluetooth 5, , NB-IoT
Connect your IoT device: Bluetooth 5, 802.15.4, NB-IoT Prithi Ramakrishnan Arm TechTalk 2017 IoT connectivity technologies Multiple standards, different applications Throughput Unlicensed >100Mbps Wi-Fi
More informationIPL Workshop Luncheon DAC Interoperable PDK Libraries: The Proof is in the Pudding
IPL Workshop Luncheon DAC 2008 Interoperable PDK Libraries: The Proof is in the Pudding Agenda 12:00 12:20 Complimentary Lunch Buffet 12:20 12:40 Introduction & IPL Overview Ed Lechner, Synopsys 12:40
More information90-nm To 10-nm Physical IP For Wearable Devices & Application Processors Navraj Nandra Synopsys, Inc. All rights reserved. 1
90-nm To 10-nm Physical IP For Wearable Devices & Application Processors Navraj Nandra 2015 Synopsys, Inc. All rights reserved. 1 Process Requirements are Specific to Customer/Market Need Wearable / IoT
More information2017 Arm Limited. How to design an IoT SoC and get Arm CPU IP for no upfront license fee
2017 Arm Limited How to design an IoT SoC and get Arm CPU IP for no upfront license fee An enhanced Arm DesignStart Building on a strong foundation Successfully used by 1000s of designers, researchers
More informationVersatile RRAM Technology and Applications
Versatile RRAM Technology and Applications Hagop Nazarian Co-Founder and VP of Engineering, Crossbar Inc. Santa Clara, CA 1 Agenda Overview of RRAM Technology RRAM for Embedded Memory Mass Storage Memory
More informationTI SimpleLink dual-band CC1350 wireless MCU
TI SimpleLink dual-band CC1350 wireless MCU Sub-1 GHz and Bluetooth low energy in a single-chip Presenter Low-Power Connectivity Solutions 1 SimpleLink ultra-low power platform CC2640: Bluetooth low energy
More informationEMBEDDED SYSTEMS READY TO USE LECTURE MATERIALS FOR UNDERGRADUATES
EMBEDDED SYSTEMS READY TO USE LECTURE MATERIALS FOR UNDERGRADUATES INTRODUCTION 12 WEEK COURSE OUTLINE (1/2) 1.) Introduction What are embedded systems Characteristics Sample Market Segments The IoT Era
More informationConnect Your IoT Device: Bluetooth 5, , NB-IoT
Connect Your IoT Device: Bluetooth 5, 802.15.4, NB-IoT Craig Tou Business Development Manager, Arm Arm Tech Symposia 2017, Taipei IoT Devices - Everything Connects New classes of connectivity for a new
More informationCommon Platform Ecosystem Enablement
Joe Abler Common Platform Ecosystem Enablement IBM provides a complete Foundry solution Innovative technology Leadership road map with advanced SiGe & RF offerings Leading-edge CMOS process development
More informationA Test-Centric Approach to ASIC Development for MEMS
A Test-Centric Approach to ASIC Development for MEMS MÅRTEN VRÅNES DIRECTOR, CONSULTING SERVICES CONSULTING SERVICES GROUP MEMS JOURNAL, INC. C: 707.583.3711 MVRAANES@MEMSJOURNAL.COM 4 th Annual MTR Conference
More informationEMERGING NON VOLATILE MEMORY
EMERGING NON VOLATILE MEMORY Innovative components for neuromorphic architecture Leti, technology research institute Contact: leti.contact@cea.fr Neuromorphic architecture Brain-inspired computing has
More informationNANOIOTECH The Future of Nanotechnologies for IoT & Smart Wearables Semiconductor Technology at the Core of IoT Applications
NANOIOTECH The Future of Nanotechnologies for IoT & Smart Wearables Semiconductor Technology at the Core of IoT Applications Giorgio Cesana STMicroelectronics Success Factors for new smart connected Applications
More informationSo you think developing an SoC needs to be complex or expensive? Think again
So you think developing an SoC needs to be complex or expensive? Think again Phil Burr Senior product marketing manager CPU Group NMI - Silicon to Systems: Easy Access ASIC 23 November 2016 Innovation
More informationCMOSETR Session C1, July 7 (Macroelectronics)
Universal Flexible Hybrid System Development Kit including MCU, ADC and RFIC Prepared for: CMOSETR Session C1, July 7 (Macroelectronics) Doug Hackler President & CEO doughackler@americansemi.com 208 336-2773
More informationChapter 5: ASICs Vs. PLDs
Chapter 5: ASICs Vs. PLDs 5.1 Introduction A general definition of the term Application Specific Integrated Circuit (ASIC) is virtually every type of chip that is designed to perform a dedicated task.
