1.0 mm Free Height (FH) Plug. Surface Mount Technology (SMT) 27 JUN 11 Rev D

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1 1.0 mm Free Heght (FH) Plug Applcaton Specfcaton and Receptacle Connectors Usng Surface Mount Technology (SMT) 27 JUN 11 All numercal values are n metrc unts [wth U.S. customary unts n brackets]. Dmensons are n mllmeters [and nches]. Unless otherwse specfed, dmensons have a tolerance of ±0.13 [±.005] and angles have a tolerance of ±2. Fgures and llustratons are for dentfcaton only and are not drawn to scale. 1. INTRODUCTION Ths specfcaton covers the requrement for applcaton of 1.0 mm FH Plug and Receptacle Connectors for surface mount prnted crcut (pc) board applcatons. These plug and receptacle connectors have solder tnes spaced on 1 mm [.039 n.] centers and are avalable n (IEEE Standard) 64- or optonal 84-poston versons. The connectors can be postoned by hand or by robotc equpment and are desgned for board stackng applcatons that have 8 stackng heghts from 8.0 mm [.315 n.] to 15.0 mm [.591 n.]. When correspondng wth personnel, use the termnology provded n ths specfcaton to facltate your nqures for nformaton. Basc terms and features of ths product are provded n Fgure 1. Algnment Posts Receptacle Connector Vacuum Cover Standard 64-Poston or Optonal 84-Poston Solder Tnes Plug Connector Solder Tnes Fgure 1 2. REFERENCE MATERIAL 2.1. Revson Summary Ths paragraph s reserved for a revson summary coverng the most recent addtons and changes made to ths specfcaton. Most recently, the comany logo was changed, The new company logo s reflected on ths specfcaton : 2.2. Customer Assstance Reference Part Number and Product Code 6537 are representatve numbers of 1.0 mm FH Plug and Receptacle Connectors. Use of these numbers wll dentfy the product lne and expedte your nqures through a servce network establshed to help you obtan product nformaton. Such nformaton can be obtaned through a local Tyco Electroncs Representatve or, after purchase, by callng the Toolng Assstance Center or the Product Informaton Center number at the bottom of ths page Tyco Electroncs Corporaton, a TE Connectvty Ltd. Company All Rghts Reserved *Trademark TOOLING ASSISTANCE CENTER PRODUCT INFORMATION Ths controlled document s subject to change. For latest revson and Regonal Customer Servce, vst our webste at TE Connectvty, TE connectvty (logo), and TE (logo) are trademarks. Other logos, product and/or Company names may be trademarks of ther respectve owners. 1 of 13 LOC B

2 2.3. Drawngs Customer drawngs for each connector are avalable from the servce network. The nformaton contaned n customer drawngs takes prorty f there s a conflct wth ths specfcaton or wth any techncal documentaton suppled by TE Agency Specfcatons EIA , EIA-700AAAB, and IEEE 1386 provde requrements and evaluaton methods Manuals Manual s avalable upon request and can be used as a gude n solderng. Ths manual provdes nformaton on varous flux types and characterstcs along wth the commercal desgnaton and flux removal procedures. A checklst s attached to the manual as a gude for nformaton on solderng problems. 3. REQUIREMENTS 3.1. Storage A. Ultravolet Lght Prolonged exposure to ultravolet lght may deterorate the chemcal composton used n the connector housng materal. B. Shelf Lfe Connectors are packaged and shpped on reels nsde EIA-481 carrer tape. To prevent damage to the housngs and contacts, the connectors should reman n the contaner untl ready for nstallaton. Also, to prevent possble storage contamnaton and ensure maxmum solderablty for SMT solder tnes, the connectors should be used on a frst n, frst out bass. C. Chemcal Exposure Do not store connectors near any chemcal lsted below as they may cause stress corroson cracks n the contacts. Alkales Ammona Ctrates Phosphates Ctrates Sulfur Compounds Amnes Carbonates Ntrtes Sulfur Ntrtes Tartrates 3.2. Product Materals FH Connector Housngs are constructed of hgh temperature thermoplastc - Lqud Crystal Polymer, UL94V-0. The plug and receptacle contacts are made of phosphor bronze wth the matng nterface of the contacts underplated wth nckel and fnshed wth gold platng. The solder tnes have 93/7 matte tn-lead platng Crcut Identfcaton 1.0 mm FH Plug and Receptacle Connectors are not polarzed wth respect to ether the X or Y axs, and therefore pn 1 locaton s arbtrary. Pn layout s to be establshed by the OEM Spacng A. Connector Algnment Connectors can be placed n close proxmty to each other on the pc board. The dmensons provded do NOT nclude space needed for other pc board components or robotc toolng. Check spacng requrements for other components before makng your placement layout on the pc board. Fgure 2 provdes recommended placement varatons to ensure vertcal board-to-board plug and receptacle matng and unmatng. CAUTION! Careful consderaton to the tolerances must be observed when more than one connector par s to be used between pc boards. Tolerance buld-up on the pc board n conjuncton wth the tolerances assocated wth placng the connectors could cause a stress load on the solder jonts whch could affect ther relablty. Consult Tyco Electroncs Engneerng by callng one of the telephone numbers at the bottom of page 1. B. Board Stackng Heghts Board stackng heghts for the 1.0 mm FH Connectors are provded n Fgure 3. 2 of 13

