Electromagnetics. R14 Update. Greg Pitner ANSYS, Inc. February 24, 2012

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1 Electromagnetics R14 Update Greg Pitner 1

2 HFSS Version 14 2

3 HFSS Overview Advanced Integrated Solver Technologies Finite Arrays with Domain Decomposition Hybrid solving: FEBI, IE Regions Physical Optics Solver in HFSS IE Transient Finite Elements improvements Huray surface roughness model Usability Enhancement Radiated fields.. Network installation improvements 3D modeler improvements CAD Integration in Workbench Improved Multiphysics flow 3

4 Finite Arrays with Domain Decomposition Efficient solution for repeating geometries (array) with domain decomposition technique (DDM) ANSYS, Inc. February 24, 2012

5 A Review: Domain Decomposition Distributed memory parallel solver technique Distributes mesh sub domains to network of processors Significantly increases simulation capacity Highly scalable to large numbers of processors Automatic generation of domains by mesh partitioning User friendly Load balance Hybrid iterative & direct solver Multi frontal direct solver for each subdomain Sub domains exchange information iteratively via Robin s transmission conditions (RTC) Distributes mesh sub-domains to networked processors and memory 5

6 Finite Arrays Solve large finite array designs Efficient setup and solution Define unit cell and array dimensions Efficient geometry creation and representation Efficient Domain Decomposition solution Leverages repeating nature of array geometries Only mesh unit cell Virtually repeat mesh throughout array Post process full S parameter Couplings included Edge effects included 3D field visualization Far field patterns for full array Memory efficient Enabled with the HFSS HPC product 6

7 Finite Arrays by Domain Decomposition Each element in array treated as solution domain One compute engine can solve multiple elements/domains in series Distributes element sub-domains to networked processors and memory 7

8 Example: Skewed Waveguide Array 16X16 (256 elements and excitations) Skewed Rectangular Waveguide (WR90) Array 1.3M Matrix Size Using 8 cores 3 hrs. solution time 0.4GB Memory total Using 16 cores 2 hrs. solution time 0.8GB Memory total Additional Cores Faster solution time More memory. Unit cell shown with wireframe view of virtual array 8

9 Skewed Waveguide Array Patterns from 8X8 Array Dashed is idealized infinite array analysis Solid from finite array analysis Two simulations use identical mesh Note edge effects due to finite array size 9

10 Efficient: 8X8 Array Patch Array Direct solver with 12 cores 5:05: GB RAM Finite Array with 12 cores 00:44: GB 10

11 Hybrid Finite Element Integral Equation Method Finite Element Based Method HFSS Efficient handle complex material and geometries Volume based mesh and field solutions Airbox required to model free space radiation Conformal radiation volume with Integral Integral Equation Based Method Equations HFSS IE Efficient solution technique for open radiation and scattering Surface only mesh and current solution Airbox not needed to model free space radiation This Finite Element-Boundary Integral hybrid method leverages the advantages of both Finite methods Elements to achieve vs. Integral the most Equations accurate and robust solution for radiating and scattering problems 11

12 HFSS Hybrid Solving Hybrid Solving introduced in HFSS 13 with FEBI A highly accurate solution for open boundary problems Accurate: Solves directly for equivalent surface currents on boundary conditions Efficient: Conformal arbitrary shape BC to reduce FEM solution domain Reflectionless: can be placed closed to radiating surface. Does not have to be continuous: provides possibility of physically separate FEM volumes 12

13 HFSS Hybrid Solving IE Regions Parallelized IE regions solved in parallel. Analogous to FEM domains Rigorous Multiple reflection Automated 13

14 IE Dielectric Regions Solve large homogeneous blocks of dielectric with a boundary condition Replace enclosed arbitrary dielectrics Solve with multiple open or enclosed IE regions Conducting IE regions may be inside dielectric IE regions Antenna Ground Penetrating Radar Air Surface Soil Mine FEM Enclosed IE Conducting IE Different solution domains may be solved in parallel with DDM 14

15 HFSS IE PO Asymptotic solver for extremely large problems In HFSS IE Solves electrically huge problems Currents are approximated in illuminated regions Set to zero in shadow regions No ray tracing or multiple bounces Target applications: Large reflector antennas RCS of large objects such as satellites Option in solution setup for HFSS IE. Sourced by incident wave excitations Plane waves or linked HFSS designs as a source 15

16 PO Solver in HFSS-IE 14 PE C Where: J PO = 2(n x H inc ) PO assumes the fields on all illuminated surface are the incident fields Effects of the scatterers are included by assuming the incident fields are scattered at each point on the body as if it were reflected from an infinite tangent plane at that point; J~2(n x H inc ) for PEC. For non-illuminated surfaces the J are set to zero. 16

17 PO Examples Notice the shadowing of the gun barrel on the tank and the tank on the ground. 17

18 HFSS IE PO Example Offset reflector 50 λ 0 in diameter fed by a horn HFSS far field link Simulated with 8 cores IE: 48.3min and 11.9GB PO: 23S and 286MB Note > 120x speedup 18

19 Huray Surface Roughness Model Realistic loss model for rough conductor surfaces 19

20 Save Radiated Field Data Only Reduces the amount of data stored on hard drive for large antenna problems Setting in Solution Setup, Advanced Tab: discrete and fast sweeps ~10X Reduction 20

21 Import List Entry for Edit Sources Easy input for magnitude and phase from source list Can include parametric variables 21

22 Interpolating Sweep Passivity Interpolating sweep algorithm can check for passivity during the sweep and solve at any interpolated points found to be nonpassive 22

