256K 8 CMOS FLASH MEMORY
|
|
- Giles Cross
- 6 years ago
- Views:
Transcription
1 GENERL DESCRIPTION 256K 8 CMOS FLSH MEMORY The W29C020C is a 2-megabit, 5-volt only CMOS flash memory organized as 256K 8 bits. The device can be written (erased and programmed) in-system with a standard 5V power supply. 2-volt VPP is not required. The unique cell architecture of the W29C020C results in fast write (erase/program) operations with extremely low current consumption compared other comparable 5-volt flash memory products. The device can also be written (erased and programmed) by using standard EPROM programmers. FETURES Single 5-volt write (erase and program) operations Fast page-write operations 28 bytes per page Page write (erase/program) cycle: 0 ms (max.) Effective byte-write (erase/program) cycle time: 39 µs Optional software-protected data write Fast chip-erase operation: 50 ms Two 8 KB boot blocks with lockout Whole chip cycling: 0K (typ.) Read access time: 70/90/20 ns Twenty-year data retention Software and hardware data protection Low power consumption ctive current: 25 m (typ.) Standby current: 20 µ (typ.) umatic write (erase/program) timing with internal VPP generation End of write (erase/program) detection Toggle bit Data polling Latched address and data ll inputs and outputs directly TTL compatible JEDEC standard byte-wide pinouts vailable packages: 32-pin 600 mil DIP, 32-pin TSOP, and 32-pin PLCC Publication Release Date: February 8, Revision 4
2 PIN CONFIGURTIONS BLOCK DIGRM NC pin DIP VDD VDD VSS CONTROL OUTPUT BUFFER DQ0.. DQ DQ7 DQ0 DQ DQ2 GND N C V # D W D E 7 30 DQ6 DQ5 DQ4 DQ DECODER 8K Byte Boot Block (Optional) CORE RRY 8K Byte Boot Block (Optional) VDD NC DQ pin PLCC D Q D Q2 G ND D Q3 D Q4 D Q5 D Q pin DQ7 DQ6 DQ5 DQ4 DQ3 9 TSOP 24 GND 0 23 DQ2 22 DQ 2 2 DQ DQ PIN DESCRIPTION SYMBOL PIN NME 0 7 ddress Inputs DQ0 DQ7 Data Inputs/Outputs Chip Enable Output Enable Write Enable VDD Power Supply GND Ground NC No Connection - 2 -
3 FUNCTIONL DESCRIPTION Read Mode The read operation of the W29C020C is controlled by and, both of which have be low for the host obtain data from the outputs. is used for device selection. When is high, the chip is de-selected and only standby power will be consumed. is the output control and is used gate data from the output pins. The data bus is in high impedance state when either or is high. Refer the read cycle timing waveforms for further details. Page Write Mode The W29C020C is written (erased/programmed) on a page basis. Every page contains 28 bytes of data. If a byte of data within a page is be changed, data for the entire page must be loaded in the device. ny byte that is not loaded will be erased "FF hex" during the write operation of the page. The write operation is initiated by forcing and low and high. The write procedure consists of two steps. Step is the byte-load cycle, in which the host writes the page buffer of the device. Step 2 is an internal write (erase/program) cycle, during which the data in the page buffers are simultaneously written in the memory array for non-volatile srage. During the byte-load cycle, the addresses are latched by the falling edge of either or, whichever occurs last. The data are latched by the rising edge of either or, whichever occurs first. If the host loads a second byte in the page buffer within a byte-load cycle time (TBLC) of 200 µs after the initial byte-load cycle, the W29C020C will stay in the page load cycle. dditional bytes can then be loaded consecutively. The page load cycle will be terminated and the internal write (erase/program) cycle will start if no additional byte is loaded in the page buffer 7 7 specify the page address. ll bytes that are loaded in the page buffer must have the same page address. 0 6 specify the byte address within the page. The bytes may be loaded in any order; sequential loading is not required. In the internal write cycle, all data in the page buffers, i.e., 28 bytes of data, are written simultaneously in the memory array. Before the completion of the internal write cycle, the host is free perform other tasks such as fetching data from other locations in the system prepare write the next page. Software-protected Data Write The device provides a JEDEC-approved optional software-protected data write. Once this scheme is enabled, any write operation requires a three-byte command sequence (with specific data a specific address) be performed before the data load operation. The three-byte load command sequence begins the page load cycle, without which the write operation will not be activated. This write scheme provides optimal protection against inadvertent write cycles, such as cycles triggered by noise during system power-up and power-down. The W29C020C is shipped with the software data protection enabled. To enable the software data protection scheme, perform the three-byte command cycle at the beginning of a page load cycle. The device will then enter the software data protection mode, and any subsequent write operation must be preceded by the three-byte command sequence cycle. Once enabled, the software data protection will remain enabled unless the disable commands are issued. power transition will not reset the software data protection feature. To reset the device unprotected mode, a six-byte command sequence is required. For information about specific codes, see the Command Codes for Software Data Protection in the Table of Operating Modes. For information about timing waveforms, see the timing diagrams below. Publication Release Date: February 8, Revision 4
4 Hardware Data Protection The integrity of the data sred in the W29C020C is also hardware protected in the following ways: () Noise/Glitch Protection: pulse of less than 5 ns in duration will not initiate a write cycle. (2) VDD Power Up/Down Detection: The write and read operation are inhibited when VDD is less than 2.5V. (3) Write Inhibit Mode: Forcing low, high, or high will inhibit the write operation. This prevents inadvertent writes during power-up or power-down periods. (4) VDD power-on delay: When VDD reaches its sense level, the device will aumatically timeout for 5 ms before any write (erase/program) operation. Chip Erase Modes The entire device can be erased by using a six-byte software command code. See the Software Chip Erase Timing Diagram. Boot Block Operation There are two boot blocks (8K bytes each) in this device, which can be used sre boot code. One of them is located in the first 8K bytes and the other is located in the last 8K bytes of the memory. The first 8K or last 8K of the memory can be set as a boot block by using a seven-byte command sequence. See Command Codes for Boot Block Lockout Enable for the specific code. Once this feature is set the data for the designated block cannot be erased or programmed (programming lockout); other memory locations can be changed by the regular programming method. Once the boot block programming lockout feature is activated, the chip erase function will be disabled. In order detect whether the boot block feature is set on the two 8K blocks, users can perform a six-byte command sequence: enter the product identification mode (see Command Codes for Identification/Boot Block Lockout Detection for specific code), and then read from address "00002 hex" (for the first 8K bytes) or "3FFF2 hex" (for the last 8K bytes). If the output data is "FF hex," the boot block programming lockout feature is activated; if the output data is "FE hex," the lockout feature is deactivated and the block can be programmed. To return normal operation, perform a three-byte command sequence exit the identification mode. For the specific code, see Command Codes for Identification/Boot Block Lockout Detection. Data Polling (DQ7)- Write Status Detection The W29C020C includes a data polling feature indicate the end of a write cycle. When the W29C020C is in the internal write cycle, any attempt read DQ7 from the last byte loaded during the page/byte-load cycle will receive the complement of the true data. Once the write cycle is completed. DQ7 will show the true data. See the Polling Timing Diagram
5 Toggle Bit (DQ6)- Write Status Detection In addition data polling, the W29C020C provides another method for determining the end of a write cycle. During the internal write cycle, any consecutive attempts read DQ6 will produce alternating 0's and 's. When the write cycle is completed, this ggling between 0's and 's will sp. The device is then ready for the next operation. See Toggle Bit Timing Diagram. Product Identification The product ID operation outputs the manufacturer code and device code. The programming equipment aumatically matches the device with its proper erase and programming algorithms. The manufacturer and device codes can be accessed through software or by hardware operation. In the software access mode, a six-byte command sequence can be used access the product ID. read from address "00000 hex" outputs the manufacturer code "D hex." read from address "0000 hex" outputs the device code "45 hex." The product ID operation can be terminated by a three-byte command sequence. In the hardware access mode, access the product ID is activated by forcing and low, high, and raising 9 2 volts. Note: The hardware SID read function is not included in all parts; please refer Ordering Information for details. TBLE OF OPERTING MODES Operating Mode Selection Operating Range: 0 70 C (mbient Temperature), VDD = 5V ±0 %, VSS = 0V, VHH = 2V MODE PINS DDRESS DQ. Read VIL VIL VIH IN Dout Write VIL VIH VIL IN Din Standby VIH X X X High Z Write Inhibit X VIL X X High Z/DOUT X X VIH X High Z/DOUT Output Disable X VIH X X High Z 5-Volt Software Chip Erase VIL VIH VIL IN DIN Product ID VIL VIL VIH 0 = VIL; 7 = VIL; 9 = VHH VIL VIL VIH 0 = VIH; 7 = VIL; 9 = VHH Manufacturer Code D (Hex) Device Code 45 (Hex) Publication Release Date: February 8, Revision 4
6 Command Codes for Software Data Protection BYTE SEQUENCE TO ENBLE PROTECTION TO DISBLE PROTECTION DDRESS DT DDRESS DT 0 Write 5555H H 5555H H Write 2H 55H 2H 55H 2 Write 5555H 0H 5555H 80H 3 Write H H 4 Write - - 2H 55H 5 Write H 20H Software Data Protection cquisition Flow Software Data Protection Enable Flow Software Data Protection Disable Flow Load data Load data address 2 address 2 Load data 0 Load data 80 (Optional page-load operation) Sequentially load up 28 bytes of page data Load data Pause 0 ms address 2 Exit Load data 20 Pause 0 ms Exit Notes for software program code: Data Format: DQ7 DQ0 (Hex) ddress Format: 4 0 (Hex) - 6 -
7 Command Codes for Software Chip Erase BYTE SEQUENCE DDRESS DT 0 Write 5555H H Write 2H 55H 2 Write 5555H 80H 3 Write 5555H H 4 Write 2H 55H 5 Write 5555H 0H Software Chip Erase cquisition Flow Load data address 2 Load data 80 Load data address 2 Load data 0 Pause 50 ms Exit Notes for software chip erase: Data Format: DQ7 DQ0 (Hex) ddress Format: 4 0 (Hex) Publication Release Date: February 8, Revision 4
8 Command Codes for Product Identification and Boot Block Lockout Detection BYTE SEQUENCE LTERNTE PRODUCT (7) IDENTIFICTION/BOOT BLOCK LOCKOUT DETECTION ENTRY SOFTWRE PRODUCT IDENTIFICTION/BOOT BLOCK LOCKOUT DETECTION ENTRY SOFTWRE PRODUCT IDENTIFICTION/BOOT BLOCK LOCKOUT DETECTION EXIT DDRESS DT DDRESS DT DDRESS DT 0 Write H H 5555H H Write H 55H 2H 55H 2 Write H 80H 5555H F0H 3 Write H H Write - - 2H 55H Write H 60H - - Pause 0 µs Pause 0 µs Pause 0 µs Software Product Identification and Boot Block Lockout Detection cquisition Flow Product Identification Entry () Load data Product Identification and Boot Block Lockout Detection Mode (3) Product Identification Exit () address 2 Read address = data = D (2) Load data Load data 80 Read address = 0000 data = 45 (2) address 2 Load data Read address = data = FF/FE (4) Load data F0 address 2 Read address = 3FFF2 data = FF/FE (5) Pause 0 µ S Load data 60 Normal Mode (6) Pause 0 µ S Notes for software product identification/boot block lockout detection: () Data Format: DQ7 DQ0 (Hex); ddress Format: 4 0 (Hex) (2) 6 = VIL; manufacture code is read for 0 = VIL; device code is read for 0 = VIH. (3) The device does not remain in identification and boot block (address 0002 Hex/3FFF2 Hex respond first 8K/last 8K) lockout detection mode if power down. (4), (5) If the output data is "FF Hex," the boot block programming lockout feature is activated; if the output data "FE Hex," the lockout feature is inactivated and the block can be programmed. (6) The device returns standard operation mode. (7) This product supports both the JEDEC standard 3 byte command code sequence and original 6 byte command code sequence. For new designs, Winbond recommends that the 3 byte command code sequence be used
9 Command Codes for Boot Block Lockout Enable BYTE SEQUENCE BOOT BLOCK LOCKOUT FETURE SET ON FIRST 8K DDRESS BOOT BLOCK BOOT BLOCK LOCKOUT FETURE SET ON LST 8K DDRESS BOOT BLOCK DDRESS DT DDRESS DT 0 Write 5555H H 5555H H Write 2H 55H 2H 55H 2 Write 5555H 80H 5555H 80H 3 Write 5555H H 5555H H 4 Write 2H 55H 2H 55H 5 Write 5555H 40H 5555H 40H 6 Write 00000H 00H 3FFFFH FFH Pause 0 µs Pause 0 µs Boot Block Lockout Enable cquisition Flow Boot Block Lockout Feature Set on First 8K ddress Boot Block Load data Boot Block Lockout Feature Set on Last 8K ddress Boot Block Load data address 2 address 2 Load data 80 Load data 80 Load data Load data address 2 address 2 Load data 40 Load data 40 Load data 00 address Load data FF address 3FFFF Pause 0 ms Pause 0 ms Notes for boot block lockout enable:. Data Format: DQ7 DQ0 (Hex) 2. ddress Format: 4 0 (Hex) 3. If you have any questions about this commend sequence, please contact the local distribur or Winbond Electronics Corp. Publication Release Date: February 8, Revision 4
10 DC CHRCTERISTICS bsolute Maximum Ratings PRMETER RTING UNIT Power Supply Voltage VSS Potential V Operating Temperature C Srage Temperature C D.C. Voltage on ny Pin Ground Potential Except VDD +.0 V Transient Voltage (<20 ns) on ny Pin Ground Potential -.0 VDD +.0 V Voltage on 9 and OE Pin Ground Potential V Note: Exposure conditions beyond those listed under bsolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 5.0V ±0%, VSS = 0V, T = 0 70 C) PRMETER SYM. TEST CONDITIONS LIMITS UNIT Power Supply Current Standby VDD Current (TTL input) Standby VDD Current (CMOS input) ICC ISB = = VIL, = VIH, all DQs open ddress inputs = VIL/VIH, at f = 5 MHz = = VIL, = VIH, all DQs open ddress inputs = VIL/VIH, at f = 2 MHz = VIH, all DQs open Other inputs = VIL/VIH MIN. TYP. MX m m ISB2 = VDD -0.3V, all DQs open µ Input Leakage Current ILI VIN = VSS VDD µ Output Leakage Current ILO VIN = VSS VDD µ Input Low Voltage VIL V Input High Voltage VIH V Output Low Voltage VOL IOL = 2.0 m V Output High Voltage VOH IOH = -400 µ V Output High Voltage CMOS VOH2 IOH = -00 µ; VDD = 4.5V V - 0 -
11 Power-up Timing PRMETER SYMBOL TYPICL UNIT Power-up Read Operation TPU. RED 00 µs Power-up Write Operation TPU. WRITE 5 ms CPCITNCE (VDD = 5.0V, T = 25 C, f = MHz) PRMETER SYMBOL CONDITIONS MX. UNIT DQ Pin Capacitance CDQ VDQ = 0V 2 pf Input Pin Capacitance CIN VIN = 0V 6 pf C CHRCTERISTICS C Test Conditions (VDD = 5.0V ±0 % for 90 ns and 20 ns; VDD = 5.0V ±5 % for 70 ns) PRMETER Input Pulse Levels Input Rise/Fall Time Input/Output Timing Level Output Load 0V 3V <5 ns.5v/.5v CONDITIONS TTL Gate and CL = 00 pf for 90/20 ns CL = 30 pf for 70 ns C Test Load and Waveform +5V.8KΩ D OUT 00 pf for 90/20 ns 30 pf for 70 ns (Including Jig and Scope).3KΩ Input Output 3V 0V Test Point.5V.5V Test Point Publication Release Date: February 8, Revision 4
12 C Characteristics, continued Read Cycle Timing Parameters (VDD = 5.0V ±0 % for 90 ns and 20 ns; VDD = 5.0V ±5 % for 70 ns, VSS = 0V, T = 0 70 C) PRMETER SYM. W29C020C-70 W29C020C-90 W29C020C-2 UNIT MIN. MX. MIN. MX. MIN. MX. Read Cycle Time TRC ns Chip Enable ccess Time TCE ns ddress ccess Time T ns Output Enable ccess Time TOE ns High High-Z Output TCHZ ns High High-Z Output TOHZ ns Output Hold from ddress change TOH ns Byte/Page-write Cycle Timing Parameters PRMETER SYMBOL MIN. TYP. MX. UNIT Write Cycle (erase and program) TWC ms ddress Setup Time TS ns ddress Hold Time TH ns and Setup Time TCS ns and Hold Time TCH ns High Setup Time TOES ns High Hold Time TOEH ns Pulse Width TCP ns Pulse Width TWP ns High Width TWPH ns Data Setup Time TDS ns Data Hold Time TDH ns Byte Load Cycle Time TBLC µs Note: ll C timing signals observe the following guideline for determining setup and hold times: Reference level is VIH for high-level signal and VIL for low-level signal
13 C Characteristics, continued #DT Polling Characteristics () PRMETER SYMBOL MIN. TYP. MX. UNIT Data Hold Time TDH ns Hold Time TOEH ns Output Delay (2) TOE ns Write Recovery Time TWR ns Notes: () These parameters are characterized and not 00% tested. (2) See TOE spec in.c. Read Cycle Timing Parameters. Toggle Bit Characteristics () PRMETER SYMBOL MIN. TYP. MX. UNIT Data Hold Time TDH ns Hold Time TOEH ns Output Delay (2) TOE ns High Pulse TOEHP ns Write Recovery Time TWR ns Notes: () These parameters are characterized and not 00% tested. (2) See TOE spec in.c. Read Cycle Timing Parameters. TIMING WVEFORMS Read Cycle Timing Diagram T RC ddress 7-0 TCE TOE VIH T OHZ DQ7-0 High-Z Data Valid TOH Data Valid T CHZ High-Z T Publication Release Date: February 8, Revision 4
14 Timing Waveforms, continued Controlled Write Cycle Timing Diagram T S T H T WC ddress 7-0 T CS T CH T OES T OEH T WP T WPH T DS DQ7-0 Data Valid T DH Internal write starts Controlled Write Cycle Timing Diagram TS TH TWC ddress 7-0 TCP TWPH TOES TOEH TCS TCH DQ7-0 High Z TDS Data Valid TDH Internal Write Starts - 4 -
15 Timing Waveforms, continued Page Write Cycle Timing Diagram TWC ddress 7-0 DQ7-0 TWP T WPH TBLC Byte 0 Byte Byte 2 Byte N- Internal Write Start Byte N #DT Polling Timing Diagram ddress 5-0 TOEH DQ7 TDH TOE HIGH-Z TWR Publication Release Date: February 8, Revision 4
16 Timing Waveforms, continued Toggle Bit Timing Diagram TOEH DQ6 TDH TOE HIGH-Z TWR Page Write Timing Diagram Software Data Protection Mode Three-byte sequence for software data protection mode Byte/page load cycle starts TWC ddress DQ TWP TWPH TBLC SW0 SW SW2 Word 0 Word N- Word N (last word) Internal write starts - 6 -
17 Timing Waveforms, continued Reset Software Data Protection Timing Diagram Six-byte sequence for resetting software data protection mode TWC ddress DQ T WP T WPH TBLC SW0 SW SW2 SW3 SW4 SW5 Internal programming starts Software Chip Erase Timing Diagram Six-byte code for 5V-only software chip erase TWC ddress DQ TWP TWPH T BLC SW0 SW SW2 SW3 SW4 SW5 Internal erasing starts Publication Release Date: February 8, Revision 4
18 ORDERING INFORMTION PRT NO. CCESS TIME (ns) POWER SUPPLY CURRENT MX. (m) STNDBY VDD CURRENT MX. (m) PCKGE CYCLING HRDWRE SID RED FUNCTION W29C020C-70B mil DIP 0K Y W29C020C-90B mil DIP 0K Y W29C020C-2B mil DIP 0K Y W29C020CT70B Type one TSOP 0K Y W29C020CT90B Type one TSOP 0K Y W29C020CT2B Type one TSOP 0K Y W29C020CP70B pin PLCC 0K Y W29C020CP90B pin PLCC 0K Y W29C020CP2B pin PLCC 0K Y W29C020C90BN mil DIP 0K N W29C020C2BN mil DIP 0K N W29C020CT90N Type one TSOP 0K N W29C020CT2N Type one TSOP 0K N W29C020CP90N pin PLCC 0K N W29C020CP2N pin PLCC 0K N Notes:. Winbond reserves the right make changes its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. 3. In Hardware SID Read column: Y = with SID read function; N = without SID read function
19 HOW TO RED THE TOP MRKING Example: The p marking of 32-pin TSOP W29C020CT70B W29C020CT70B OBS st line: Winbond logo 2 nd line: the part number: W29C020CT70B 3 rd line: the lot number 4 th line: the tracking code: 49 O B S 49: Packages made in 0, week 49 O: ssembly house ID: means SE, O means OSE,...etc. B: IC revision; means version, B means version B,...etc. S: Process code Publication Release Date: February 8, Revision 4
