MEMS - Exhibitor Presentations Manufacturing Technology and Quality Multi Sensor Metrology for Control of MEMS Production

Transcription

1 MEMS - Exhibitor Presentations Manufacturing Technology and Quality Multi Sensor Metrology for Control of MEMS Production Dr. Bastian Marheineke FRT, Fries Research & Technology GmbH marheineke@frt-gmbh.com /

2 Metrology in MEMS manufacturing Multiple metrology tasks on structural and wafer scales Roughness Structures TTV Warp Film thickness Bow Flatness Nanotopography Vias Planarity Wafer roll-off amount Stress Wafer stacks

3 FRT Multi Sensor Technology flexible metrology systems addressing multiple tasks Multi sensor configurations

4 FRT Products for Surface Metrology FRT standard systems for various industries Tabletop unit Fully integrated production tool

5 MicroProf 200 TTV Semi automated wafer metrology tool established standard metrology tool measurement according to Semi standards high performance software and hardware easy to use, high reliability configurable to specific metrology tasks IR and Film Thickness upgrades optional on site upgradable to fully automated wafer handling several hundred tools in industrial use

6 MicroProf 300 MFE Fully automated wafer metrology tool multi sensor tool high throughput fully automated high reliability sorting capability SECS/GEM interface

7 FRT MEMS Solutions MicroProf (TTV) Measurement applications: Roughness Structures TTV Warp / Bow Measurement Flatness / Planarity Nanotopography Wafer Stack Measurement Vias Film Thickness Roll-off Amount Stress Measurement

8 MicroProf TTV Simultaneous measurements on top and bottom side of wafers Polished side Rough side

9 FRT MEMS topography measurement Examples: various structures of different sizes Source: Danfoss Silicon Power GmbH

10 FRT Roughness Measurement Example: measurements of polished Silicon Paramater evaluation based on common standards: sra: nm srq: nm srz(din): nm srmax: nm srz25: nm srmax25: nm srp: nm srv: nm srt: nm srsk: srku: srk: nm srpk: nm srvk: nm smr1: % smr2: % sv0: nm³/nm² srmr(c): % (with c = 0.1 µm)

11 FRT Bow Measurement Example: pre and post treatment measurements of Si substrate

12 FRT Planarity / Flatness Measurement White Light Interferometer (WLI PL) deep surface measurement without shadowing effects due to coaxial illumination (max. z-range 50 mm) fast one-shot-technology (few seconds) Further applications: high accuracy planarity measurements of large specimen through Silicon Via analysis with small diameter and great depth fast measurement of large bump areas broadband light source camera sample Michelson interferometer

13 FRT MEMS TSV Measurement Measurement and analysis of Vias

14 FRT Nanotopography Measurement FRT nanotopography solution Nanotopograhy-Analysis (NT) Mapping of the entire wafer Stitching Data processing according to SEMI M78 NT-Analysis according to SEMI M43 White Light Interferometer with FoV 85x85 mm² 16 single measurements cover the full 300 mm wafer Fully automated measurement, recipe controlled

15 FRT Defect Detection Detection and analysis of defects Automated Defect Detection, e.g. dimple or center defect Defects down to 50 nm depth and 300 µm in diameter accessible Reporting of depth, area, volume and wafer coordinates

16 FRT Stack Thickness Measurement Measurements of wafer stacks

17 FRT Film Thickness Measurement Point sensor FTR n downhill Simplex fit, up to 10 layers n iterative fit with FFT, with one or two variable film thickness values n FFT for thickness bigger 2 µm, 2 layers database with 40 materials

18 FRT Film Thickness Measurement Example: mapping of coated wafers

19 FRT Film Thickness Measurement Example: wafer mapping of multi-layer structures Si3N4 SiO2 Si

20 FRT Stress Measurement Example: measurements of coated wafers Film deposition Before deposition After deposition Stress: σ = -7,65 MPa Thickness mapping

21 FRT MEMS Metrology Solutions Applications: Roughness Structures TTV Warp / Bow Measurement Flatness / Planarity Nanotopography Wafer Stack Measurement Vias Film Thickness Roll-off Amount Stress Measurement in a single tool MicroProf

22 Thank you for your attention! FRT, Fries Research & Technology GmbH Headquarters FRT, Fries Research & Technology GmbH Friedrich-Ebert-Strasse D Bergisch Gladbach Tel.: +49 (0) Fax: +49 (0) Internet