More informationDesign Solutions in Foundry Environment. by Michael Rubin Agilent Technologies
Design Solutions in Foundry Environment by Michael Rubin Agilent Technologies Presenter: Michael Rubin RFIC Engineer, R&D, Agilent Technologies former EDA Engineering Manager Agilent assignee at Chartered
More informationMRAM in 2024 How we got there?
MRAM in 2024 How we got there? Panel Discussion Chair: Satoru Araki, Sr.Dir, Prog/Prod Mgmt, Spin Transfer Technologies Goal: Visualize what we can expect, and what we need to work on Panelists: - Tom
More informationSoCtronics Corporate Overview Industry s 1st Design FoundryTM
SoCtronics Corporate Overview Industry s 1st Design FoundryTM Headquarters Hyderabad, India Design Center Santa Clara, California Company Profile One-stop SoC design service company Operating since 2003
More informationLearning Module 9. Managing the Sensor: Embedded Computing. Paul Flikkema. Department of Electrical Engineering Northern Arizona University
Learning Module 9 Managing the Sensor: Embedded Computing Paul Flikkema Department of Electrical Engineering Northern Arizona University Outline Networked Embedded Systems Hardware Software Languages Operating
More informationEnabling Electronic Devices, Materials, and Processes with Physically Flexible ICs. Rich Chaney
Enabling Electronic Devices, Materials, and Processes with Physically Flexible ICs Rich Chaney Image from performancemanagementcompany.com Image from: theapplecollection.com Traditional Crunchy (rigid)
More informationTechnology Platform Segmentation
HOW TECHNOLOGY R&D LEADERSHIP BRINGS A COMPETITIVE ADVANTAGE FOR MULTIMEDIA CONVERGENCE Technology Platform Segmentation HP LP 2 1 Technology Platform KPIs Performance Design simplicity Power leakage Cost
More informationAgile Hardware Design: Building Chips with Small Teams
2017 SiFive. All Rights Reserved. Agile Hardware Design: Building Chips with Small Teams Yunsup Lee ASPIRE Graduate 2016 Co-Founder and CTO 2 2017 SiFive. All Rights Reserved. World s First Single-Chip
More informationTitan silicon root of trust for Google Cloud
Scott Johnson Dominic Rizzo Secure Enclaves Workshop 8/29/2018 Titan silicon root of trust for Google Cloud 1 Cloud Perspective: We need a silicon root of trust Software infrastructure Datacenter equipment
More informationUltra Low Power Microcontroller - Design Criteria - June 2017
Ultra Low Power Microcontroller - Design Criteria - June 2017 Agenda 1. Low power technology features 2. Intelligent Clock Generator 3. Short wake-up times 4. Intelligent memory access 5. Use case scenario
More informationWill Silicon Proof Stay the Only Way to Verify Analog Circuits?
