New Silicon Frontiers: Physically Flexible System-on-a-Chip

Transcription

1 New Silicon Frontiers: Physically Flexible System-on-a-Chip Richard L. Chaney, Douglas R. Hackler, Kelly J. DeGregorio, Dale G. Wilson This work sponsored in part by the Rapid Response Technology Office and Air Force Research Laboratory, Wright-Patterson AFB, under the programs Advanced FleX SoC Microcontroller and Enabling Flexible Materials, Devices and Processes for Defense Doug Hackler President & CEO American Semiconductor

2 What are Flexible Hybrid Electronics? Printed Electronics Low Cost, R2R, Large Format Flexible Hybrid System Combination of flexible printed materials and flexible silicon-based ICs to create a new class of flexible electronics. Flexible FleX-ICs High Performance, High Density Molex flexible substrate Printed Electronics Sensors Interconnects Substrates Displays Low Cost, Large Format Roll-To-Roll, Screen, Inkjet Print, American Semiconductor FleX-ICs Sensor Signal Processing Data Processing Data Storage Communications Low Cost, High Performance Compatible with Printed Electronics Foundry CMOS + FleX Processing 2

3 FleX-IC Traditionally Thinned Die Why Flexible Hybrid Electronics? New Applications Internet of Things (IoT) Wearables Structural New Requirements Conformal Dynamically Flexible Ultra thin Ultra light weight Traditionally Thinned Die at 5mm Radius Improved Reliability No Die Cracking Reduced Breakage of Interconnects 3

4 Features Drive Complexity FleX-SoC - Programmable System on Chip 8-bit Microcontroller Core V Operating Range Low Power, Including 0.1uA Deep Sleep 256Kb Flash NVM (50K cycles) 2KB SRAM USB Mbs Full-Speed Compliant 10-bit Analog-to-Digital Converter 2 Analog Comparators Low Power Sense Module 36 Programmable Input / Output Pins 6/12/24MHz Internal Oscillator 4

5 FleX Silicon-on-Polymer Conversion First high-volume industry standard IC available as a flexible device 200mm (8 ) wafers converted to SoP with ultra-thin form factor FleX SoC-Wafer on Dicing Tape Probing a FleX-SoC Die FleX-SoC Die After Pick 130nm CMOS with 4 metal layers 2.2 mm X 2.3 mm die 5

6 Flash memory using SONOS technology Program / erase operations shift transistor operating point Known good die from standard wafers used as reference Flash Non-Volatile Memory Transistor Testing 6

7 Flash Non-Volatile Memory Radius of Curvature Testing Devices tested for before and after bending around RoC test mandrels Program, erase and read operations all tested NVM transistors passed to 5mm RoC in both concave and convex directions FleX-SoC NVM Erase RoC Results FleX-SoC NVM Program RoC Results 7

8 Test Coverage 85% of the Flash NVM 60% of the SRAM 30% of the GPIO Ports Full speed 24MHz operation FleX-SoC die have successfully passed probe testing FleX-SoC Die Testing Probing a FleX-SoC Die FleX-SoC Die During Probe FleX-SoC Die Test System 8

9 FleX-SoC Radius of Curvature Testing Devices tested for before and after bending around RoC test mandrels FleX-SoC passed to 5mm RoC in both concave and convex directions FleX-SoC Die FleX-SoC Die During RoC Testing 9

10 FleX-SoC NVM Data Retention Testing Flash NVM high temp data retention passed 150C AFRL/RX Flash NVM Solar Irradiance Testing Pass: Data retention testing at AFRL/RX Oriel solar simulator Air Mass AM 1.5G 100mW cm 2 solar simulated illumination Class B for spectral match, irradiance spatial nonuniformity, and temporal instability 300mW full spectrum Calibrated to a KG-5 filtered Si reference cell Passed 8 hours exposure 10

11 Flexible SoC Conclusions Most complex flexible IC ever produced SoP demonstrated using major supplier semiconductor wafers First COTS product processed using FleX SoP conversion Demonstrated performance to 5mm radius of curvature High temp NVM data retention passed at 150C SoP 262,144 memory bit density is over 7,000X larger than commercially available flexible printed memories: FleX-SoC Die (Tx=25um) vs $1 Bill (Tx=100um) 11

12 Thank You Doug Hackler American Semiconductor, Inc. All rights reserved. American Semiconductor is a registered trademark of American Semiconductor, Inc. FleXform, FleXform-ADC, FleX, Silicon-on-Polymer, FleX-ADC, FleX-MCU and FleX-IC are trademarks of American Semiconductor, Inc. American Semiconductor, Inc W Targee St Boise, ID Tel: Fax: