IDEMA, March Hari Hegde CTO, Data Storage Process Equipment Veeco Instruments Inc.

Transcription

1 Era of HDD s for Consumer Electronics: Slider Technology Process Solutions IDEMA, March 2005 Hari Hegde CTO, Data Storage Process Equipment Veeco Instruments Inc. Overview Disk Drive Industry Rejuvenation Consumer Electronics Market Drivers Form Factors Greater Opportunities in Cell Phones Need for Reduced Cost and Increased Areal Density Veeco Process and Metrology Tools Enable Advanced Sliders Lower COO Higher Productivity Advanced Technology Higher Levels of Integration to avoid non-value added steps Examples: Lapping, Saws, Etching, and Overcoats Integrated Metrology Conclusions 2 1

2 3 Advances in Hard Disk Drives as Enablers for CE Market: Large Form Factor HDD Applications Game Box: Large capacity at low price, Form Factor not important. Market expected to grow from 10M to 15M in 3 years. TiVo s and DVR s: Simultaneous playback and record feature is unique. Large capacity at very low price point, Form Factor not important, low acoustics. 400GB: allows > 100 hours recording. Market expected to grow from 16M to 40M in 3 Years. Automobile GPS: Capacity at low price and fast access speed versus CD/DVD based systems. Market expected to grow from 2M to 5M in 3 Years. Multi-function HDD based audio systems is potentially a 10x larger market. Wide operating temperatures is a challenge ( extremes to 40 C to 50 C) Need improvements in PTR and stiction. 4 Market estimate and projection based on IDC 02/18/05 2

3 Advances in Hard Disk Drives as Enablers for CE Market: Small Form Factor HDD Applications Portable Audio (ipod) and Video: Capacity at 1 and smaller form factor. Extreme ruggedness with design sophistication. Low Power Consumption: >10 hours playing time. Market expected to grow from 6M to 24M in 3 Years. Digital Photo Opportunity: Capacity at 1 and smaller form factor, extreme ruggedness Consumer desire for compatibility with DVD players poses challenge to full market penetration: Need simplified interfacing. Market estimate and projection based on IDC 02/18/05 5 Cell Phones: Large Opportunity and Greatest Challenge Price/MB ($) Price/MB (60% areal density increase from 2002) Year Flash Memory Trajectory??? Small Disk Drive Trajectory 1.8" 1" Flash.82" Cell phone unit volume is >2x of HDD. Advantage of HDD over Flash: 1. Data Transfer Rate 5x 15 GB/sec 2. Better power consumption for write process. 3. Capacity at 1 is 3x better. 4. FF 0.85 match the impact resistance offered by flash. Competing with NAND Flash Memory: Need Increased Areal Density Growth at Lower Cost. ASP s of 2 GB Flash Card is now only $125. Capacity of 1 microdrive is only 3x better, at similar price. NAND Flash Memory currently at 90 nm node in 200mm fabs, with dual die and multi-level cell. Expect prices of flash to fall more steeply than normal in near term. Y2005 switch to to 300 mm fab, at 70 nm node. 6 3

4 Substra te Substra te Slider is the Most Complicated and Expensive Component in HDD A slider comprises < 0.01% of volume of HDD. Slider costs > 15% of a HDD. Slider fabrication involves highly complicated processes that are compounded by three major changes occurring near simultaneously: 1. Femto with advanced Advanced ABS 2. TGMR/CPP 3. PMR 7 Veeco s Process Equipment and Metrology Tools: Enablers in Wafer Fab: Advanced Sensors, Poles Sensor Pole Coil Sensor Sensor Writer Pole PROCESS EQUIPMENT Pre-CMP Fill Al2O3 PROCESS EQUIPMENT PROCESS EQUIPMENT PROCESS EQUIPMENT PVD, ALD, IBD, Etch PVD, Etch PVD, ALD METROLOGY Post CMP Flatness: AFM METROLOGY X3D AFM PR Profile - METROLOGY Stylus Profiling X3D AFM METROLOGY Stylus Profiling, Defect Insp. Quasi Static Tester 8 4

5 9 CE HDD s: Need for Lower Cost of Ownership Capital Equipment: Veeco s Approach Common platform: Common Platform across all products (common software, controls, handling) More reliable systems Better utilization of resources Easier to leverage Veeco s extensive process know-how Shorter time to market COO: Cost Footprint Maintainability - Throughput: Use Cost- Footprint- Maintainability- Throughput as design parameters from an early stage Better supply chain management with suppliers engaged during the engineering process High level of process integration Cell construction design Tested subassemblies Easier to manufacture or outsource 10 5

6 Veeco s Advanced IBD Enables TMR and CPP Sensors Year Areal Density - Product / Development ( Gb / in2 ) 80 / / / / / / 600 Reader Width ( nm ) 120 / / / / / / 40 S-S Spacing ( nm ) 60 / / / / / / 22 Track Width Direction Reader Hard Bias CoCrPt Isolation Layer Al2O3 Current in Plane: CIP CPP / TGMR Production Yield of Narrow Track Sensor depends on: Hard Bias and Isolation Layer uniformity: Junction Symmetry, Junction Uniformity across the full wafer. Veeco s NEXUS IBD is an enabler with cluster IBD/ IBE / ALD platform. 11 Veeco s Advanced IBE and ALD Enables PMR Poles Year Areal Density - Product / Development ( Gb / in2 ) 80 / / / / / / 600 Pole Width ( nm ) 130 / / / / / / 47 S-S Spacing ( nm ) 60 / / / / / / 22 Longitudinal Track Width Direction Writer Perpendicular Erase band on media is sensitive to skew angle. Need tight control of slanted sidewalls of perpendicular pole. < 100 nm pole width can show magnetic damage of edges. Excellent static etch uniformity with low damage is needed. Pole CD 3 Sigma % Partial Pole CD U% vs. IBE Static U% Install Base NIBE U% < 3% Static Etch Beam 3 Sigma % NEXUS IBE for PMR Pole: Provides outstanding CD uniformity Low damage of PMR sidewalls Series1 12 6