Will Silicon Proof Stay the Only Way to Verify Analog Circuits? Pierre Dautriche Jean-Paul Morin Advanced CMOS and analog. Embedded analog Embedded RF 0.5 um 0.18um 65nm 28nm FDSOI 0.25um 0.13um 45nm 1997
More informationIoT Sensor Connectivity and Processing with Ultra-Low Power, Small Form-Factor FPGAs
IoT Sensor Connectivity and Processing with Ultra-Low Power, Small Form-Factor FPGAs Applications Run the Gamut from Sensor Buffers, Signal Aggregation to Embedded Camera, Audio and Display Solutions A
More informationThe Software of Things T Y S O N T U T T L E C E O S I L I C O N L A B S A S P E N C O R E C E O S U M M I T S H E N Z H E N 8 N O V E M B E R 2018
The Software of Things T Y S O N T U T T L E C E O S I L I C O N L A B S A S P E N C O R E C E O S U M M I T S H E N Z H E N 8 N O V E M B E R 2018 Most technology we ve built so far was for the Internet
More informationCprE 288 Introduction to Embedded Systems (Project and Platform Overview)
CprE 288 Introduction to Embedded Systems (Project and Platform Overview) Instructor: Dr. Phillip Jones http://class.ece.iastate.edu/cpre288 1 Overview of Today s Lecture Announcements What are Embedded
More informationARROW ARIS EDGE Board User s Guide 27/09/2017
ARROW ARIS EDGE Board User s Guide All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject
More informationNew STM32 F7 Series. World s 1 st to market, ARM Cortex -M7 based 32-bit MCU
New STM32 F7 Series World s 1 st to market, ARM Cortex -M7 based 32-bit MCU 7 Keys of STM32 F7 series 2 1 2 3 4 5 6 7 First. ST is first to sample a fully functional Cortex-M7 based 32-bit MCU : STM32
More information24th MONDAY. Overview 2018
24th MONDAY Overview 2018 Imagination: your route to success At Imagination, we create and license market-leading processor solutions for graphics, vision & AI processing, and multi-standard communications.
More informationHEXIWEAR COMPLETE IOT DEVELOPMENT SOLUTION
HEXIWEAR COMPLETE IOT DEVELOPMENT SOLUTION NXP SEMICONDUCTORS PUBLIC THE ONLY SUPPLIER TO PROVIDE COMPLETE IoT SOLUTIONS DSPs, MCUs & CPUs Suite of Sensors NFC, BLE, Thread, zigbee, sub-ghz Wireless Interconnects
More informationWearDrive: Fast and Energy Efficient Storage for Wearables
WearDrive: Fast and Energy Efficient Storage for Wearables Reza Shisheie Cleveland State University CIS 601 Wearable Computing: A New Era 2 Wearable Computing: A New Era Notifications Fitness/Healthcare
More informationUnleashing MRAM as Persistent Memory
Unleashing MRAM as Persistent Memory Andrew J. Walker PhD Spin Transfer Technologies Contents The Creaking Pyramid Challenges with the Memory Hierarchy What and Where is MRAM? State of the Art pmtj Unleashing
More informationVORAGO TECHNOLOGIES. Rad-hard CMOS Based Technology for Space Ross Bannatyne (512)
VORAGO TECHNOLOGIES Rad-hard CMOS Based Technology for Space Ross Bannatyne rbannatyne@voragotech.com (512) 550-2954 Space Parts Working Group Torrance, CA April 4-5th, 2017 VORAGO Technologies Privately
More informationFOR IOT PRODUCT DEVELOPMENT
FOR IOT PRODUCT DEVELOPMENT TRONSHOW IEEE2050-2018 STANDARD 2018/12/12 ATSUSHI HASEGAWA INDUSTRIAL SOLUTION BUSINESS UNIT RENESAS ELECTRONICS CORPORATION SOLUTION OFFERINGS FOR FOCUS DOMAINS To develop
More informationToward a Memory-centric Architecture
Toward a Memory-centric Architecture Martin Fink EVP & Chief Technology Officer Western Digital Corporation August 8, 2017 1 SAFE HARBOR DISCLAIMERS Forward-Looking Statements This presentation contains
More informationIncorporating a Capacitive Touch Interface into Your Design
Incorporating a Capacitive Touch Interface into Your Design Renesas Electronics America Inc. Renesas Technology & Solution Portfolio 2 Microcontroller and Microprocessor Line-up 2010 2012 32-bit 8/16-bit
More informationEmbedded Systems: Architecture
Embedded Systems: Architecture Jinkyu Jeong (Jinkyu@skku.edu) Computer Systems Laboratory Sungkyunkwan University http://csl.skku.edu ICE3028: Embedded Systems Design, Fall 2018, Jinkyu Jeong (jinkyu@skku.edu)
More informationVORAGO TECHNOLOGIES. Solutions for Selective Radiation-Hardened Components in CubeSats Ross Bannatyne, VORAGO Technologies
VORAGO TECHNOLOGIES Solutions for Selective Radiation-Hardened Components in CubeSats Ross Bannatyne, VORAGO Technologies rbannatyne@voragotech.com VORAGO Technologies VORAGO Technologies, Austin, Texas.
