IoT A Perfect Business Enabler for 200mm Fabs. Bill Chuang Marketing Director UMC Sep. 3, 2014

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1 IoT A Perfect Business Enabler for 200mm Fabs Bill Chuang Marketing Director UMC Sep. 3, 2014

2 Outline Market Observation Supply Chain Evolution Fragmented Market & End-Applications Industry Challenge Solutions 2

3 Computing Paradigm Shift Drives Semi Growth Sensing Semiconductor (Bn USD) Mainframe Client Server Personal Mobile

4 Ubiquitous Connectivity Enables Intelligence Analyzed Data Cloud Interactive Home/Office 375X Increase in connected devices from 2000 to 2020 (40% CAGR) Interactive Vehicle Wearable Connectivity 4

5 Application Drivers of Semiconductor Numbers of Devices In Use (in million) Smartphone leads post PC era growth IoT applications will drive the next wave 20,000 18,000 16,000 14,000 12,000 10,000 8,000 6,000 4,000 2,000 YoY Growth Rate in 2015 Tablet: 9% Smartphone: 13% LCD TV: (-5%) PC: (-8%) Feature Phone: (-21%) Source: BI Intelligence, Gartner, IDC, UMC IoT IoT Tablets Smartphones PC (Desktop & Notebook)

6 Internet Of Things, Where The Money Goes 6 6

7 Watch/Band Type Devices: ~80% Market(2018) Source: IEK 7

8 Key Drivers of IoT Adoption Cost effectiveness and easy-to-use of hardware design and software development The level of integration with Big Data/Analytics, from which companies in various sectors can increase revenues and reduce inefficiencies. 8

9 IoT Smart Device Supply Chain Paradigm Shift Today Feedback Big Data Analysis On Cloud For Next Design Fabless/IDM IDM System House ASIC Design Small Fabless Specific Platform Big Fabless Generic Platform T/O T/O Technology Platform Fab Wafer OSAT Finished Goods System House End-product End-User Heterogeneous T/K Ecosystem Customized IC 9 Fab. of Smart Devices UMC Wafer Prototyping Portfolio OSAT: Set A:Low cost, so-so performance Set B:Customized Set C:High Performance, high cost System House Planned spec. End-User w/ Experience End-product w/ specific SW 9

10 Diving Into IoT Requirements On Specialty Wearable Smart Grid Smart Home/ Building IOT Remote Healthcare Smart Retail/ Logistic Smart Transport LP MCU LP MCU LP MCU LP MCU LP MCU LP MCU BT/BLE Display Charger PMIC Sensor HP AP HP AP HP AP Zigbee PLC WiFi BT/BLE Sensor Zigbee PLC WiFi BT/BLE Zigbee BT/BLE 2G/3G/4G Display Display Display PMIC Charger PMIC Energy Harvesting Charger PMIC Sensor RFID NFC GPS Display Charger PMIC Sensor RFID NFC GPS Display PMIC Sensor Sensor : envm : Cutting Edge Logic/MM : MMRF : HV : BCD : CIS, MEMS 10

11 MEMS/Sensors are Critical to IoT applications IoT LP MCU HP AP Wearable Smart Healthcare Smart Home RFID/NFC GPS WIFI PLC BT/BLE Zigbee 2G/3G/4G City Management Smart Logistics Smart Transport Smart Energy Display Charger, PMIC, Energy Harvest Sensors

12 Industry Trends Require MEMS Design Automation Consumer electronics Lower cost Time to market Sensor fusion & integration Cross-coupling effects Increasing complexity Packaging effects System-level optimization Fab lite and fab-less model Standardized processes Process Design Kits Reference designs & tool flows Joint process development Requirements for MEMS Design Automation: Capacity for Complex designs Processing effects Cross-coupling effects Packaging effects Accuracy to Avoid build & test Avoid component-level testing Speed for Design optimization System-level simulation 12

Battery Life Is the Major Issue Power Management Lower Vcc will extend battery life 1.5 AA Alkaline Cells Discharged at 500 ma VOLTS 1.2 1.0 0.5 EM 1.

13 Battery Life Is the Major Issue Power Management Lower Vcc will extend battery life 1.5 AA Alkaline Cells Discharged at 500 ma VOLTS EM 1.17 AH +160% +300% ET 1.84 AH DC AA 1.30 AH RS AA 1.31 AH EG 1.28 AH Source: 13

14 UMC IoT Solutions with Coverage LP core <1.0V LP SRAM bit-cell Low power eflash (SONOS) +RFCMOS platform Low power IP: 6/8 track cell lib memory complier BLE

Industry Challenges Facing Paradigm Shift Challenges Partner Requirements Moore s Law Alive and Well Advanced Node Commitment More-than-Moore Evolving Supply

15 Industry Challenges Facing Paradigm Shift Challenges Partner Requirements Moore s Law Alive and Well Advanced Node Commitment More-than-Moore Evolving Supply Chain Consolidation Skyrocketing R&D and CAPEX Robust Specialty Portfolio Open Collaboration for Strong Supply Chain Relations Flexibility to Share Risk/Cost 15

16 UMC Fab Of Smart Devices 1980 founded 10 total wafer fabs 1 st publicly listed IC company in Taiwan 8 global sales offices 16,000+ employees worldwide $4 Billion revenue 16

Hsinchu 8F Hsinchu 8N Suzhou 8S Hsinchu 6A Hsinchu 500,000 wpm Capacity 12 Fab x2 8 Fab x7 6