20 PCKGE DIMENSIONS 32-pin P-DIP E 2 L D S B e B Base Plane Seating Plane a E e c Symbol B 2 B c D E E e L Dimension in inches Dimension in mm Min. Nom. Max. Min. Nom. Max a e S Notes:.Dimensions D Max. & S include mold flash or tie bar burrs. 2.Dimension E does not include interlead flash. 3.Dimensions D & E. include mold mismatch an are determined at the mold parting line. 4.Dimension B does not include dambar protrusion/intrusion. 5.Controlling dimension: Inches. 6.General appearance spec. should be based on final visual inspection spec. 32-pin TSOP H D D c Symbol Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. Max M e E b c (0.004) D b E H D e θ L L 2 Y L L Y θ Note: Controlling dimension: Millimeters
21 Package Dimensions, continued 32-pin PLCC H E E D H D G D Symbol 2 b b c D E e Dimension in Inches Min. Nom. Max. Min. Nom. Max Dimension in mm G D c G E H D H E L y θ L Notes: θ Seating Plane e G E b b 2 y. Dimensions D & E do not include interlead flash. 2. Dimension b does not include dambar protrusion/intrusion. 3. Controlling dimension: Inches. 4. General appearance spec. should be based on final visual inspection sepc. Publication Release Date: February 8, Revision 4
22 VERSION HISTORY VERSION DTE PGE DESCRIPTION May Initial Issued 2 pr Change Byte Load Cycle Time from 50 µs 200 µs 3 Dec , 8 dd in Hardware SID Read function note 4 Feb. 8, dd in one more Test Condition in Power Supply Current (Icc): f = 2 MHz 4 Modify VDD Power Up/Down Detection description 9 dd HOW TO RED THE TOP MRKING Headquarters No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: FX: Taipei Office 9F, No.480, Rueiguang Rd., Neihu Chiu, Taipei, 4, Taiwan, R.O.C. TEL: FX: Winbond Electronics Corporation merica 2727 North First Street, San Jose, C 9534, U.S.. TEL: FX: Winbond Electronics Corporation Japan 7F Daini-ueno BLDG, Shinyokohama Kohoku-ku, Yokohama, TEL: FX: Winbond Electronics (Shanghai) Ltd. 27F, 2299 Yan n W. Rd. Shanghai, China TEL: FX: Winbond Electronics (H.K.) Ltd. Unit 9-5, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: FX: Please note that all data and specifications are subject change without notice. ll the trade marks of products and companies mentioned in this data sheet belong their respective owners
256K 8 CMOS FLASH MEMORY
GENERL ESCRIPTION 256K 8 CMOS FLSH MEMORY The W29C020 is a 2-megabit, 5-volt only CMOS flash memory organized as 256K 8 bits. The device can be written (erased and programmed) in-system with a standard
More information512K 8 CMOS FLASH MEMORY
GENERL ESCRIPTION 52K 8 CMOS FLSH MEMORY The W29C040 is a 4-megabit, 5-volt only CMOS page mode Flash Memory organized as 52K 8 bits. The device can be written (erased and programmed) in-system with a
More information128K 8 CMOS FLASH MEMORY
128K 8 CMOS FLSH MEMORY GENERL ESCRIPTION The W29EE011 is a 1-megabit, 5-volt only CMOS flash memory organized as 128K 8 bits. The device can be programmed and erased in-system with a standard 5V power
More information128K 8 CMOS FLASH MEMORY
128K 8 CMOS FLSH MEMORY GENERL ESCRIPTION The W29EE011 is a 1-megabit, 5-volt only CMOS flash memory organized as 128K 8 bits. The device can be programmed and erased in-system with a standard 5V power
More informationW27E257 32K 8 ELECTRICALLY ERASABLE EPROM GENERAL DESCRIPTION FEATURES PIN CONFIGURATIONS BLOCK DIAGRAM PIN DESCRIPTION
32K 8 ELECTRICLLY ERSBLE EPROM GENERL DESCRIPTION The W27E257 is a high-speed, low-power Electrically Erasable and Programmable Read Only Memory organized as 32768 8 bits that operates on a single 5 volt
More information128K 8 CMOS FLASH MEMORY
128K 8 CMOS FLASH MEMORY GENERAL ESCRIPTION The W29C011A is a 1-megabit, 5-volt only CMOS flash memory organized as 128K 8 bits. The device can be programmed and erased in-system with a standard 5V power
More information128K 8 CMOS FLASH MEMORY
128K 8 CMOS FLASH MEMORY GENERAL ESCRIPTION The W29EE011 is a 1-megabit, 5-volt only CMOS flash memory organized as 128K 8 bits. The device can be programmed and erased in-system with a standard 5V power
More information2-Megabit (256K x 8) 5-volt Only CMOS Flash Memory AT29C020. Features. Description. Pin Configurations
Features Fast Read Access Time - 90 ns 5-Volt-Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 1024 Sectors (256 bytes/sector) Internal Address and Data Latches for
More information256K 8 CMOS FLASH MEMORY
256K 8 CMOS FLSH MEMORY GENERL ESCRIPTION The W49F002U is a 2-megabit, 5-volt only CMOS flash memory organized as 256K 8 bits. The device can be programmed and erased in-system with a standard 5V power
More informationFEATURES. Single Power Supply Operation - Low voltage range: 2.70 V V
FEATURES Single Power Supply Operation - Low voltage range: 2.70 V - 3.60 V - IS39LV040: 512K x 8 (4 Mbit) - IS39LV010: 128K x 8 (1 Mbit) - IS39LV512: 64K x 8 (512 Kbit) - 70 ns access time - Uniform 4
More information128Kx8 CMOS MONOLITHIC EEPROM SMD
128Kx8 CMOS MONOLITHIC EEPROM SMD 5962-96796 WME128K8-XXX FEATURES Read Access Times of 125, 140, 150, 200, 250, 300ns JEDEC Approved Packages 32 pin, Hermetic Ceramic, 0.600" DIP (Package 300) 32 lead,
More information128K 8 CMOS FLASH MEMORY
128K 8 CMOS FLASH MEMORY Table of Contents- 1. GENERAL DESCRIPTION... 3 2. FEATURES... 3 3. PIN CONFIGURATIONS... 4 4. BLOCK DIAGRAM... 4 5. PIN DESCRIPTION... 4 6. FUNCTIONAL DESCRIPTION... 5 6.1 Device
More information1-Megabit (128K x 8) 5-volt Only Flash Memory AT29C010A. Features. Description. Pin Configurations
Features Fast Read Access Time - 70 ns 5-Volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 1024 Sectors (128 bytes/sector) Internal Address and Data Latches for
More informationAT28C16. 16K (2K x 8) CMOS E 2 PROM. Features. Description. Pin Configurations
Features Fast Read Access Time - 150 ns Fast Byte Write - 200 µs or 1 ms Self-Timed Byte Write Cycle Internal Address and Data Latches Internal Control Timer Automatic Clear Before Write Direct Microprocessor
More informationAT28C K (32K x 8) Paged CMOS E 2 PROM. Features. Description. Pin Configurations
AT28C256 Features Fast Read Access Time - 150 ns Automatic Page Write Operation Internal Address and Data Latches for 64-Bytes Internal Control Timer Fast Write Cycle Times Page Write Cycle Time: 3 ms
More informationWhite Electronic Designs
12Kx32 EEPROM MODULE, SMD 5962-9455 FEATURES Access Times of 120**, 140, 150, 200, 250, 300ns Packaging: 66-pin, PGA Type, 27.3mm (1.075") square, Hermetic Ceramic HIP (Package 400) 6 lead, 22.4mm sq.