More informationBuilding secure devices on the intelligent edge with Azure Sphere. Paul Foster, Microsoft Dr Hassan Harb, E.On
Building secure devices on the intelligent edge with Azure Sphere Paul Foster, Microsoft Dr Hassan Harb, E.On Microcontrollers (MCUs) low-cost, single chip computers 9 BILLION new MCU devices built and
More informationSmartBond DA Smallest, lowest power and most integrated Bluetooth 5 SoC. Applications DA14585
SmartBond DA14585 Smallest, lowest power and most integrated Bluetooth 5 SoC Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery
More informationSoC Memory Interfaces. Today and tomorrow at TSMC 2013 TSMC, Ltd
SoC Memory Interfaces. Today and tomorrow at TSMC 2013 TSMC, Ltd 2 Agenda TSMC IP Ecosystem DDR Interfaces for SoCs Summary 3 TSMC Highlights Founded in 1987 The world's first dedicated semiconductor foundry
More informationECE 111 ECE 111. Advanced Digital Design. Advanced Digital Design Winter, Sujit Dey. Sujit Dey. ECE Department UC San Diego
Advanced Digital Winter, 2009 ECE Department UC San Diego dey@ece.ucsd.edu http://esdat.ucsd.edu Winter 2009 Advanced Digital Objective: of a hardware-software embedded system using advanced design methodologies
More informationMicrosemi Secured Connectivity FPGAs
IoT Solutions Microsemi Secured Connectivity FPGAs SmartFusion2 SoC FPGAs Low Power Small Form Factors Scalable Security Secured Connectivity FPGAs Best in Class for IoT Infrastructure The IoT Infrastructure
More informationAdvantages of MIPI Interfaces in IoT Applications
Advantages of MIPI Interfaces in IoT Applications IoT DevCon Conference Hezi Saar April 27, 2017 Abstract In addition to sensors, high-resolution cameras are key enablers of IoT devices. The challenge
More informationNew Silicon Frontiers: Physically Flexible System-on-a-Chip
New Silicon Frontiers: Physically Flexible System-on-a-Chip Richard L. Chaney, Douglas R. Hackler, Kelly J. DeGregorio, Dale G. Wilson This work sponsored in part by the Rapid Response Technology Office
More informationRecent IoT/Automotive device Trends and testing challenges Presented To: SiP Conference China 2018 Presented By: Kotaro HASEGAWA
Recent IoT/Automotive device Trends and testing challenges Presented To: SiP Conference China 2018 Presented By: Kotaro HASEGAWA 2018/10/19 All Rights Reserved - ADVANTEST CORPORATION 1 IoT Market Trend
More informationIoT as Enabling Technology for Smart Cities Panel PANEL IEEE RTSI
IoT as Enabling Technology for Smart Cities Panel PANEL SESSION @ IEEE RTSI Torino, September 17, 2015, 8.30-10.00 Giuliana Gangemi, STMicroelectronics, giuliana.gangemi@st.com IoT Ecosystem 2 Sensors
More informationMobile & IoT Market Trends and Memory Requirements
Mobile & IoT Market Trends and Memory Requirements JEDEC Mobile & IOT Forum Daniel Heo ARM Segment Marketing Copyright ARM 2016 Outline Wearable & IoT Market Opportunities Challenges in Wearables & IoT
More informationINTERNET OF BIG THINGS : SMART INFRASTRUCTURES FOR IMPROVED MOBILITY. Sarah WELDON
INTERNET OF BIG THINGS : SMART INFRASTRUCTURES FOR IMPROVED MOBILITY Sarah WELDON sarah.weldon@cea.fr LETI : ONE OF CEA TECH'S 3 RESEARCH INSTITUTES 16,000 CEA employees worldwide 10 % PhDs and post-docs
More informationTIRIAS RESEARCH. Lowering Barriers to Entry for ASICs. Why ASICs? Silicon Business Models
Technology industry Reporting Insights Advisory Services Whitepaper by TIRIAS Research June 20, 2017 There has never been a better time to build your own custom application specific integrated circuit
