Maskrom Auto Fail Bitmap Monitoring Algorithm & Applied Effect in Mass Product
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1 Maskrom Auto Fail Bitmap Monitoring Algorithm & Applied Effect in Mass Product Dong Seog Chae Jun Samsung Electronics Dong Seog Chae SWTW Slide 1
2 Auto Fail BitMap Monitoring Method Agenda Purpose of Auto Fail BitMap Setup In Mass Product BitMap Analysis and Monitoring Method Fail Bit Analysis Result Applied Effect Dong Seog Chae SWTW Slide 2
3 Purpose of Auto Fail Bitmap Setup In Mass Product For maintain Static Device Yield. Rapid feedback to FAB about device main fail type. Decision of New Repair Scheme. Save the manufacturing cost. Dong Seog Chae SWTW Slide 3
4 BitMap Analysis and Monitoring Method Assortment target wafer Test Start Full Test Item Complete Every 5th Wafer N Redunduncy BitMap routine Start Binning Decision Dong Seog Chae SWTW Slide 4
5 BitMap Analysis and Monitoring Method Flow Chart B it M a p S t a r t Fail Address Count & Fail Address Scan Address Store Exist Fail N Routine Out User scramble Physical Scramble Fail Address Store User Scram ble æ B it M a p S c r a m b le Construct Count T able Fail type extract Store to Global DB Fail Types Extract G e n e rate D ata fo r M ac s s y s te m F u ll C h ip T e s t Y G e n e rate ro w d ata & Dong Seog Chae SWTW Slide 5
6 Fail Type Definition Fail Type Gate Oxide BN+ Open Contact Not Open Bit Line Fail Wore Line Fail Single Bit Fail Definition Data 0 Fail / Less Than 1 String (0x1F) More Than 5 Address Fail Bit Data 1 Fail / Less than 1 String (0x1F) More than 5 Address Fail Bit Data 1 Fail / Between 1 ~ 2 String Fail (0x20~0x3F) More than10 Address Fail Bit Data 0 or 1 Fail / More than 2 String(0x20) More than 30 Address Fail Bit More than 30 Address Fail Bit at X Address Only 1 or 2 Fail Address Fail Bit Dong Seog Chae SWTW Slide 6
7 Fail Bit Analysis Result (Fail Type/Per Chip) LotID WaferID X,Y FAILBIT GOX BN+ CON WL XDEC BL SINGLE BMWG2828 W01 37, BMWG2828 W01 38, BMWG2828 W01 39, BMWG2828 W01 38, BMWG2828 W01 29, BMWG2828 W01 30, BMWG2828 W01 29, BMWG2828 W01 30, BMWG2828 W01 35, BMWG2828 W01 36, Dong Seog Chae SWTW Slide 7
8 Fail Bit Analysis Result (Raw Data of Fail/Per Chip) Chip Inform Fail Type Fail Addr X: 0030 Y: 0030 FAILBIT: 232 GOX: 1 BN+: 0 CONATCT: 0 WORDLINE: 1 XDECODER:0 BITLINE: 0 SINGLE: 0 Xadd Yadd FailIO FailData Fail Pattern ============================================= 282 3A6 8 0 GOX 287 3A A A A 3A6 8 0 Dong Seog Chae SWTW Slide 8
9 Applied Effect (Visual Inspection) W/L Bridge Gate Oxide String Repair Dong Seog Chae SWTW Slide 9
10 Applied Effect (Fail Trend Plot) Dong Seog Chae SWTW Slide 10 B0 1 B0 1 B0 8 B0 9 B1 1 B1 2 B2 1 B2 2 B2 6 B2 6 B2 6 B2 6 B2 8 B3 4 B3 4 B3 4 C1 2 C1 4 C2 4 Lot No GOX BN+ Cont W/ L B/ L X- d e c Si ngl e Fai l Count
11 Hit Ratio (MS3490 & BitMap Analysis) Fail Types Exist Tool MS-3490 BitMap Tool (GII) Hit Ratio Gate Oxide BN+ Open Contact Not Open Bit Line Word Line Single Bit Other Total Dong Seog Chae SWTW Slide 11
12 Derivation (Repair Scheme) MaskRom Repair Scheme Change (8 Bit Repair -> 8 String Repair) Fail Type Change (Extract Data from BitMap Algorithm) Fai l Type GOX St ri ng Fai l B/ N+ Ac t i v e Br i dg e W/L B/ L Bi t Other NAND Ce l l Nor Ce l l Dong Seog Chae SWTW Slide 12
13 Cell Scheme Change Nand Cell Nor Cell BL<0> BL<1> BL<0> GL<0> SSL<0> SSL<0> SSL<1> SSL<1> WL<0> WL<0> WL<1> WL<1> WL<30> WL<31> WL<14> GSL<0> WL<15> GSL<1> Dong Seog Chae SWTW Slide 13
14 Limitation of 8 Bit Repair Fail type Change(String Fail)-> Decrease Repair rate -NAND Cell : 75% - FLAT Cell : Less than 5% Dong Seog Chae SWTW Slide 14
15 Number of Fuse (String Red vs Bit Red) String 5String Z = String Repair Bit Repair Scheme 400 4String Z: Fuse No for String/Bit Repair Fus Bit 3String 2String α:string Add Fuse + I/O Fuse 100 1String N: Number of Fail String Number of Fail Bit (EA) n: Number of Fail Bit Dong Seog Chae SWTW Slide 15
16 String Repair Algorithm Flow Chart St ar t Check ECR De Sc r a mb l e Sor t Dat a Ana l Fa i l u_act i ve( dut ) Y DBM Dat acat ch N Re l a y Op e n ECR Dat acat ch Fi nal Dat aext Pas s / Fai l Dong Seog Chae SWTW Slide 16
17 String Redundancy using ratio (64M X 16 B-Die) (Normal YLD & Low YLD) Normal YLD Low YLD % % % % string bi t st r i ng+bi t string bi t string+bi t Dong Seog Chae SWTW Slide 17
18 Derivation(Repair Scheme) Normal YLD Abnormal YLD 30 Repair Portion Yield RepairPortion Yield Rep String Repair 16M E 16M F 32M E 64M B 64M C 128M A Bit Repair 64M A 128M M Rep Yie String Repair Bit Repair 32M E 64M B 64M C 64M A 128M M Yie Dong Seog Chae SWTW Slide 18
19 Results Average YLD Up (15% Up -> Repair Portion elevation) Obtained the static objected Data & Utilize at anytime. Real Time Fail Analysis & Feed Back. Customer order meets(an Order Product) (Possible to forecast device yield) Dong Seog Chae SWTW Slide 19
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