Dual In- Line Package (DIP)

Transcription

1 Dual In- Lne Package (DIP) Applcaton Specfcaton Programmng Swtches (7000 and 7100 Seres) 03 MAY 11 Rev D All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of [+.005] and angles have a tolerance of +2_. Fgures and llustratons are fordentfcaton only and are not drawn to scale. 1. INTRODUCTION Ths specfcaton covers the requrements for applcaton of DIP programmng swtches (7000 and 7100 Seres) for prnted crcut (pc) board applcatons Seres swtches are desgned for a lfe of 7,000 cycles per pole Seres swtches are recommended for programmng applcatons where the number of cycles s lmted to 2,000 per pole. Swtches are manually rocker actuated and are desgned for wave solderng on prnted crcut (pc) boards or nserton nto DIP Sockets wth n--row centerlne spacng of 7.62 [.300] seres swtches are black, and are avalable n 2 through 12 postons, whle 7100 seres swtches are blue and avalable n 2 through 12 postons. Both seres are avalable wth a premum seal, an economy seal, or unsealed n the rased rocker (standard profle) or flush rocker profle (low profle). In addton, 7000 seres swtches are avalable wth a sde rocker profle (sde actuated). Both seres are ndvdual sngle--pole, sngle--throw (SPST) seres rased rocker profle swtches may have ganged rockers for sngle--pole, double--throw (SPDT) and double--pole, double--throw (DPDT) make--before--break crcuts. The unsealed swtches are desgned for socket applcatons and the sealed swtches are desgned for solderng drectly to the pc board. The sealants prevent flux and other contamnants from enterng the swtch durng solderng and cleanng. The rased rocker and sde rocker profles come unsealed or wth an optonal economy or premum maskng top seal. The flush rocker profle comes unsealed or wth an optonal economy tape top seal or premum maskng top seal. The mult--pole swtches come unsealed only. All swtches come standard wth a bottom seal. Swtches are desgned for use n logc level swtchng applcatons. When correspondng wth personnel, use the termnology provded n ths specfcaton to facltate your nqures for nformaton. Basc terms and features of ths product are provded n Fgure 1. Rased Rocker Standard Profle Swtch Whte Dot Identfes Pn 1 Poston Number Low-Profle Swtch Housng Sde Rocker Swtch Flush Rocker Whte Dot Identfes Pn 1 Fgure 1 Solder Tal E2011 Tyco Electroncs Corporaton, a TE Connectvty Ltd. Company All Rghts Reserved *Trademark TOOLING ASSISTANCE CENTER PRODUCT INFORMATION Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at TE Connectvty, TE connectvty (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of ther respectve owners. 1 of 7 LOC B

2 2. REFERENCE MATERIAL 2.1. Revson Summary Revsons to ths applcaton specfcaton nclude: S Changed company logo 2.2. Customer Assstance Reference Product Base Part Number and Product Code 4546 are representatve of DIP programmng swtches (7000 and 7100 Seres). Use of these numbers wll dentfy the product lne and expedte your nqures through a servce network establshed to help you obtan product and toolng nformaton. Such nformaton can be obtaned through a local Representatve or, after purchase, by callng PRODUCT INFORMATION at the number at the bottom of page Drawngs Customer Drawngs for product part numbers are avalable from the servce network. If there s a conflct between the nformaton contaned n the Customer Drawngs and ths specfcaton or wth any other techncal documentaton suppled, the nformaton contaned n the Customer Drawngs takes prorty Specfcatons Product Specfcatons (7000 seres) and (7100 seres) provde product performance and test nformaton. Qualfcaton Test Reports (7000 seres) and (7100 seres) provde an ndependent corporate test report to show the swtch conforms to the above mentoned Product Specfcatons Instructonal Materal Instructon Sheets (408--seres) provde product assembly nstructons or toolng setup and operaton procedures and Customer Manuals (409--seres) provde machne setup and operatng procedures. Documents avalable whch pertan to ths product are: Dual In--Lne Package (DIP) Programmng Swtches (7000 and 7100 Seres) 2.6. Manuals Manual can be used as a gude to solderng. Ths manual provdes nformaton on varous flux types and characterstcs wth the commercal desgnaton, flux removal procedures, and a gude for nformaton on solderng problems. 3. REQUIREMENTS 3.1. Safety Do not stack product shppng contaners so hgh that the contaners buckle or deform Lmtatons The swtches are desgned to operate wthn a temperature range of --55_ to 105_C [--67_ to 221_F] Storage A. Ultravolet Lght Prolonged exposure to ultravolet lght may deterorate the chemcal composton of components used n the swtches. B. Shelf Lfe The swtches should reman n the shppng contaners untl ready for use to prevent damage. These products should be used on a frst n, frst out bass to avod storage contamnaton. 2 of 7 Rev D

3 C. Chemcal Exposure Do not store swtches near any chemcals lsted below, as they may cause stress corroson crackng n the components. Alkales Ammona Ctrates Phosphates Ctrates Sulfur Compounds Amnes Carbonates Ntrtes Sulfur Ntrtes Tartrates Where the above envronmental condtons exst, phosphor -bronze contacts are recommended PC Board A. Materal and Thckness The pc board materal must be glass epoxy (FR--4 or G--10). The pc board thckness shall be 2.36 [.093]. Contact PRODUCT INFORMATION at the number at the bottom of page 1 for sutablty of other pc board materals and thcknesses. B. Tolerance Maxmum allowable bow of the pc board must be 0.08 [.003] over each 25.4 [1.00] of length. C. Layout The solder tal contact holes n the pc board must be precsely located to ensure proper placement and optmum performance of the swtch. The layout dmensons and tolerances shown n Fgure 2 must be observed when preparng pc boards for the varous swtches. The layout shows the top (component) sde of the board. Recommended PC Board Layout [ ] Typ [ ] Da Typ Note: Not to Scale [ ] 3.5. Holes Fgure 2 The holes n the pc board for the contact solder tals must be drlled and plated through to specfc dmensons gvennfgure Mountng Requrements Determne whether the swtch wll be soldered drectly to the pc board (a sealed swtch wll be requred), or whether the swtch s to be nstalled n a socket (an unsealed swtch can be used). A. DIP Socket 1. Secure DIP socket to pc board accordng to nstructons packaged wth socket. 2. Start one row of contact leads nto one row of contact cavtes n socket, then rotate swtch untl t s parallel wth socket. Rev D 3 of 7

4 Pad Dameter (As Requred) Drlled Hole Dameter (As Requred) [ ] Da Fnshed Hole After Platng Tn/Lead Thckness (As Requred) Copper Thckness (As Requred) Maxmum Hardness of Copper 150 Knoop Fgure 3 3. Grppng ends of swtch push swtch nto socket untl t s bottomed. 4. Determne whch of the crcuts are to be closed, then depress the applcable rockers to the ON poston. 5. If nstallng a protectve dust cover, check to be sure there are no obstructons on the swtch rockers or n the protectve cover, then slde the cover over the top of the housng. B. PC Board 1. Make a layout on pc board accordng to dmensons shown n Fgure Hold swtch at a slght angle and start one row of contact leads nto pc board holes. Do NOT over--nsert. Swtch should be rotated untl second row of contact leads are algned wth opposte row of contact holes. 3. Make certan all contact leads have started entry nto holes. Grp sdes of swtch and push swtch nto pc board untl t s bottomed. 4. To hold swtch n place durng wave solderng, the four outsde leads may be clnched nward at 45_. SeeFgure [.030] Max Fgure 4 Clnched Solder Tal (Inward Only) 4 of 7 Rev D