23 Show Nets Show Nets identifies 3D conducting paths between terminals 23

24 Designer Version 7 24

25 Designer Overview Parameterized padstacks Automated causal material Multi frequency point adapting Integrated 2D/3D views Huray surface roughness models Lumped Port De embedding Trapezoidal trace cross sections Automated Virtuoso HFSS Design Passivity enforced interpolation HFSS Solves from within Cadence User defined outputs IBIS AMI enhancements 25

26 HFSS Solver on Demand in Designer Set up project within 2D layout environment of Designer Layers, vias, PCB oriented geometry primitives Easy port creation Simulate with the 3D HFSS engine 26

27 Parameterized Padstacks Enables parametric investigation of via geometry, or optimization. Applied to global padstack definition. Therefore, project variables are used: 27

28 Parameterized Differential Vias 28

29 Layout Editor Enhancements Parameterizable Etch Factor Automatic Causal Djordjevic Sarkar Dielectric Models Parameterizable Surface Roughness 29

30 HFSS Setup & Solve Within Cadence Create and Solve models with HFSS from within Cadence Allegro, APD, & SiP HFSS Solution Progress 30

31 Also DDR2/3 Timing Specifications 31 Information source: JEDEC specification JESD79-3

32 User Defined Outputs UDO s are a way of calling Python scripts from within the Designer GUI Python is an intuitive and powerful scripting language with a large scientific and engineering user base Perform custom analyses on simulation waveforms A Python script can be written to arbitrarily postprocess waveforms 32

33 Creating a UDO based Report Once a UDO is set up, its results can be accessed like an ordinary output 33

34 DDR3 Calculations With UDO Voltage and timing margins can be printed in Data Table format within the Designer GUI 34

35 Macro Modeling with Network Data Explorer New! Touchstone Models from Arbitrary Source can be converted to Multiple Model Types with Causality and Passivity Enforcement! Advanced features 35

36 High Speed Serial Design with IBIS AMI Automated IBIS AMI Importing IBIS AMI Specification Testing Pass/Fail Advanced 36

37 User Defined Transmit Jitter for HSS Design PDF vs. time defined in a text file No jitter Contents of text file userdefined.txt 37

38 SIwave Version 6 38

39 Memory and High Speed Serial Improvements 39 Solver Signal Net Analyzer Ideal and non ideal lumped parameters (i.e Zo) Nexxim and HSPICE RLC simulations Via to Via Coupling Differential pair accuracy improvements Solver Support for Arbitrary Antipad Cutouts Improvement in via modeling accuracy SYZ Solver Improvements Guaranteed passive/causal SYZ solutions FWS Improvements for Large Port Count Devices Faster convergence and reduced RAM when using Iterated Fitting of Passivity for large port count devices Improved Push Excitation Accuracy & Robustness SIwave now forces required interpolation from Designer 7.0. Improved Surface Roughness Added Huray surface roughness model PI Advisor Improvements Genetic Algorithm supports weighting of constraints Genetic Algorithm supports new constraints Maximum Total Capacitor Area Maximum Number of Capacitor Types Improved SYZ Storage Architecture 6x reduction in disk space for SYZ parameters 64 bit GUI for Windows Table Impedance Calculator Flight time plots Transient Simulations with Nexxim or HSPICE PKG & PCB Automation Graphical selection & merging Pin Grouping Automation Multi part select with group per part/net definitions Improved Validation Checker Detection of pins belonging to multiple pin groups Automated DCIR Reports Equipotential Pads for DCIR Solver Temperature Profile Plotting from Icepak Improved Surface Roughness Addition of Huray model in GUI PI Advisor Improvements Allowance of weighting constraints in GUI Additional constraints added Maximum Total Capacitor Area Maximum Number of Capacitor Types Improved ODB++ Support GUI Support for X2Y Low Inductance Capacitors

40 Via Enhancements Improved handling of complex via antipad geometry Capture of direct via to via coupling 40

41 Huray Surface Roughness 41

42 DDR3 Solutions: Signal Net Analyzer Displays Z 0, length, time delay, and reference layer All possible paths (from each pin to every other pin on net) are displayed Sorted in descending order of path distance User can click on an individual path in the table Variation in Z0 is graphically displayed Path is highlighted in SIwave s main layout window Ideal reference layer mode (default) Traces on top & bottom metal layers are assumed to be microstrips Interior traces are assumed to be striplines Non ideal reference layer mode Reference layer is explicitly calculated for each trace segment Some traces may be floating (no suitable reference layer available) 42

43 Automated DCIR Reporting Automatically generate a formatted report for DC IR drop simulations 43

44 Equipotential Pads for DCIR Power Density Plot: Without Pad Power Density Plot: With Pad Current Density Plot: Without Pad Current Density Plot: With Pad 44

45 Q3D Version 11 45

46 Q3D Extractor Overview Major Applications 64 Bit Windows GUI Magnetic Materials Terminal Setup Improvements for AC RL Solver Touch Panel Expression Caching for CG and RL Selectable Frequency Export for Lumped SPICE Passives DCRL Speed Up CG Convergence improvements HPC Improvements Network Installs Fixed Variables Greatly improves post processing speed for projects with large numbers of variables i.e. Via Wizard 3D Modeling Enhancements WB Integration Improvements for DSO & Optimetrics 46

47 Touch Screen Accuracy Improvements Added the ability to converge on off diagonal terms with Touch Panel displays 47

48 Magnetic Materials Simulation Time Q3D AC 10 s Maxwell3D 50 min Q3D DC 6min 30 s Sweep 2 s Total < 7 min 50 min Peak RAM 0.6 GB 5 GB Electroplated Nickel has 5 Bulk Nickel has

49 3D Modeler Enhancements View customization. Z-stretch. 64 bit user interface 49