Mobility and Miniaturization 3D WLI Microscopes Address Key Metrology Needs

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1 Mobility and Miniaturization 3D WLI Microscopes Address Key Metrology Needs

2 Outline Introductions Brief Overview of 3D Microscopes based on WLI General technology description Benefits and general applications Semiconductor Related Examples Semiconductor metrology (process monitoring, failure analysis, dimensional metrology) Summary 6/4/2014 Bruker Confidential 2

3 Introductions Bruker Nano Surfaces Division 3D Optical Microscopy Stylus Profilometry Tribology and Mechanical Testing Fluorescence Microscopy Scanning Probe Microscopy 6/4/2014 Bruker Confidential 3

4 Introductions Bruker Stylus and Optical Metrology Technology Leadership 60+ Patents 3 R&D 100 Awards 6 Photonics Circle of Excellence Awards Manufacturing Excellence Lean, six sigma-based process >100 systems/quarter capacity Rapid production ramp capability Bruker NSD SOM is a division of Bruker 6/4/2014 Bruker Confidential 4

5 Introductions Speaker Matt Novak, Ph.D. Director, Technology and Applications Stylus and Optical Metrology Joined Bruker 2011 (3+ years) Industry experience (17 years) optical engineering, fabrication and metrology Earned Ph.D. working in private sector metrology capital equipment (instrument design/assembly/test) 6/4/2014 Bruker Confidential 5

6 Who Will Benefit? Intended Webinar Audience People interested in fast, non-contact methods for imaging metrology in semiconductor related applications Those looking for metrology to monitor changes in surface topography from nm to µm scales with accuracy and repeatability Those unfamiliar with 3D microscopes based on WLI will gain understanding of this technique for quantitative surface measurements and imaging capabilities Those already familiar with 3D microscopes based on WLI introduced to some example applications where the technique may be new 6/4/2014 Bruker Confidential 6

7 Bruker 3D Optical Microscopes Produce Highly Accurate 3D Image of Areas of Interest Microscopes with special objectives used to provide sample height data Optics scanned vertically so sample is passed through focus Height data computed from this focus scan information 6/4/2014 Bruker Confidential 7

8 3D Optical Microscopes What is a 3D microscope, anyway?? Microscope with special objectives, scanned perpendicular to sample reflected interference signal processed to produce accurate height map Coherent light interference builds height map 6/4/2014 BRUKER CONFIDENTIAL 8

9 3D Microscope (Vertical Scanning, VSI) Image Acquisition Live Video View VSI Feature of Interest 6/4/2014 Bruker Confidential 9

10 Motivation for Accurate 3D Metrology Internet of Things, Mobility Internet of Things By 2020, up to 50,000,000,000 connections Mobility Means Smaller, Lighter, Thinner Miniaturization Means Increased vertical integration Manufacturing challenges Increased demand for metrology

11 Vertical Integration Interposers Advance 2.5D and 3D Packaging Wires limit connections, Power consumption Build up Substrates 3D stacked Die TSV direct connections, power consumption lower Si and TSV Glass, TGV (high frequency, RF, isolation)

12 Packaging Advances + Challenges Management of Obstacles Thermal (dissipation, stress) Electrical Fraunhofer IZM Mechanical (stability, reliability, TSV) Fabrication Dimensional Accuracy and Failure Analysis

13 Packaging Advances + Challenges Failure analysis increasingly important Define Scope of Problem Collect + Analyze Data IR Imaging, thermal imaging SEM inspection Optical, X-Ray, SPM, profiler 3D Microscopes Based on WLI Meets variety of metrology needs ASM International, 2011

14 3D Microscopes Based on WLI Excellent for Surface Imaging, FA FA, imaging traditional stacked die, wirebonding FA, IMC exploration advanced packaging will have other needs

15 3D Microscopes Based on WLI Failure Analysis - Surface Imaging SEM, XRM used for advanced packaging internal analysis Fast, easy inspection of surfaces afforded by 3D WLI Microscopes

16 3D Microscopes in Many Formats Panel Build Up Substrate Metrology Pad Clearance Circle Connect Overlay Trace Complex Via Auto Alignment & CD Surface Anchor MultiTrace Larger panel format 3D systems to enable metrology for 600 mm x 600 mm panels deploy for HDI-MCM substrate metrology

17 3D Microscopes Address Many Needs Trace CD, Heights

18 3D Microscopes Address Many Needs Via Protrusion, Recess

19 3D Microscopes Address Many Needs Cu Pillars, CD, Heights Larger UBM Microbumps

20 3D Microscope (Vertical Scanning, VSI) TSV/Etch Measurements 3D WLI Microscope

21 3D Microscopes Address Many Needs Trench Etch Depths and Widths, Others WLI 3D microscopes correlate to SEM sections for high aspect trenches Work to improve/enhance applications as needs evolve

22 Summary Drive to Miniaturize Promotes advances in 3D packaging Miniaturization WLCSP, 2.5D and 3D IC High demand for MCM/HDI substrates, good metrology Work ongoing, many ways by many organizations Thinner, lighter, faster less space, tolerances increase Increased Demand for Metrology 3D Microscopes based on WLI address multiple needs FA, development, CDs, heights, yield monitoring (IC substrates now, others in the future) 6/4/2014 Bruker Confidential

23 Questions? Thank you for your time today 6/4/2014 Bruker Confidential

24 Copyright Bruker Corporation. All rights reserved.