5 3.7. Solderng A. Flux Selecton Solder tals must be fluxed pror to solderng. Selecton of the flux wll depend on the type of pc board and other components mounted on the board. Addtonally, the flux must be compatble wth the wave solder lne, manufacturng, health, and safety requrements. Call the PRODUCT INFORMATION number at the bottom of page 1 for consderaton of other types of flux. Flux types that are compatble wth these swtches are provded n Fgure 5. PROCESS STEP CLEANING FLUX ORGANIC RA (Actve) ROSIN RMA (MldlyActve) ROSIN 1 Heat Heat Extra pre -clean 2 Solder Solder Heat 3 Wash n tap water or saponferd Wash wth saponferd Solder 4 Rnse n tap or de -onzed water Rnse n tap or de -onzed water Wash n saponferd 5 Dry n ambent ar or radant heater Dry n ambent or radant heater Rnse n tap or de -onzed water 6 Dry n ambent ar or radant heater D Reduces resdue to soap. Fgure 5 B. Solder ng Process Refer to Paragraph 2.5 for nstructonal materal that s avalable for establshng solderng gudelnes. The swtches can be soldered usng wave solderng or equvalent solderng technques. It s recommended usng SN60 or SN62 solder for these swtches. The maxmum solder profle temperature should be _C [473+10_F]. These swtches are not recommended for reflow process. C. Cleanng After solderng, removal of fluxes, resdues, and actvators s necessary. Automatc n--lne cleanng s recommended for the sealed swtch. Installaton n a socket s recommended for the unsealed swtch. Consult wth the suppler of the solder and flux for recommended cleanng solvents. Cleaners must be free of dssolved flux and other contamnants. It s recommended cleanng wth the pc board on ts edge. If usng an aqueous cleaner, standard equpment such as a soak--tank or an automatc n--lne machne should be used. The followng s a lst of common cleanng solvents that wll not affect the swtches for the tme and temperature specfed. See Fgure 6. CAUTION! DANGER Vapor cleanng (wth the pc board on edge) s preferred over submerson n a lqud cleaner. Unsealed swtches should not be submerged due to contamnants n the cleanng bath. Do NOT ultrasoncally clean swtches sealed wth tape or maskng materal. Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Refer to the manufacturer s Materal Safety Data Sheet (MSDS) for characterstcs and handlng of cleaners. Trchloroethylene and Methylene Chlorde s not recommended because of harmful occupatonal and envronmental effects. Both are carcnogenc (cancer -causng). If you have a partcular solvent that s not lsted, contact PRODUCT INFORMATION at the number at the bottom of page 1. Rev D 5 of 7

6 NAME CLEANER TIME TEMPERATURE TYPE (Mnutes) (Maxmum) ALPHA 2110 Aqueous 1 BIOACT EC -7 Solvent 5 100_C [212_F] ButylCARBITOLSolvent Solvent 1 Ambent Room Isopropyl Alcohol Solvent 5 KESTER 5778 Aqueous 5 KESTER 5779 Aqueous 5 LONCOTERGE 520 Aqueous 5 LONCOTERGE 530 Aqueous 5 Terpene Solvent Solvent 5 D. Dryng Fgure 6 100_C [212_F] When dryng cleaned unsealed assembles and pc boards, make certan that the housng temperature does not exceed 130_C [270_F]. Excessve temperatures may cause housng degradaton. When processng the economy sealant, make certan that the sealant temperature does not exceed 100_C [212_F] for 1 mnute. Ths s a hot melt sealant and wll reflow Checkng Installed Swtches The solder tal must be through ts ntended hole n the pc board. Solder fllet must be evenly formed around each solder tal. The housng of the swtch must be seated on the pc board not exceedng the dmenson gven n Fgure Removal and Repar Damaged or defectve swtches must NOT be used and should be replaced. The swtches must be removed from the pc board by standard de--solderng methods. CAUTION! When removng or replacng swtches, care must be taken not to damage other pc board components durng the de -solderng process. 4. QUALIFICATIONS DIP programmng swtches are not requred to be agency approved. 5. TOOLING No toolng s requred for manual placement of these swtches; however, a pc board support that provdes relef for protrudng components must be used to prevent deformaton of contact tals. The pc board support must be custom made. See Fgure 7. PC Board Support (Customer Suppled) Holes (Ref) Channel (Ref) Fgure 7 ALPHA, BIOACT, CARBITOL, KESTER, and LONCOTERGE are trademarks of ther respectve owners. 6 of 7 Rev D

7 6. VISUAL AID Fgure 8 shows a typcal applcaton of DIP programmng swtches. Ths llustraton should be used by producton personnel to ensure a correctly appled product. Applcatons whch DO NOT appear correct should be nspected usng the nformaton n the precedng pages of ths specfcaton and n the nstructonal materal shpped wth the product or toolng. SOLDERED SWITCH THEREMUSTBENO CRACKS IN SOLDER REMOVABLE SWITCH SWITCH MUST BE BOTTOMED ON SOCKET SWITCH MUST BE VISUALLY BOTTOMED ON PC BOARD SWITCH HOUSINGS MUST NOT BE DAMAGED IN ANY WAY FIGURE 8. VISUAL AID Rev D 7 of 7