17 UMC Is Your Enabler for Success 34 Years Experience 20 Years Pure-Play Foundry 16,000 Employees 1,100 R&D Engineers 12A Tainan 8AB Hsinchu Fab 12i Singapore 8C & D Hsinchu 8E Hsinchu 8F Hsinchu 8N Suzhou 8S Hsinchu 6A Hsinchu 500,000 wpm Capacity 12 Fab x2 8 Fab x7 6 Fab x1 C/P+ Foundry For China Best C/P & More $4B Revenue 24% from <=40nm 28nm Ramp Up 2Q14 14nm Pilot 2014/E 17

18 Rising Demand Of 200mm Specialty Tech Source: UMC 18

19 UMC: IoT Partner Foundry Customer-Oriented Foundry DNA Flexibility Customer Oriented Business Model Portfolio Comprehensive Technologies Value-Added Services Total Silicon Realization Solution Cost of Ownership Optimized Supply Chain Partnership 19

20 Flexibility Customer Oriented Business Model Customer Supply Chain Requirements Technology/Manufacturing Needs Different Business Models (ASIC, IDM, fabless, etc.) Time to Market Advantages UMC JDP Engagement Process Porting Platform Solutions 20

21 Depth Advanced Logic Technology Performance Poly-SiON CoSi2, K=2.9 Poly-SiON NiSi, K=2.9 esige C_CESL esige Poly-SiON NiSi, SiGe K=2.55 HK/MG Gate Last NiSi, SiGe K=2.55, TSV FinFET SiGe/SiP K=2.55, TSV 90nm 65nm 45/40nm 28nm 14/10nm FinFET Litho: 193nm Scanner Immersion Scanner DPT 2014/

22 Width Specialty Technology Leadership Ultimate 8 Specialties HV eflash ee2prom CIS PMIC MEMS Leadership on 12 Specialties 55nm HV: industry s first to production 55nm CIS: technology release for production 55nm eflash: in developing Ongoing innovations: 40nm/HV, 40nm/eFlash, and more 22

23 UMC Technology Portfolio Comprehensive Technologies.6um.5um.35um.25um.18um.15um.13um.11um 90nm 80nm 65nm 55nm 40nm 28nm 14nm 10nm Logic/MS RF eflash HV CIS PMIC MEMS 2.5/3DIC Available Developing 23

24 UMC Turn-Key Service Model 1.Customer CoT 2. ASIC House UMC Sales / CS Tape-out Support Mask Making Non-Probe Wafers Fab Manufacturing Drop Ship Bump / BL Wafers Probed Wafers Bump / Back Lapping Wafer Sorting UMC Backend Services Packaged Chips Assembly / Final Test 1. Flexible In-house and Outsourcing Wafer Sort Production 2. Comprehensive Quality Assurance System 3. Short Turn-around Time & Quick Yield Feedback with In-house CP 24 24

25 Total Cost of Ownership Optimized Supply Chain Partnership Fabless & IDM UMC Foundry Flexibility Open Ecosystem Approach System maker Design & Mask OSAT Equipment & Material No Conflict of Interest Increased Transparency Seamless Business Model Long-term Partnerships EDA & IP 25

26 Complete 55nm ulp Device Offerings 55nm ulp Technology Core Devices LVt 1.1V 0.95V RVt 1.1V 0.95V HVt 1.1V 0.95V 55nm ulp SRAM I/O Devices 2.5V I/O 2) MS 1) Devices Native Vt Bipolar Diodes MIM 5V LDMOS / MOM NCAP/MOM 6T SRAM 8T SRAM 1) MS: mixed signal 2) I/O device offerings: 2.5V, 2.5OD3.3V, 2.5UD1.8V Resistors Inductor 26

27 Customized Solutions For Wearable Iactive Ioff SRAM Vccmin Flash Mask Adders 40% ~ 70% 20% ~ 50% 5-15% +12 >> 50% +4 General Offerings Customized Platform 27

UMC 55uLP IoT Platform Process V1.0 DSM FDK Fundamental IP Multi-Vol. IO T/O Kit (1.8/2.5/3.3V) 6T/8T SC *T/O Kit SP/1PRF/2PRF/ Via ROM **T/O Kit * Cell library, PMK, ECO kit (Vdd = 0.95V) ** Vcc = 0.

28 UMC 55uLP IoT Platform Process V1.0 DSM FDK Fundamental IP Multi-Vol. IO T/O Kit (1.8/2.5/3.3V) 6T/8T SC *T/O Kit SP/1PRF/2PRF/ Via ROM **T/O Kit * Cell library, PMK, ECO kit (Vdd = 0.95V) ** Vcc = 0.95 V 6T bitcell: 0.525um^2 8T bitcell: 0.789um^2 Leakage: < 5pA/cell Foundation IP ADC/DAC/PLL efuse OTP BT 4.0/4.1 BT 4.0/4.1 T/O Kit eflash Bit cell T/O (SONOS) Macro T/O (SONOS) Qual Finish Q2 14 Q3 14 Q4 14 Q1 15 Q2 15 Q3 15 Q4 15 : Under planning Right edge of box: Ready Date 28

29 If You Build It, They Will Come (Ray Kinsella in Field of Dreams, 1989) Italy, 1352 ~1980 >2013 Future? China, ~

30 Thank You 30

Technologies Leading at Specialty. S C Chien VP of Specialty Technology and Corporate Marketing 27th May, 2015

Technologies Leading at Specialty S C Chien VP of Specialty Technology and Corporate Marketing 27th May, 2015 Outline Paving the Way for IoT Greener and Smarter Automotive Summary 2 IoT Redirects Foundry