More information1-megabit (64K x 16) 5-volt Only Flash Memory AT49F1024A Features Description Pin Configurations
BDTIC www.bdtic.com/atmel Features Single-voltage Operation 5V Read 5V Reprogramming Fast Read Access Time 45 ns Internal Program Control and Timer 8K Word Boot Block with Lockout Fast Erase Cycle Time
More informationW49V002FA 256K 8 CMOS FLASH MEMORY WITH FWH INTERFACE GENERAL DESCRIPTION FEATURES
GENERAL DESCRIPTION 256K 8 CMOS FLASH MEMORY WITH FWH INTERFACE The W49V002FA is a 2-megabit, 3.3-volt only CMOS flash memory organized as 256K 8 bits. The device can be programmed and erased in-system
More information4-Megabit (512K x 8) 5-volt Only CMOS Flash Memory AT49F040 AT49F040T AT49F040/040T AT49F040/040T. Features. Description. Pin Configurations
Features Single Voltage Operation 5V Read 5V Reprogramming Fast Read Access Time - 70 ns Internal Program Control and Timer 16K bytes Boot Block With Lockout Fast Erase Cycle Time - 10 seconds Byte By
More informationRev. No. History Issue Date Remark
Preliminary 512K X 8 OTP CMOS EPROM Document Title 512K X 8 OTP CMOS EPROM Revision History Rev. No. History Issue Date Remark 0.0 Initial issue June 17, 1998 Preliminary 1.0 Change CE from VIL to VIH
More informationDIP Top View VCC WE A17 NC A16 A15 A12 A14 A13 A8 A9 A11 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 I/O1 I/O2 GND.
Features Fast Read Access Time - 70 ns 5-volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 1024 Sectors (256 bytes/sector) Internal Address and Data Latches for
More information1-Megabit (128K x 8) 5-volt Only Flash Memory AT29C010A. Features. Description. Pin Configurations
Features Fast Read Access Time - 70 ns 5-Volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 1024 Sectors (128 bytes/sector) Internal Address and Data Latches for
More information4-Megabit (512K x 8) 5-volt Only 256-Byte Sector Flash Memory AT29C040A. Features. Description. Pin Configurations
Features Fast Read Access Time - 120 ns 5-Volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 2048 Sectors (256 bytes/sector) Internal Address and Data Latches for
More informationAT49BV004(T) TSOP Top View Type 1 1. AT49BV4096A(T) TSOP Top View Type 1 A16 BYTE GND I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 VCC I/O11 I/O3 I/O10 I/O2
Features 2.7V to 3.6V Read/Write Operation Fast Read Access Time - 120 ns Internal Erase/Program Control Sector Architecture One 8K Words (16K bytes) Boot Block with Programming Lockout Two 4K Words (8K
More information1-Megabit (128K x 8) Low Voltage Paged Parallel EEPROMs AT28LV010
BDTIC www.bdtic.com/atmel Features Single 3.3V ± 10% Supply Fast Read Access Time 200 ns Automatic Page Write Operation Internal Address and Data Latches for 128 Bytes Internal Control Timer Fast Write
More informationEDI8G322048C DESCRIPTION FEATURES PIN CONFIGURATION PIN NAMES
2048K x 32 Static RM CMOS, High Speed Module FETURES n 2048K x 32 bit CMOS Static n Random ccess Memory ccess Times: 20, 25, and 35ns Individual Byte Selects Fully Static, No Clocks TTL Compatible I/O
More informationWhite Electronic Designs
256Kx32 Static RM CMOS, High Speed Module FETURES 256Kx32 bit CMOS Static Random ccess Memory ccess Times: 12, 15, 20, and 25ns Individual Byte Selects Fully Static, No Clocks TTL Compatible I/O High Density
More informationPm39F010 / Pm39F020 / Pm39F040
1 Mbit / 2 Mbit / 4 Mbit 5 Volt-only CMOS Flash Memory FEATURES Single Power Supply Operation - Low voltage range: 4.5 V - 5.5 V Memory Organization - Pm39F010: 128K x 8 (1 Mbit) - Pm39F020: 256K x 8 (2
More informationThe Winbond flash memory has a data protection function. Any data in flash memory can be protected by using the following method.
Application Note-07 1. GENERAL DESCRIPTION DATA PROTECTION METHOD OF The unforeseen rewriting may be executed or a status register read mode may be enabled by recognizing a noise signal as any command
More information256K (32K x 8) 3-volt Only Flash Memory
Features Single Supply Voltage, Range 3V to 3.6V 3-Volt Only Read and Write Operation Software Protected Programming Low Power Dissipation 15 ma Active Current 40 µa CMOS Standby Current Fast Read Access
More informationW83C42 KEYBOARD CONTROLLER GENERAL DESCRIPTION FEATURES
查询 W83C4 供应商 W83C4 KEYBOR CONTROLLER GENERL ESCRIPTION The W83C4 keyboard controller is programmed to support the IBM compatible personal computer keyboard serial interface. The keyboard controller receives
More informationCAT28C K-Bit Parallel EEPROM
256K-Bit Parallel EEPROM HALOGENFREE LEAD TM FREE FEATURES Fast read access times: 120/150ns Low power CMOS dissipation: Active: 25 ma max Standby: 150 µa max Simple write operation: On-chip address and
More informationAT29C K (32K x 8) 5-volt Only CMOS Flash Memory. Features. Description. Pin Configurations
Features Fast Read Access Time - 70 ns 5-Volt-Only Reprogramming Page Program Operation Single Cycle Reprogram (Erase and Program) Internal Address and Data Latches for 64-Bytes Internal Program Control
More information1-megabit (64K x 16) 5-volt Only Flash Memory AT49F1024 AT49F1025
Features Single-voltage Operation 5V Read 5V Reprogramming Fast Read Access Time 35 ns Internal Program Control and Timer 8K Word Boot Block with Lockout Fast Erase Cycle Time 10 seconds Word-by-word Programming
More information4Mbit, 512KX8 5V Flash Memory (Monolithic)
4Mbit, 512KX8 5V Flash Memory (Monolithic) Features 5V Programming, 5V±10% Supply TTL Compatible Inputs and CMOS Outputs Access Times: 90, 120 and 150ns Low Vcc Write Inhibit 3.2v 8 Equal Size Sectors
More informationSST 29EE V-only 1 Megabit Page Mode EEPROM
Data Sheet SST 29EE010 July 1996 5.1 Features: Single 5.0-Volt Read and Write Operations CMOS SuperFlash EEPROM Technology Endurance: 100,000 Cycles (typical) Greater than 100 years Data Retention Low
More informationLP621024E-I Series 128K X 8 BIT CMOS SRAM. Document Title 128K X 8 BIT CMOS SRAM. Revision History. AMIC Technology, Corp.
