MICTOR* SB Vertical Connector for Surface Mount Technology (SMT) Printed Circuit (PC) Board Applications

Transcription

1 MICTOR* SB Vertcal Connector for Surface Mount Technology (SMT) Prnted Crcut (PC) Board Applcatons Applcaton Specfcaton JUL12 All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of ±0.13 [±.005] and angles have a tolerance of ±2. Fgures and llustratons are for dentfcaton only and are not drawn to scale. 1. INTRODUCTION Recommendatons n ths document are ntended only for the MICTOR SB product lnes. Ths specfcaton covers requrements for applcaton of MICTOR SB (Sngle Beam) Vertcal Board-to-Board Plug and Receptacle Connectors for Surface Mount Technology (SMT) Prnted Crcut (PC) Board Applcatons. The connectors have n-row contact centerlne spacng of 0.80 mm [.0315 n.]. Dependng on the contact centerlne, the connectors are desgned to accommodate 38 through 300 contact postons. Connectors are desgned for manual or robotc placement on pc boards of varous thcknesses Plug connectors are avalable n varous stack heghts. The stack heghts descrbe the board-to-board dstance when assembled wth a standard vertcal receptacle. Plugs and receptacles have polarzed matng faces, and are polarzed for algnment to the pc boards by means of algnment pegs on the housng bottoms. Date codes are marked on the sdes of the housngs. When correspondng wth TE Connectvty Personnel, use the termnology provded n ths specfcaton to facltate your nqures for nformaton. Basc terms and features of ths product are provded n Fgure 1. MICTOR SB SMT Vertcal Connectors 5.0 mm [.197 n.] Plug Receptacle Assembly (Typ) 11.0 mm [.433 n.] Plug Receptacle wth Gude Post Holes 30.0 mm [1.181 n.] Plug Plug wth Gude Posts Fgure Tyco Electroncs Corporaton, a TE Connectvty Ltd. Company All Rghts Reserved *Trademark TOOLING ASSISTANCE CENTER PRODUCT INFORMATION Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at TE Connectvty, TE connectvty (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of ther respectve owners. 1 of 14 LOC B

2 2. REFERENCE MATERIAL 2.1. Revson Summary Updated document to corporate requrements Deleted 0.50 centerlne connectors n Introducton, Fgures 2, 3, 4, 5, and 6, and Paragraph 3.8.A 2.2. Customer Assstance Reference Part Number and Product Code K052 are representatve of MICTOR SB Vertcal Connectors for SMT PC Board Applcatons. These numbers are used n a servce network of customer servce to access toolng and product applcaton nformaton. Ths servce s provded by your local company representatve or, after purchase, by callng the Toolng Assstance Center or the Product Informaton number at the bottom of page Customer Drawngs Customer drawngs for specfc products are avalable from the responsble company engneerng department va the servce network. The nformaton contaned n the customer drawng takes prorty f there s a conflct wth ths specfcaton or any other techncal documentaton suppled by the company Specfcatons Product Specfcaton and Desgn Objectve provde product performance requrements and test nformaton. Solderablty Specfcaton provdes requrements and evaluaton methods Manuals Manual s avalable upon request and can be used as a gude n solderng. Ths manual provdes nformaton on varous flux types and characterstcs along wth the commercal desgnaton and flux removal procedures. A checklst s ncluded n the manual as a gude for nformaton on solderng problems. 3. REQUIREMENTS 3.1. Product Materals MICTOR SB SMT Connector Housngs are constructed of a hgh temperature thermoplastc - Lqud Crystal Polymer, UL94V-0. The plug and receptacle sgnal contacts, and the ground buses are made of phosphor bronze. The matng nterface of the sgnal contacts and ground buses are underplated wth nckel and fnshed wth gold platng or wth gold flash. The solder leads and tnes have gold or gold flash platng Storage Connectors are packaged and shpped n protectve ant-statc trays or pocket tape whch can be used for automated placement of the connector to the pc board. Connectors should reman n the contaners untl ready for use to prevent physcal damage to the housngs and contacts. The connectors should be used on a frst n, frst out bass to avod storage contamnaton that could adversely affect sgnal transmssons and solderablty of the contact tnes Polarzaton Both the vertcal plug and receptacle connectors are prevented from reverse matng by an orentaton feature located at the ends of the connector that nterfaces wth the orentaton holes n the pc board. Fgure Crcut Identfcaton MICTOR SB SMT Vertcal Plugs and Receptacles are not marked wth a No. 1 pn dentfer. Refer to Fgure 1 and the followng notes for recommendatons regardng crcut dentfcaton. There s no ndustry standard for the callout of the pn number numberng sequence for MICTOR SB SMT Connectors. It s up to the customers' dscreton. However, the most common method s to start wth pn number 1 (reference recommended pc board pad dentfcaton n Fgure 5, wth algnment pegs algnng connector to the pc board pattern) and proceed to number 2 pn drectly on the opposte sde of the connector. Pn number 3 would then be adjacent pn number 1, wth pn number 4 adjacent to pn number 2, and so on. The ground bus contacts of all MICTOR SB true SMT style connectors are nternally commoned wthn each module, wth each module havng four surface mount style leads. MICTOR SB SMT Connectors come n three contact centerlne versons, wth each verson havng a dfferent number of contacts per module as lsted n the table n Fgure 2. 2 of 14

3 3.5. Spacng CENTERLINE VERSION A. Connector Algnment POSITIONS PER MODULE Fgure 2 MAXIMUM NUMBER OF MODULES TOTAL NUMBER OF SIGNAL POSITIONS 0.80 [.0315] To prevent solder jont damage, care should be used when matng connectors to ensure they have the freedom to self algn themselves to each other wthout bndng n any manner that may result n axal forces beng transferred through the solder jonts. TE does NOT recommend the use of more than one matng connector between two pc boards. The use of multple connectors on one board matng to multple connectors on another board may be plagued wth ssues regardng connector-to-connector postonal tolerances that may result n unfavorable solder jont stress. B. Board-to-Board Spacng Board-to-board stackng heghts for the MICTOR SB SMT Vertcal Connectors are provded n the table n Fgure 3. The dmenson provded does not nclude the paste thckness between the solder tnes and solder pads of both connectors PC Boards for MICTOR SB SMT Connectors VERTICAL CONNECTOR STACK HEIGHTS BOARD-TO-BOARD DISTANCES (SINGLE LEAD PITCH) 0.80 [.0315] Centerlne 5.00 [.197] 8.00 [.315] [.433] [.551] [.630] 9.00 [.748] [.866] [.984] [1.181] Fgure 3 A. Tolerance At the tme of connector placement, the coplanarty of the pad pattern must be held to 0.05 mm [.002 n.] maxmum. We recommend a solder mask to mnmze solder brdgng between pads. The mask must not exceed the heght of the pad by more than 0.05 mm [.002 n.]. Maxmum allowable bow of the pc board shall be 0.10 mm [.004 n.] over the length of the connector. Snce the connector housngs may rest on top of the solder mask, an excessvely hgh mask wll allow too much space between the solder tne and pad for a good solder jont. A solder jont under these condtons would be weak, and would not provde long term performance for the connector. 3 of 14

4 B. Materal and Thckness Snce MICTOR SB SMT Vertcal Connectors for Surface Mount Technology are true SMT parts, the pc board thckness s rrelevant. However, specal cauton should be taken to ensure the pc boards are at least thck enough to ensure board stablty, (flatness, etc.) throughout the reflow process and be rgd enough to support mate and unmate cyclng. C. PC Board Layouts The recommended pc board patterns depend on the approprate connector centerlne, 0.80 mm [.0315 n.]), and type, (receptacle or plug) are provded n Fgure 4. These layouts are vewed from the connector sde [.042] 2 Plc Fgure 4 (Cont d) 4 of 14

5 MICTOR SB TRUE SMT VERTICAL CONNECTORS RECOMMENDED PC BOARD LAYOUT DIMENSION TABLE CL STYLE TYPE STACK HEIGHT POSITION SIZE B C E F H [.599] [.793] [1.013] [1.386] [1.580] [.787] [1.800] Receptacle All [2.174] [2.367] [1.575] [2.587] [2.961] [3.155] [2.362] [3.375] 0.80 [.031] [3.749] [3.943] [3.150] [4.163] [.599] [.728] [1.386] [1.515] [.787] --- Plug All [2.174] [2.302] [1.575] [2.961] [3.090] [2.362] [3.749] [3.878] [3.150] --- Fgure 4 (End) Holes for processng hold-down fxtures or pc board spacer hardware should be placed along the sdes of connectors, based toward the mddle of the connector's length. Placng holes at the ends of the connectors may cause the ends of the connectors to act as fulcrum ponts to pry apart the opposte end or md-porton of the connector as the hold-down or spacer hardware s tghtened. WE do NOT recommend the use of more than one matng connector between two pc boards; f such a confguraton s necessary to meet desgn requrements, consult the Product Informaton number located at the bottom of page Mechancal Supports To ensure the pc board does not bow durng placement and a msapplcaton occurs, the pc board should be supported along the full length of the connector Processng PC Boards must meet the solderablty requrements of IEC (512-6: 1984 Test 12a). 5 of 14

6 A. Stencl The recommended stencl aperture s determned by the crcut pad sze and stencl thckness. It may be any shape as long as t prevents solder brdgng from one pad to another. Generally, the thnner stencl wll need a larger aperture to mantan the gven volume of solder paste. The formulas for calculatng the apertures for the MICTOR SB SMT Connector pads are as follows. Refer to Fgure mm [.0315 n.] Centerlne Vertcal Receptacles Volume of solder paste depost per pad for sgnal contacts: mm3 [ n³] Volume of solder paste depost per pad for ground bus contacts: Md-module pads: mm3 [ n³] End-module pads: mm3 [ n³] Wdth of sgnal contact crcut pads: mm [.0160 n.] Wdth of ground bus contact pads: mm [.0170 n.] Area of stencl aperture for sgnal contact pads mm2 [.0007 n²] Area of stencl aperture for ground bus contact pads: Length of stencl aperture for sgnal contact pads: 2.00 mm [.0795 n.] Length of stencl aperture for ground bus contact pads: Md-module pads: 4.70 mm [.185 n.] End-module pads: 2.79 mm [.110 n.] Wdth of stencl aperture for sgnal contact pads: 0.36 mm [.014 n.] 0.80 mm [.0315 n.] Centerlne Vertcal Plugs ( , 25.0, and 30.0 mm [ ,.984, and n.] Stack Heght Versons) Volume of solder paste depost per pad for sgnal contacts = mm3 [ n3] Volume of solder paste depost per pad for ground bus contacts: Md-module pads = mm3 [ n³] End-module pads = mm3 [ n³] Wdth of sgnal contact crcut pads = mm [.0180 n.] Wdth of ground bus contact pads = mm [.0250 n.] Area of stencl aperture for sgnal contact pads mm² [.0007 n²] Area of stencl aperture for ground bus contact pads: Md-module pads = 3.01 mm² [.0046 n²] End-module pads = 1.63 mm2 [.0025 n2] Length of stencl aperture for sgnal contact pads = 1.19 mm [.047 n.] Length of stencl aperture for ground bus contact pads: Md-module pads = 4.70 mm [.185 n.] End-module pads = 2.54 mm [.100 n.] Wdth of stencl aperture for sgnal contact pads = 0.41 mm [.016 n.] 6 of 14

7 0.80 mm [.0315 n.] Centerlne Vertcal Plugs ( mm [ n.] Stack Heght Versons) Volume of solder paste depost per pad for sgnal contacts = mm3 [ n3] Volume of solder paste depost per pad for ground bus contacts: Md-module pads = mm3 [ n3] End-module pads = mm3 [ n3] Wdth of sgnal contact crcut pads = mm [.0180 n.] Wdth of ground bus contact pads = mm [.0250 n.] Area of stencl aperture for sgnal contact pads mm2 [.0010 n2] Area of stencl aperture for ground bus contact pads: Md-module pads = 3.01 mm2 [.0046 n2] End-module pads = 1.63 mm2 [.0025 n2] Length of stencl aperture for sgnal contact pads = 1.56 mm [.0615 n.] Length of stencl aperture for ground bus contact pads: Md-module pads = 4.70 mm [.1850 n.] End-module pads = 2.54 mm [.1000 n.] Wdth of stencl aperture for sgnal contact pads = 0.41 mm [.016 n.] All traces must be covered by solder mask n the solder depost area. Exposed traces could cause brdgng and create a short, or wck solder away from the solder tnes, producng a weak solder jont. If a hold-down aperture s requred other than that specfed, the desgn must ensure that the connector housng wll not st on the solder depost. The recommended aperture wdth s 0.43 mm [.017 n.] for the vertcal connector crcut contact pads. It may be wder; however, care must be gven to ensure aganst solder brdgng durng processng. The recommended solder stencl layouts for MICTOR SMT Connectors are shown n Fgure 5. 7 of 14