More informationBluetooth Low Energy Portfolio
Bluetooth Low Energy Portfolio February 2016 - Page 1 Price Smart Platform 3 Platforms based on BLE Combo Node Connectivity ISP0900 series Intelligent Node ISP1300 series ISP091201 ISP1500 series ISP130301
More informationSemiconductors : Accelerating Technologies for Intelligent Applications. Zhiyong Han, General Manager, China Sales
Semiconductors : Accelerating Technologies for Intelligent Applications Zhiyong Han, General Manager, China Sales Technology Effects are Accelerating 2 Today s Explosion of Data is Amazing 70,017 Hours
More informationSimplify System Complexity
1 2 Simplify System Complexity With the new high-performance CompactRIO controller Arun Veeramani Senior Program Manager National Instruments NI CompactRIO The Worlds Only Software Designed Controller
More informationMicroprocessor Systems
Microprocessor Systems Networks and Embedded Software Module 4.1.1 by Wolfgang Neff Components (1) Microprocessor System Microprocessor (CPU) Memory Peripherals Control Bus Address Bus Data Bus 2 Components(2)
More informationGrundlagen Microcontroller Memory. Günther Gridling Bettina Weiss
Grundlagen Microcontroller Memory Günther Gridling Bettina Weiss 1 Lecture Overview Memory Memory Types Address Space Allocation 2 Memory Requirements What do we want to store? program constants (e.g.
More informationTechnologies Leading at Specialty. S C Chien VP of Specialty Technology and Corporate Marketing 27th May, 2015
Technologies Leading at Specialty S C Chien VP of Specialty Technology and Corporate Marketing 27th May, 2015 Outline Paving the Way for IoT Greener and Smarter Automotive Summary 2 IoT Redirects Foundry
More informationWearable Technologies and the IoT. David Lamb Market Development Manager, North Europe STMicroelectronics
Wearable Technologies and the IoT David Lamb Market Development Manager, North Europe STMicroelectronics Who We Are 2 A global semiconductor leader The largest European semiconductor company 2013 revenues
More informationA Perspective on the Role of Open-Source IP In Government Electronic Systems
A Perspective on the Role of Open-Source IP In Government Electronic Systems Linton G. Salmon Program Manager DARPA/MTO RISC-V Workshop November 29, 2017 Distribution Statement A (Approved for Public Release,
More information08 - Address Generator Unit (AGU)
October 2, 2014 Todays lecture Memory subsystem Address Generator Unit (AGU) Schedule change A new lecture has been entered into the schedule (to compensate for the lost lecture last week) Memory subsystem
More informationEnabling IOT. IQRF Alliance Conference May Harald Weidinger Key Client Manager
Enabling IOT IQRF Alliance Conference May 2016 Harald Weidinger Key Client Manager IQRF Alliance Conference, May 2016 2 Vision, Mission & Goals Vision : Make Microchip a leading provider of IoT ecosystems,
More informationNVIDIA'S DEEP LEARNING ACCELERATOR MEETS SIFIVE'S FREEDOM PLATFORM. Frans Sijstermans (NVIDIA) & Yunsup Lee (SiFive)
NVIDIA'S DEEP LEARNING ACCELERATOR MEETS SIFIVE'S FREEDOM PLATFORM Frans Sijstermans (NVIDIA) & Yunsup Lee (SiFive) NVDLA NVIDIA DEEP LEARNING ACCELERATOR IP Core for deep learning part of NVIDIA s Xavier
More informationApplication Strategic Focus
Application Strategic Focus Georges Penalver Chief Strategy Officer 2 ST SAM Evolution by Application 3 % of ST SAM 2016 Contribution to ST SAM Growth (2016-2019) Wired Comm. 11% Wireless Comm. 13% Wireless
More informationIntroduction to Microcontroller Apps for Amateur Radio Projects Using the HamStack Platform.