128K X 8 BIT CMOS SRAM Document Title 128K X 8 BIT CMOS SRAM Revision History Rev. No. History Issue Date Remark 0.0 Initial issue January 14, 2008 Preliminary 1.0 Final version release September 21, 2010
More informationSST 29EE V-only 512 Kilobit Page Mode EEPROM
Data Sheet SST 29EE512 June 1997 2.1 Features: Single 5.0-Volt Read and Write Operations CMOS SuperFlash EEPROM Technology Endurance: 100,000 Cycles (typical) Greater than 100 years Data Retention Low
More informationDIP Top View A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND VCC A17 A14 A13 A8 A9 A11 A10 I/O7 I/O6 I/O5 I/O4 I/O3 VCC A18 A17
Features Single-voltage Operation 5V Read 5V Reprogramming Fast Read Access Time 55 ns Internal Program Control and Timer 16-Kbyte Boot Block with Lockout Fast Erase Cycle Time 10 seconds Byte-by-byte
More informationPm39LV512 / Pm39LV010 / Pm39LV020 / Pm39LV040
512 Kbit / 1Mbit / 2Mbit / 4Mbit 3.0 Volt-only CMOS Flash Memory FEATURES Single Power Supply Operation - Low voltage range: 2.7 V - 3.6 V Memory Organization - Pm39LV512: 64K x 8 (512 Kbit) - Pm39LV010:
More information4-megabit (512K x 8) Single 2.7-volt Battery-Voltage Flash Memory AT49BV040 AT49BV040T AT49LV040 AT49LV040T
Features Single Voltage for Read and Write: 2.7V to 3.6V (BV), 3.0V to 3.6V (LV) Fast Read Access Time 70 ns Internal Program Control and Timer 16K Bytes Boot Block with Lockout Fast Chip Erase Cycle Time
More information8K X 8 BIT LOW POWER CMOS SRAM
February 2007 FEATURES Access time :55ns Low power consumption: Operation current : 15mA (TYP.), VCC = 3.0V Standby current : 1µ A (TYP.), VCC = 3.0V Wide range power supply : 2.7 ~ 5.5V Fully Compatible
More informationMX27C K-BIT [32K x 8] CMOS EPROM FEATURES GENERAL DESCRIPTION BLOCK DIAGRAM PIN CONFIGURATIONS PIN DESCRIPTION
FEATURES 32K x 8 organization Single +5V power supply +125V programming voltage Fast access time: 45/55/70/90/100/120/150 ns Totally static operation Completely TTL compatible 256K-BIT [32K x 8] CMOS EPROM
More information1-Megabit (128K x 8) Low Voltage Paged Parallel EEPROMs
Features Single 3.3V ± 10% Supply Fast Read Access Time - 200 ns Automatic Page Write Operation Internal Address and Data Latches for 128 Bytes Internal Control Timer Fast Write Cycle Time Page Write Cycle
More information1-megabit (64K x 16) 3-volt Only Flash Memory AT49LV1024 AT49LV1025
Features Single-voltage Operation 3V Read 3.1V Programming Fast Read Access Time 55 ns Internal Program Control and Timer 8K Word Boot Block with Lockout Fast Erase Cycle Time 10 seconds Word-by-Word Programming
More informationAS6C6264 8K X 8 BIT LOW POWER CMOS SRAM REVISION HISTORY. Feb
REVISION HISTORY Revision Description Issue Date 1.0 Initial issue Feb 2007 2.0 Add-in industrial temperature option for 28-pin 600 July 2017 mil PDIP. Standby current(isb1) reduced to be 20uA for I-grade
More informationAS6C K X 8 BIT LOW POWER CMOS SRAM
REVISION HISTORY Revision Description Issue Date Rev. 1.0 Rev. 1.1 Initial Issue Add package 48-ball 8mm 10mm TFBGA Revised ORDERING INFORMATION in page 11 Jan.09.2012 July.12.2013 0 FEATURES Fast access
More informationW39V040B Data Sheet 512K 8 CMOS FLASH MEMORY WITH LPC INTERFACE. Table of Contents-
Sheet Table of Contents- 512K 8 CMOS FLASH MEMORY WITH LPC INTERFACE 1. GENERAL DESCRIPTION... 3 2. FEATURES... 3 3. PIN CONFIGURATIONS... 4 4. BLOCK DIAGRAM... 4 5. PIN DESCRIPTION... 4 6. FUNCTIONAL
More information4-megabit (512K x 8) 5-volt Only 256-byte Sector Flash Memory AT29C040A
Features Fast Read Access Time 90 ns 5-volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 2048 Sectors (256 Bytes/Sector) Internal Address and Data Latches for
More information512 Kbit (64K x8) Page-Write EEPROM SST29EE512
512 Kbit (64K x8) Page-Write EEPROM FEATURES: 512Kb (x8) Page-Write, Small-Sector flash memories Single Voltage Read and Write Operations 4.5-5.5V for Superior Reliability Endurance: 100,000 Cycles (typical)
More information1-megabit (128K x 8) 3-volt Only Flash Memory AT29LV010A
Features Single Supply Voltage, Range 3V to 3.6V 3-volt Only Read and Write Operation Software Protected Programming Fast Read Access Time 120 ns Low Power Dissipation 15 ma Active Current 40 µa CMOS Standby
More informationMy-MS. MM27C ,072 x 8 CMOS EPROM PRELIMINARY INFORMATION ISSI IS27C010 FEATURES DESCRIPTION FUNCTIONAL BLOCK DIAGRAM
IS27C010 ISSI MM27C010 131,072 x CMOS EPROM PRELIMINARY INFORMATION FEATURES Fast read access time: 90 ns JEDEC-approved pinout High-speed write programming Typically less than 16 seconds 5V ±10% power
More information1-megabit (128K x 8) Paged Parallel EEPROM AT28C010
Features Fast Read Access Time 120 ns Automatic Page Write Operation Internal Address and Data Latches for 128 Bytes Internal Control Timer Fast Write Cycle Time Page Write Cycle Time 10 ms Maximum 1 to
More informationAm27C512. Advanced Micro Devices. 512 Kilobit (65,536 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL
FINAL 512 Kilobit (65,536 x 8-Bit) CMOS EPROM Advanced Micro Devices DISTINCTIVE CHARACTERISTICS Fast access time 55 ns Low power consumption 20 µa typical CMOS standby current JEDEC-approved pinout Single
More information4-megabit (512K x 8) Single 2.7-volt Battery-Voltage Flash Memory AT49BV040 AT49LV040
Features Single Voltage for Read and Write: 2.7V to 3.6V (BV), 3.0V to 3.6V (LV) Fast Read Access Time 70 ns Internal Program Control and Timer 16K Bytes Boot Block with Lockout Fast Chip Erase Cycle Time
More informationAm27C128. Advanced Micro Devices. 128 Kilobit (16,384 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL
FINAL 128 Kilobit (16,384 x 8-Bit) CMOS EPROM Advanced Micro Devices DISTINCTIVE CHARACTERISTICS Fast access time 45 ns Low power consumption 20 µa typical CMOS standby current JEDEC-approved pinout Single
More informationDIP Top View VCC RESET A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND A14 A13 A8 A9 A11 A10 I/O7 I/O6 I/O5 I/O4 I/O3
Features Single Supply for Read and Write: 2.7 to 3.6V (BV), 3.0 to 3.6V (LV) Fast Read Access Time - 70 ns Internal Program Control and Timer Sector Architecture One 16K Byte Boot Block with Programming
More informationAm27C020. Advanced Micro Devices. 2 Megabit (262,144 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL
FINAL 2 Megabit (262,144 x 8-Bit) CMOS EPROM Advanced Micro Devices DISTINCTIVE CHARACTERISTICS Fast access time 70 ns Low power consumption 100 µa maximum CMOS standby current JEDEC-approved pinout Plug
More information2-megabit (256K x 8) 5-volt Only Flash Memory AT29C020
Features Fast Read Access Time 70 ns 5-volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 1024 Sectors (256 Bytes/Sector) Internal Address and Data Latches for
More information64K (8K x 8) High Speed Parallel EEPROM with Page Write and Software Data Protection AT28HC64BF
Features Fast Read Access Time 70 ns Automatic Page Write Operation Internal Address and Data Latches for 64 Bytes Fast Write Cycle Times Page Write Cycle Time: 2 ms Maximum (Standard) 1 to 64-byte Page
More informationLP62S16256G-I Series. Document Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM. Revision History. Rev. No. History Issue Date Remark
Preliminary 256K X 16 BIT LOW VOLTAGE CMOS SRAM ocument Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. History Issue ate Remark 0.0 Initial issue June 2, 2006 Preliminary PRELIMINARY
More information64Mbit, 2MX32 3V Flash Memory Module
64Mbit, 2MX32 3V Flash Memory Module Features 3.0V ± 10% read and write operation 1,000,000 Block Erase Cycles Access Times: 70,90,120 &150ns 4X(32 Equal Sectors of 64-Kbyte Each) Package Options: Individual
More information256K-Bit PARALLEL EEPROM
256K-Bit PARALLEL EEPROM FEATURES Fast read access times: 120/150ns Low power CMOS dissipation: Active: 25 ma max Standby: 150 µa max Simple write operation: On-chip address and data latches Self-timed
More informationAm27C Megabit (131,072 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM
FINAL 1 Megabit (131,072 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS Fast access time 45 ns maximum access time Low power consumption 20 µa typical CMOS standby current JEDEC-approved pinout Single
More information2-megabit (256K x 8) Single 2.7-volt Battery-Voltage Flash Memory AT29BV020
Features Single Supply Voltage, Range 2.7V to 3.6V Single Supply for Read and Write Software Protected Programming Fast Read Access Time 120 ns Low Power Dissipation 15 ma Active Current 50 µa CMOS Standby
More informationSOIC VCC RESET A11 A10 A9 A8 A7 A6 A5 A4 A12 A13 A14 A15 A16 A17 A18 A19 NC NC NC NC I/O0 RDY/BUSY I/O1 I/O7 I/O6 I/O5 I/O4 VCC I/O2 I/O3 GND GND
Features Single Voltage Operation 5V Read 5V Reprogramming Fast Read Access Time - 90 ns Internal Program Control and Timer 16K Bytes Boot Block With Lockout Fast Erase Cycle Time - 10 seconds Byte-By-Byte
More informationBattery-Voltage. 256K (32K x 8) Parallel EEPROMs AT28BV256. Features. Description. Pin Configurations
Features Single 2.7V - 3.6V Supply Fast Read Access Time - 200 ns Automatic Page Write Operation Internal Address and Data Latches for 64 Bytes Internal Control Timer Fast Write Cycle Times Page Write
More informationA29001/ Series. 128K X 8 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory. Document Title. Revision History. AMIC Technology, Corp.
A29001/290011 Series 128K X 8 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory Document Title 128K X 8 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory Revision History Rev. No. History Issue Date Remark
More information512K (64K x 8) 3-volt Only Flash Memory AT29LV512
Features Single Supply Voltage, Range 3V to 3.6V 3-volt Only Read and Write Operation Software Protected Programming Low-power Dissipation 15 ma Active Current 50 µa CMOS Standby Current Fast Read Access
More informationACT-S128K32 High Speed 4 Megabit SRAM Multichip Module
CT-S128K32 High Speed 4 Megabit SRM Multichip Module Features 4 Low Power CMOS 128K x 8 SRMs in one MCM Overall configuration as 128K x 32 Input and Output TTL Compatible 17, 20, 25, 35, 45 & 55ns ccess
More informationKeyboard and PS/2 Mouse Controller
KBD43W13 Keyboard and PS/2 Mouse Controller FEATURES Supports IBM PC and Compatible System Designs Full Hardwire Design Based on Advanced VLSI CMOS Technology Supports PS/2 Mouse 6 MHz to 12 MHz Operating
More information64K x 16 1Mb Asynchronous SRAM
TSOP, FP-BGA Commercial Temp Industrial Temp 64K x 16 1Mb Asynchronous SRAM GS71116AGP/U 7, 8, 10, 12 ns 3.3 V V DD Center V DD and V SS Features Fast access time: 7, 8, 10, 12 ns CMOS low power operation:
More information4 Megabit (512K x8) Multi-Purpose Flash SST39SF040
Megabit (K x) Multi-Purpose Flash FEATURES: Organized as K X Single.0V Read and Write Operations Superior Reliability Endurance: 0,000 Cycles (typical) Greater than 0 years Data Retention Low Power Consumption:
More informationCAT28C17A 16K-Bit CMOS PARALLEL EEPROM
16K-Bit CMOS PARALLEL EEPROM HALOGENFREE LEAD TM FREE FEATURES Fast Read Access Times: 200 ns Low Power CMOS Dissipation: Active: 25 ma Max. Standby: 100 µa Max. Simple Write Operation: On-Chip Address
More information256 (32K x 8) High-speed Parallel EEPROM AT28HC256N. Features. Description. Pin Configurations
Features Fast Read Access Time 90 ns Automatic Page Write Operation Internal Address and Data Latches for 64 Bytes Internal Control Timer Fast Write Cycle Times Page Write Cycle Time: 3 ms or 10 ms Maximum
More informationIDT71V124SA/HSA. 3.3V CMOS Static RAM 1 Meg (128K x 8-Bit) Center Power & Ground Pinout
33V CMOS Static RAM 1 Meg (K x -Bit) Center Power & Ground Pinout IDT71VSA/HSA Features K x advanced high-speed CMOS static RAM JEDEC revolutionary pinout (center power/gnd) for reduced noise Equal access
More information1-megabit (128K x 8) 5-volt Only Flash Memory AT49F001A AT49F001AN AT49F001AT AT49F001ANT. Features. Description. Pin Configurations
Features Single-voltage Operation 5V Read 5V Reprogramming Fast Read Access Time 45 ns Internal Program Control and Timer Sector Architecture One 16K Bytes Boot Block with Programming Lockout Two 8K Bytes
More information64K (8K x 8) Battery-Voltage Parallel EEPROM with Page Write and Software Data Protection AT28BV64B
Features Single 2.7V to 3.6V Supply Hardware and Software Data Protection Low Power Dissipation 15mA Active Current 20µA CMOS Standby Current Fast Read Access Time 200ns Automatic Page Write Operation
More informationW83176R-400 W83176G-400
W83176R-400 W83176G-400 Winbond Current Mode Differential Buffer for PCI Express and SATA Date: May/16/2006 Revision: 0.6 Datasheet Revision History PAGES DATES VERSION WEB VERSION MAIN CONTENTS 1 n.a.