3 The dmenson provded does not nclude the paste thckness between the solder tnes and solder pads of both connectors. Mnmum Between Adjacent Pad Patterns to be Determned by Customer Requrements for Solder Jont Inspecton 6.20 [.244] Mnmum Between Pad Centers Fgure 2 The system should be desgned wth support for the pc boards to mnmze stress on the solder tnes of surfacemounted connectors. CAUTION! The dstance between pc boards wll be determned by the dmenson needed for fully mated connectors as provded n Fgure 3. However, we emphasze that the connectors MUST NOT be used as the only standoff between pc boards. Fgure 3 3 of 13

4 3.5. Prnted Crcut Boards for SMT Connectors A. Tolerance At the tme of connector placement, the coplanarty of the pad pattern must be held to 0.05 mm [.002 n.] maxmum. We recommend a solder mask to mnmze solder brdgng between pads. The mask must not exceed the heght of the pad by more than 0.05 mm [.002 n.]. Maxmum allowable bow of the pc board shall be 0.10 mm [.004 n.] over the length of the connector. CAUTION! Snce the connector housngs may rest on top of the solder mask, an excessvely hgh mask wll allow too much space between the solder tne and pad for a good solder jont. A solder jont under these condtons would be weak, and would not provde long term performance for the connector. B. Materal and Thckness The pc board materal shall be glass epoxy (FR-4 or G-10). The thckness of the pc board depends on your desgn requrements. Consult TE engneerng for sutablty of other materals. A solder mask s recommended when solderng connectors. Those most sutable are Lqud Photo Imageable and Dry Flm. C. PC Board Layout Recommended pc board patterns for plug and receptacle connectors are provded n Fgure 4. Fgure 4 (Cont d) 4 of 13

5 NUMBER OF POSITIONS A Fgure 4 (End) DIMENSIONS Standard [1.220] 34.4 [1.354] Optonal [1.614] 44.4 [1.748] D 5 of 13

6 3.6. Processng The pc boards must be solderable n accordance wth EIA A. Typcal Solder Paste Characterstcs 1) Alloy type shall be ether 63 Sn/37 Pb or 60 Sn/40 Pb. 2) Flux shall be RMA type. B. Solder Volume Solder volume for each component shall be: Plug mm3 [ n3] max mm3 [ n3] mn per contact Receptacle mm3 [ n3] max mm3 [ n3] mn per contact Solder volume may vary dependng on solder paste composton. C. Stencl Stencl aperture wll be determned by the thckness of the stencl beng used. Generally, the thnner stencls wll have a larger aperture to mantan a gven volume of solder paste. Solder deposton should be wthn the pad area of the contact solder tnes. Typcal aperture openngs and locaton of solder dsposton are provded n Fgure 5. CAUTION All traces must be covered by solder mask n the solder depost area. Vas (non-component nterlayer connecton holes) must be adequately spaced from pads and separated by solder mask to avod coverage by solder paste deposts.! Exposed traces could cause brdgng and create a short, or wck solder away from the solder tnes, producng a weak solder jont. Stencl Plug Nomnal Pad Sze 0.6 x 2.7 [.024 x.106] Stencl 64-Poston 84-Poston Thckness A B E F E F 0.1 [.004] 0.8 [.032] 3.5 [.139] 0.15 [.006] 0.7 [.028] 2.8 [.110] [.008] 0.6 [.024] 2.5 [.098] Fgure 5 (Cont d) 6 of 13

7 Stencl Nomnal Pad Sze Stencl 64-Poston 84-Poston Thckness A B E F E F 0.1 [.004] 0.8 [.032] 3.1 [.122] Receptacle D. Solder Mask 0.15 [.006] 0.7 [.028] 2.7 [.106] 0.2 [.008] 0.6 [.024] 2.1 [.083] Fgure 5 (End) Solder mask s recommended between all pads. If a trace s run between adjacent pads on the solder sde of the pc board, a solder mask must be appled over the trace to prevent brdgng and wckng of solder away from the contact solder tnes. Lqud photo mageable or dry flm solder masks are recommended Connector Placement Connectors are on tape reels and should be placed drectly from the package to the pc board. We do NOT recommend emptyng them from the package nto ples or n bowl feeders pror to placement. Connectors can be placed on the pc board by hand by grppng the connector at the ends of the housng wthout touchng the contacts. Ths procedure wll prevent contamnaton and deformaton of the solder tnes. They can also be postoned wth robotc equpment usng vacuum pckup or robotc grppers. Care must be taken durng postonng of the connectors on the pc board so as to not exceed the allowable msalgnment absorpton, as recommended by the EIA-700AAAB specfcaton. See Fgure 6Fgure 6. Values gven are for the mated par, and not for each connector. Ths requres each connector to be located wthn +0.07mm [.003 n.] of nomnal center. Optmally, the connector solder tnes should be centered on the pc board pads. However, slght msregstraton s permssble as long as the entre solder tne s on the pad wth no overhang. See Fgure 7. 7 of 13

8 Fgure 6 Connector Solder Tne Optmum Condton (Solder Tne Centered on Crcut Pad) PC Board PC Board Pad Solder Tne Must NOT be Off Crcut Pad Fgure 7 A. Solderng Manual provdes some gudelnes for establshng solderng practces. 1) Fluxng -- The contact solder tnes and, f applcable, attachng hardware must be fluxed pror to solderng wth a mldly actve, rosn base flux. Selecton of the flux wll depend on the type of pc board and other components mounted on the board. Addtonally, the flux must be compatble wth the wave solder lne, manufacturng, health, and safety requrements. Call the Product Informaton number at the bottom of page 1 for consderaton of other types of flux. Some fluxes that are compatble wth these connectors are provded n Fgure 8. 8 of 13

9 FLUX TYPE ACTIVITY RESIDUE COMMERCIAL DESIGNATION KESTER ALHA Type RMA (Mldly Actvated) Mld Noncorrosve 185/ Center (Actvated) Medum May be Corrosve 1544, 1545, , 809, 811 KESTER and ALPHA are trademarks. Fgure 8 2) Parameters -- The connectors wll wthstand temperatures of 230 C [446 F] for a maxmum of three mnutes. Hgher temperatures can be wthstood for short perods of tme. However, the actual connector temperature should not exceed 250 C [482 F] for more than 15 seconds, wth a maxmum temperature of 255 C [491 F]. Refer to the recommendatons provded n Fgure 9 for typcal nfrared (IR) reflow oven settngs. Due to the many varables nvolved wth the reflow process (e, component densty, orentaton, etc), we recommend that the user conduct tral runs under actual manufacturng condtons to ensure product and process compatblty. PREHEAT 350 C [662 F] ZONE 1 ZONE 2 ZONE 3 Top Heater 285 C [545 F] 265 C [509 F] 310 C [590 F] Bottom Heater 285 C [545 F] 265 C [509 F] 310 C [590 F] Fgure 9 3) Technques -- It s recommended that the connector be soldered usng convecton, vapor phase (VPR), double sded non-focused nfrared (IR), or equvalent solderng technque provded the temperatures and exposure tme are wthn the ranges specfed n Fgure 10. Hgher temperatures can be wthstood for short perods of tme as ndcated n Fgure 9 for the IR reflow. TE recommends usng a Corpane Batch Vapor Phase{ (Model VVP 10 BU) and Vtroncs IR} (Model SMD 718) equpment. Fgure 10 4) Reflow Parameters -- Due to the many varables nvolved wth the reflow process (e, component densty, orentaton, etc), we recommend that the user conduct tral runs under actual manufacturng condtons to ensure product and process compatblty. B. Cleanng SOLDERING PROCESS TEMPERATURE TIME (At Max Temp) CELSIUS FAHRENHEIT Vapor Phase Solderng Mnutes Infrared Reflow Solderng Mnutes Convecton Mnutes After solderng, removal of fluxes, resdues, and actvators s necessary. Consult wth the suppler of the solder paste and flux for recommended cleanng solvents. The followng s a lstng of common cleanng solvents that wll not affect the connectors. The connectors wll be unaffected by any of these solvents for 5 mnutes at 105 C [221 F]. See Fgure 11. Cleaners must be free of dssolved flux and other contamnants. We recommend cleanng wth the pc board on ts edge. If usng an aqueous cleaner, we recommend standard equpment such as a soak-tank or an automatc n-lne machne 9 of 13