Introduction to Microcontroller Apps for Amateur Radio Projects Using the HamStack Platform www.sierraradio.net www.hamstack.com Topics Introduction Hardware options Software development HamStack project
More informationThe ARM Cortex-M0 Processor Architecture Part-1
The ARM Cortex-M0 Processor Architecture Part-1 1 Module Syllabus ARM Architectures and Processors What is ARM Architecture ARM Processors Families ARM Cortex-M Series Family Cortex-M0 Processor ARM Processor
More informationAtmel s s AT94K Series Field Programmable System Level Integrated Circuit (FPSLIC)
Atmel s s AT94K Series Field Programmable System Level Integrated Circuit (FPSLIC) Embedded Systems Based Built-In Self-Test and Diagnosis of the FPGA Core Slide 1 Embedded Systems Lecture 1/19/08 System-On-Chip
More informationPlatform for System LSI Development
Platform for System LSI Development Hitachi Review Vol. 50 (2001), No. 2 45 SOCplanner : Reducing Time and Cost in Developing Systems Tsuyoshi Shimizu Yoshio Okamura Yoshimune Hagiwara Akihisa Uchida OVERVIEW:
More informationVORAGO TECHNOLOGIES. 6 th Interplanetary CubeSat Workshop Cambridge, May, 2017
VORAGO TECHNOLOGIES Radiation-hardened ARM Cortex -M0 Microcontroller for CubeSats / SmallSats Ross Bannatyne, VORAGO Technologies rbannatyne@voragotech.com VORAGO Technologies Privately held fabless semiconductor
More informationOptimization of IoT Sensing Systems Based on Bluetooth Smart SiP Modules. Chris Barratt Insight SiP Sophia Antipolis France October 15 th 2015
Optimization of IoT Sensing Systems Based on Bluetooth Smart SiP Modules Chris Barratt Insight SiP Sophia Antipolis France October 15 th 2015 Agenda Insight SiP Introduction Bluetooth Smart Principles
More informationNovel Nonvolatile Memory Hierarchies to Realize "Normally-Off Mobile Processors" ASP-DAC 2014
Novel Nonvolatile Memory Hierarchies to Realize "Normally-Off Mobile Processors" ASP-DAC 2014 Shinobu Fujita, Kumiko Nomura, Hiroki Noguchi, Susumu Takeda, Keiko Abe Toshiba Corporation, R&D Center Advanced
More informationIntroducing the 22FDX. 22nm FD-SOI Platform. from GLOBALFOUNDRIES
Introducing the 22FDX 22nm FD-SOI Platform from GLOBALFOUNDRIES March 2016 Introduction Selecting a next generation technology platform for your new product is a critical decision. Product requirements
More informationAsynchronous on-chip Communication: Explorations on the Intel PXA27x Peripheral Bus
Asynchronous on-chip Communication: Explorations on the Intel PXA27x Peripheral Bus Andrew M. Scott, Mark E. Schuelein, Marly Roncken, Jin-Jer Hwan John Bainbridge, John R. Mawer, David L. Jackson, Andrew
More informationSTM32F429 Overview. Steve Miller STMicroelectronics, MMS Applications Team October 26 th 2015
STM32F429 Overview Steve Miller STMicroelectronics, MMS Applications Team October 26 th 2015 Today - STM32 portfolio positioning 2 More than 30 product lines High-performance 398 CoreMark 120 MHz 150 DMIPS
More informationMS Diploma and Semester Projects offered at the Microelectronic Systems Laboratory during the Spring 2015
v1.2 as of 06.11.2015 MS Diploma and Semester Projects offered at the Microelectronic Systems Laboratory during the Spring 2015 Students are asked to contact the project responsible to register. The majority
More informationXilinx Vivado/SDK Tutorial
Xilinx Vivado/SDK Tutorial (Laboratory Session 1, EDAN15) Flavius.Gruian@cs.lth.se March 21, 2017 This tutorial shows you how to create and run a simple MicroBlaze-based system on a Digilent Nexys-4 prototyping
More information