More information512K x 8 4Mb Asynchronous SRAM
SOJ, TSOP, FP-BGA Commercial Temp Industrial Temp 512K x 8 4Mb Asynchronous SRAM GS74108ATP/J/X 8, 10, 12 ns 3.3 V V DD Center V DD and V SS Features Fast access time: 8, 10, 12 ns CMOS low power operation:
More informationBattery-Voltage. 16K (2K x 8) Parallel EEPROMs AT28BV16. Features. Description. Pin Configurations
Features 2.7 to 3.6V Supply Full Read and Write Operation Low Power Dissipation 8 ma Active Current 50 µa CMOS Standby Current Read Access Time - 250 ns Byte Write - 3 ms Direct Microprocessor Control
More informationIDT71016S/NS. CMOS Static RAM 1 Meg (64K x 16-Bit)
CMOS Static RAM 1 Meg (4K x 1-Bit) IDT711S/NS Features 4K x 1 advanced high-speed CMOS Static RAM Equal access and cycle times Commercial and Industrial: //2 One Chip Select plus one Output Enable pin
More informationA29040D Series. 512K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory. Document Title. Revision History. AMIC Technology, Corp.
Preliminary 512K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Document Title 512K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Revision History Rev. No. History Issue Date Remark
More informationA29010 Series. 128K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory. Document Title. Revision History. AMIC Technology, Corp.
128K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Document Title 128K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Revision History Rev. No. History Issue Date Remark 0.0 Initial
More informationRev. No. History Issue Date Remark
Preliminary 512K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Document Title 512K X 8 Bit CMOS 5.0 Volt-only, Uniform Sector Flash Memory Revision History Rev. No. History Issue Date Remark
More information1-megabit (128K x 8) Single 2.7-volt. Flash Memory AT49BV001A AT49BV001AN AT49BV001AT AT49BV001ANT. Battery-Voltage. Features.
Features Single Supply for Read and Write: 2.7 to 3.6V Fast Read Access Time 55 ns Internal Program Control and Timer Sector Architecture One 16K Bytes Boot Block with Programming Lockout Two 8K Bytes
More informationICE27C Megabit(128KX8) OTP EPROM
1- Megabit(128KX8) OTP EPROM Description The is a low-power, high-performance 1M(1,048,576) bit one-time programmable read only memory (OTP EPROM) organized as 128K by 8 bits. It is single 5V power supply
More informationMOS INTEGRATED CIRCUIT
DATA SHEET 256K-BIT CMOS STATIC RAM 32K-WORD BY 8-BIT MOS INTEGRATED CIRCUIT µpd43256b Description The µpd43256b is a high speed, low power, and 262,144 bits (32,768 words by 8 bits) CMOS static RAM. Battery
More information64-megabit (4M x 16) 3-volt Only Flash Memory AT49BV642D AT49BV642DT
BDTIC www.bdtic.com/atmel Features Single Voltage Operation Read/Write: 2.65V - 3.6V 2.7V - 3.6V Read/Write Access Time 70 ns Sector Erase Architecture One Hundred Twenty-seven 32K Word Main Sectors with
More information1 Megabit Serial Flash EEPROM SST45LF010
EEPROM FEATURES: Single.0-.V Read and Write Operations Serial Interface Architecture SPI Compatible: Mode 0 and Mode Byte Serial Read with Single Command Superior Reliability Endurance: 00,000 Cycles (typical)
More information512 Kbit / 1 Mbit / 2 Mbit (x8) Multi-Purpose Flash SST39SF512A / SST39SF010A / SST39SF020A
Kbit / Mbit / Mbit (x) Multi-Purpose Flash FEATURES: Organized as K x / K x / K x Single.0V Read and Write Operations Superior Reliability Endurance: 00,000 Cycles (typical) Greater than 00 years Data
More information512K (64K x 8) 5-volt Only Flash Memory AT29C512
Features Fast Read Access Time 70 ns 5-volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 512 Sectors (128 Bytes/Sector) Internal Address and Data Latches for 128
More information1-megabit (128K x 8) 5-volt Only Flash Memory AT29C010A
Features Fast Read Access Time 70 ns 5-volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 1024 Sectors (128 Bytes/Sector) Internal Address and Data Latches for
More informationCMOS Static RAM 1 Meg (128K x 8-Bit) Revolutionary Pinout
CMOS Static RAM 1 Meg (K x -Bit) Revolutionary Pinout IDT714 Features K x advanced high-speed CMOS static RAM JEDEC revolutionary pinout (center power/gnd) for reduced noise Equal access and cycle times
More information1-megabit (64K x 16) 3-volt Only Flash Memory AT49BV1024A AT49LV1024A
Features Single-voltage Operation Read/Write Operation: 2.7V to 3.6V (BV). 3.0V to 3.6V(LV) Fast Read Access Time 45 ns Internal Program Control and Timer 8K Word Boot Block with Lockout Fast Erase Cycle
More informationRev. No. History Issue Date Remark
128K X 8 BIT LOW VOLTAGE CMOS SRAM ocument Title 128K X 8 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. History Issue ate Remark 0.0 Initial issue February 19, 2002 Preliminary 0.1 Add 32L Pb-Free
More informationDIP Top View VCC A12 A14 A13 A6 A5 A4 A3 A2 A1 A0 A8 A9 A11 A10 I/O7 I/O6 I/O0 I/O1 I/O2 I/O5 I/O4 I/O3 GND. TSOP Top View Type 1 A11 A9 A8 A13 A14
Features Fast Read Access Time 70 ns 5-volt Only Reprogramming Page Program Operation Single Cycle Reprogram (Erase and Program) Internal Address and Data Latches for 64 Bytes Internal Program Control
More information4-megabit (512K x 8) 5-volt Only 256-byte Sector Flash Memory AT29C040A
Features Fast Read Access Time 90 ns 5-volt Only Reprogramming Sector Program Operation Single Cycle Reprogram (Erase and Program) 2048 Sectors (256 Bytes/Sector) Internal Address and Data Latches for
More information64K (8K x 8) Low-voltage Parallel EEPROM with Page Write and Software Data Protection AT28LV64B. 3-Volt, 64K E 2 PROM with Data Protection
Features Single 3.3V ± 10% Supply Hardware and Software Data Protection Low-power Dissipation 15mAActiveCurrent 20 µa CMOS Standby Current Fast Read Access Time - 200 ns Automatic Page Write Operation
More information64K-Bit CMOS PARALLEL EEPROM
64K-Bit CMOS PARALLEL EEPROM FEATURES Fast read access times: 90/120/150ns Low power CMOS dissipation: Active: 25 ma max. Standby: 100 µa max. Simple write operation: On-chip address and data latches Self-timed
More information