10 CAUTION! Even when usng "no clean" solder paste, t s mperatve that the contact nterface be kept clean of flux and resdue, snce t acts as an nsulator. Flux may mgrate under certan condtons wth elevated temperatures and, therefore, cleanng s necessary even wth "no clean" paste. NAME CLEANER TYPE ALPHA, BIOACT, CARBITOL, LONCOTERGE, and KESTER are trademarks of ther respectve owners. Fgure 11 DANGER STOP TIME (Mnutes) TEMPERATURE (Maxmum) ALPHA 2110 Aqueous C [270 F] BIOACT EC-7 Solvent C [212 F] Butyl CARBITOL Solvent 1 Ambent Room Isopropyl Alcohol KESTER 5778 KESTER 5779 LONCOTERGE 520 LONCOTERGE 530 Terpene Solvent Aqueous Aqueous Aqueous Aqueous Solvent C [212 F] Consderaton must be gven to toxcty and other safety requrements recommended by the solvent manufacturer. Trchloroethylene and Methylene Chlorde can be used wth no harmful affect to the connectors; however, TE does not recommend them because of the harmful occupatonal and envronmental effects. Both are carcnogenc (cancer-causng) and Trchloroethylene s harmful to the earth's ozone layer. If you have a partcular solvent that s not lsted, contact the Product Informaton number at the bottom of page 1. C. Dryng Ar dryng of cleaned connectors s recommended. Temperature for the connectors should not exceed -55 to 105 C [-67 to 221 F]. Degradaton of the housngs could result from extreme temperatures. D. Checkng Installed Connector All solder jonts should conform to those specfed n Workmanshp Specfcaton The housng must seat on the pc board to wthn the tolerance provded n Fgure 12. Fgure of 13

11 E. Matng/Unmatng Connectors CAUTION! The use of uneven or off-angle forces durng matng and unmatng of the connectors could cause overstress and damage to the contacts and/or housngs. Usng the "peel-back" method of unmatng one end and pullng t untl the other end s unmated s permssble. Do NOT use a severe sde-to-sde rockng moton to unmate connectors. Connectors must be pushed straght n when matng and pulled straght out when unmatng. A slght end-toend moton may be used to start extracton, but t must not contnue through full extracton cycle. Fgure 13 The angles of 5 and 8 n Fgure 13 are specfed as 3 and 1.5 respectvely per EIA-700AAAB, and ths should be consdered f matng TE connectors wth any other manufacturers' connectors. Mnaturzaton s a desgn feature of these connectors and the systems n whch they are used. Component densty, connector locaton, and pc board sze may make t dffcult to remove the connector. Two methods are recommended to facltate removal. If unmatng board-to-board connectors, the preferred method s to have one of the pc boards securely fastened and adequately supported to wthstand the pullng force appled to the other pc board. The second method s to construct a tool for your system desgn that wll produce a straght-away separaton of the connectors. See Fgure Repar/Removal Connectors may be removed from the pc board by standard de-solderng methods. Damaged connectors must be replaced. 11 of 13

12 4. QUALIFICATIONS 1.0 mm FH Plug and Receptacle Connectors are Lsted by Underwrters Laboratores Inc. (UL) n Fle No. E28476 and Certfed by CSA Internatonal n Fle No. LR7189A TOOLING We recommend that you contact a relable robotc equpment desgner for assstance n developng equpment that meets your specfc applcaton requrements. The equpment must have a placement poston accuracy tolerance of ±0.05 mm [±.002 n.] to properly locate the connector for placement. Ths ncludes grpper and fxture tolerances as well as equpment repeatablty. It must use the connector datum surfaces detaled on the Customer Drawng for the connector beng used to ensure relable placement of the connector. The equpment feed mechansm must be compatble wth the connector shppng contaners. See shppng contaners shown n Fgure 14. Shppng Contaners Cover Robotc Equpment (Contact Robotc Desgner) Carrer Strp Fgure of 13

13 6. VISUAL AID Fgure 15 shows a typcal applcaton of 1.0 mm FH Plug and Receptacle Connectors. Ths llustraton should be used by producton personnel to vsually ensure sutable applcatons. Installatons whch appear vsually ncorrect should be nspected usng the dmensonal nformaton gven n the precedng pages of ths applcaton specfcaton. FIGURE 15. VISUAL AID 13 of 13