8 Fgure 5 8 of 14

9 B. Solder Mask Solder mask s recommended between all pads, ground bus vas, and angular rngs. If a trace s run between adjacent pads on the solder sde of the pc board, a solder mask MUST be appled over the trace to prevent brdgng and wckng of solder away from the contact solder tnes. Addtonally, there should be solder mask coverng any traces n the area surroundng the bus lead solder depost. Lqud photo mageable or dry flm solder masks, n step wth modern processng technques are recommended. C. Recommended Solder Paste Characterstcs 1) Alloy type shall be ether 63 Sn/37Pb or 60 Sn/40Pb. 2) Flux shall be RMA type. 3) Solds by weght shall be 85% mnmum. 4) Mesh desgnaton -200 to +325 (74 to 44 square mcron openngs, respectvely). 5) Mnmum vscosty of screen prnt shall be 5 x 10 5 cp (centpose). 6) Mnmum vscosty of stencl prnt shall be 7.5 x 10 5 cp (centpose). D. Solder Volume Solder volume for each crcut pad and bus tne openng s calculated by multplyng the pad length by the pad wdth by the stencl thckness (Volume=LxWxT). The recommended volume for these connectors s determned wth a mean stencl thckness of 0.15 mm [.006 n.]. Refer to the table n Fgure 6. SOLDER PASTE VOLUMES TYPE CENTERLINE PAD TYPE LENGTH WIDTH THICKNESS Vertcal Receptacle Sgnal Contact Pad Vertcal Receptacle Ground Bus Contact Pads Vertcal Plug Sgnal Contact Pads Vertcal Plug Ground Bus Contact Pads Fgure 6 VOLUME mm³ [n³] 0.80 [.0315] Sgnal Contact [.0790] [.0140] [.0060] [ ] 0.80 [.0315] Md-Module [.1850] [.0170] [.0060] [ ] End-Module [.1100] [.0170] [.0060] [ ] 0.80 [.0315] Sgnal Contact [.0470] [.0160] [.0060] [ ] 0.80 [.0315] Sgnal Contact [.0615] [.0160] [.0060] [ ] 0.80 [.0315] 0.80 [.0315] Md-Module [.1850] [.0250] [.0060] [ ] End-Module [.1000] [.0250] [.0060] [ ] Md-Module [.1850] [.0250] [.0060] [ ] End-Module [.1000] [.0250] [.0060] [ ] 5.0, 8.0, 11.0, 14.0, 25.0, and 30.0 mm [.197,.315,.433,.551,.984, and n.] Stack Heght Versons mm [ n.] Stack Heght Versons Paste volumes n excess of those recommended could result n excessve solder wckng onto the solder tne, resultng n reducton of tne complance and/or solder jont falure. More techncal nformaton may be avalable from the manufacturer of the stencl. 9 of 14

10 E. Vertcal Connector Placement The vertcal plugs and receptacles are postoned on the pc board by matchng the orentaton feature on the bottom of the housng to the unplated holes. The pc board should be frmly supported n the area drectly beneath the connector durng placement to prevent the pc board from flexng. Refer to Paragraph 5.1. Connectors are avalable n shppng trays or on tape reels and should be placed drectly from the package to the pc board. TE does NOT recommend emptyng them from the package nto ples or n bowl feeders pror to placement. Connectors should be handled only by the ends. DO NOT touch the solder tnes, as mosture from the hands wll contamnate the solderng process and lead poston or coplanarty may be compromsed. Optmally, the connector solder tnes should be centered on the pc board pads. However, slght msalgnment s permssble. See Fgure 7. Typcal for MICTOR SB SMT Vertcal Connectors Solder Tne Tne Centered on PC Board Pad s Preferable PC Board Pad PC Board Tne Overhang up to 50% Max s Acceptable Per ANSI J-STD 001A (Class 2) Fgure 7 F. Solderng Manual provdes some gudelnes for establshng solderng practces. 1) Technques -- It s recommended that the connector be soldered usng convecton, vapor phase (VPR), double sded non-focused nfrared (IR), or equvalent solderng technque provded the temperatures and exposure tme are wthn the ranges specfed n Fgure of 14

11 Fgure 8 2) Connector Capacty -- Connectors wll wthstand the maxmum temperature tme lmts specfed n Fgure 8. 3) Reflow Parameters -- Due to the many varables nvolved wth the reflow process (that s, component densty, orentaton), we recommend that the user conduct tral runs under actual manufacturng condtons to ensure product and process compatblty. G. Cleanng SOLDERING PROCESS Vapor Phase Solderng Infrared Reflow Solderng Convecton CELSIUS TEMPERATURE FAHRENHEIT TIME (At Max Temp) Seconds After solderng, removal of fluxes, resdues, and actvators s necessary. Consult wth the suppler of the solder paste and flux for recommended cleanng solvents. The followng s a lstng of common cleanng solvents that wll not affect the connectors. The connectors wll be unaffected by any of these solvents for fve mnutes at 105 C [221 F]. See Fgure 9. Cleaners must be free of dssolved flux and other contamnants. We recommend cleanng wth the pc board on ts edge. If usng an aqueous cleaner, we recommend standard equpment such as a soak-tank or an automatc n-lne machne Even when usng "no clean" solder paste, t s mperatve that the contact nterface be kept clean of flux and resdue, snce t acts as an nsulator. Flux may mgrate under certan condtons wth elevated temperatures and, therefore, cleanng s necessary even wth "no clean" paste. CLEANER ALPHA, BIOACT, CARBITOL, LONCOTERGE, and KESTER are trademarks of ther respectve owners. Fgure 9 TIME (Mnutes) TEMPERATURE (Maxmum) NAME TYPE ALPHA 2110 Aqueous C [270 F] BIOACT EC-7 Solvent C [212 F] Butyl CARBITOL Solvent 1 Ambent Room Isopropyl Alcohol Solvent KESTER 5778 KESTER 5779 LONCOTERGE 520 LONCOTERGE 530 Terpene Aqueous Aqueous Aqueous Aqueous Solvent C [212 F] MICTOR SB SMT Connectors are not desgned to functon as pc board stffeners. Thermal flexng of the pc board wll result n ether the connector body followng the pc board contour or lftng off the board. 11 of 14