7 13 Impact of Femto Slider Introduction: Femto is an Enabler for Mobile Products Femto is Enabler for Mobile CE: Femto provides several great advantages: Improves shock resistance Reduces power consumption by >20% Improves storage capacity on small form factor drive Reduces fly height variation Femto Capacity gain over Pico In Small Form Factor Drives Implication of transition to Femto in head manufacturing: Footprint of Femto is 53% of Pico. Helps increase wafer productivity, and thus decrease cost. Handling of femto in slider fab more difficult, may need higher degree of automation. Common Toolsets in slider fabs can reduce cost of capital equipment and cost of automation 14 7

8 Advanced Sliders Require Multiple Metrology Technologies New metrology products allow cost savings in down stream processes: TMR Photo-resist CD and PMR Pole CD with X3D AFM. Post CMP wafer flatness with Vx AFM. New interferometric measurements prevent slider rework: HD 8100 Optical Profiler allows measurements through Photoresist. Where optical techniques fail due to film absorption, probe based technique are being introduced: DLC Pad with Vx AFM Where dimensions shrink below optical diffraction limits, probe based techniques are being introduced: PMR Pole PTR with Vx AFM. 15 Veeco s Vision for Metrology Beyond 300Gb/in 2 We focus on Advanced Technology at low COO Flexible Platform, Multi Gen Perform, Reliability, COO Our near term product plans include: Address the traditional limitations on throughput of probe based techniques Next Gen Auto AFM that combines X3D and Vx: Provide Long Scan, High Resolution AFM-Interferometer combination: High Throughput PTR 1HZ AFM Scans for high throughput. We are currently running feasibility studies on: Ultra high throughput AFM s with Video Rate scan. QNM material properties: Topography with hardness, electrical, etc. High frequency (1 GHZ) dynamic measurements for Rapid Thermal PTR 16 8

9 NEXUS IBE-Slider Enables Advanced Sliders Superior Fly Height Control requires ABS designs with added steps, and shallow mill features. Tri-pad designs are getting more in vogue: Allow higher reliability of fly height. Etch predictability, improved RTR, and U% essential. NEXUS IBE meets the etch requirements of advanced sliders, at superior COO. NEXUS provides total population 3-sigma of < 3%. Etch Rate (A/min) Uniformity within a 10.5 Pallet Uniformity over 225mm H-L Unif. = 0.7% 3sig Unif. = 1.3% Unif. Over Entire Range H-L Unif. = 0.7% 3sig Unif. = 1.4% Distance from Center (mm) Etch Rate (A/min) Run to Run Repeatability Run # 17 Elimination of Non-Value Added Steps: Example Currently, Photo Resist Re-work is needed Typical Slider Etch Process 1. Partial etch of slider 2. Remove from etch machine 3. Strip PR 4. Measure etch depth with HD3300 interferometer 5. Rework PR 6. Move to etch machine 7. Resume and end etch Conventional Interferometer correlogram does not discern signal from below layer of Photoresist Photo Resist Rework can be eliminated Advanced algorithm in HD8100 interferometer can measure partial etch depth measurements through photo-resist Eliminates steps 3 and 5 above. HD 8100 correlogram can discern signal from below Photoresist Etch machine integrated with HD8100 can eliminate steps

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11 Reduction of Slider Overcoat Thickness Enables Areal Density Areal Density growth is strongly dependent on smaller HMS and overcoat thickness: Slider overcoat is a major portion of HMS. Year Areal Density Gb/in2 Product (C+Si) OverCoat Thickness Å- Product Today s sliders use in-situ ellipsometry based FCA based overcoats. Slider overcoats require Si adhesion layer. FCA Overcoats provide superior wear resistance, low friction / stiction. Continuous process improvements to FCA and Si seed layer are being made to achieve < 20 A Slider Overcoat thickness < < 15 < 18A Slider Overcoat requires minimal thickness of the Si adhesion layer. Next Gen FCA is geared to elimination of Si Seed through alloyed Carbon based composite overcoats. 21 Meeting Industry Needs for Advanced Landing Pads: Metrology Integrated Process Equipment Current DLC Landing Pad Capability Thickness Control: +/-20A Future DLC Landing Pad Requirement Thickness Range: < 12A Critical Requirements for DLC Landing Pads Film Thickness 250A (50A Si/200A C) High Deposition Rate High Tribological Performance, Hardness >20GPa Uniform Film Deposition of 200mm Diameter Total Population Thickness Control: < 12A Endpoint Control Required to Achieve Total Range of <12A Veeco s DLC-350V with in-situ ellipsometer meets requirements of advanced landing pads

12 23 Conclusions CE Opportunities are rejuvenating the HDD industry CE Opportunities pose new challenges Increasing areal density while holding costs is necessary Small form factor drives with extreme performance goals are needed but achievable Strategic partnerships needed between major suppliers and HDD vendors Most wafer fabs share commonality of capital equipment, whereas slider fab tool sets are segregated. Lower cost would need commonality of capital equipment. New thinking in process integration can reduce cost. Strategic partnerships with key supplier for slider fab is essential. Veeco has established itself as a major supplier that provides enabling technology that meets COO expectations. Veeco s process and metrology products enable the most difficult of the components in the HDD: Advanced Slider Advanced Sensor Advanced Writer 24 12