12 DANGER STOP Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Trchloroethylene and Methylene Chlorde can be used wth no harmful affect to the connectors; however, we do NOT recommend them because of the harmful occupatonal and envronmental effects. Both are carcnogenc (cancer-causng) and Trchloroethylene s harmful to the earth's ozone layer. If you have a partcular solvent that s not lsted, contact the Product Informaton number at the bottom of page 1. H. Dryng Ar dryng of cleaned connectors s recommended. Temperature for the connectors should not exceed -55 to 105 C [-67 to 221 F]. Degradaton of the housngs could result from extreme temperatures Matng and Unmatng Uneven or off-angle forces durng matng and unmatng of MICTOR SB SMT Connectors may cause overstress and damage to the contacts, housngs or solder jonts. Severe sde-to-sde rockng motons should be prohbted. Unmatng MICTOR SB SMT Connectors by lftng one end of the connector (peelng) s permtted. However, ths should only be done to ntate separaton of the mated contacts at one end of the connector. The separaton angle should be kept as low as possble as the contacts contnue to unmate, thereby spreadng out the unmatng forces over the length of the connectors. The connectors should not be "peeled" beyond a 20 angle. Mnaturzaton s a desgn feature of these connectors and the systems n whch they are used. Component densty, connector locaton, and pc board sze may make t dffcult to remove the connector. Two methods are recommended to facltate removal. If unmatng board-to-board connectors, the preferred method s to have one of the pc boards securely fastened and adequately supported to wthstand the pullng force appled to the other pc board. The second method s to construct a tool for your system desgn that wll produce a straght-away separaton of the connectors. See Fgure 10. Applcaton of unmatng forces to the pc boards should be done wthn close proxmty of the connector (preferably wthn 25.4 mm [1.000 n.] on 1.57 mm [.062 n.] thck pc boards). Stress on the solder jonts wll ncrease as the force s appled further from the connector. Fgure of 14

13 3.10. Repar/Removal Connectors may be removed from the pc board by standard SMT de-solderng methods. Damaged connectors must be replaced. 4. QUALIFICATIONS MICTOR SB SMT Connectors have been Recognzed by Underwrters Laboratores (UL) n fle No. E28476, and Certfed by CSA Internatonal n Certfcate No TOOLING 5.1. PC Board Support A pc board support must be used to prevent bowng of the pc board durng the placement of a connector on the board Robotc Equpment MICTOR SB SMT Connectors are pck-and-place compatble. They are normally packaged n trays, but vertcal receptacles and plugs are also avalable n pocket tape (wth or wthout vacuum pck-up dots). MICTOR SB SMT Vertcal Receptacles and Plugs may be appled usng robotc grppers or vacuum heads. Robotc placement equpment should be capable of accurately locatng connectors for pc board nserton usng the connector datum surfaces detaled on the customer drawng. Several robotc companes have experence wth placng MICTOR SB SMT Connectors and can be called upon for assstance. They are: Unversal Instruments Corporaton Panasonc Factory Automaton P.O. Box West Grand Ave. Bnghamton, NY Frankln Park IL (607) (847) Robodyne Fuj Amerca Corporaton 2818 Anthony Lane South 171 Corporate Woods Parkways Mnneapols, MN Vernon Hlls, IL (612) (847) of 14

14 6. VISUAL AID Fgure 11 shows a typcal applcaton of MICTOR SB SMT Connectors. Ths llustraton should be used by producton personnel to vsually ensure sutable applcatons. Installatons whch appear vsually ncorrect should be nspected usng the dmensonal nformaton gven n the precedng pages of ths applcaton specfcaton. FIGURE 11. VISUAL AID 14 of 14