HFSS for ECAD: Package Modeling, MMIC and on-die extraction
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1 HFSS for ECAD: Package Modeling, MMIC and on-die extraction Alain Michel Technical Director, Europe 2010 ANSYS, Inc. All rights reserved. 1 ANSYS, Inc. Proprietary
2 Agenda Introduction HFSS integrated Solver on Demand (SoD) in Detail Create a project from A to Z Project examples MMIC application with UMS PH15 design kit Design Kit with HFSS SOD Package Simulation Conclusion 2010 ANSYS, Inc. All rights reserved. 2 ANSYS, Inc. Proprietary
3 Introduction 2010 ANSYS, Inc. All rights reserved. 3 ANSYS, Inc. Proprietary
4 Why HFSS in Ansoft Designer? MCAD (Mechanical Computer-Aided Design) vs. ECAD (Electronic Computer-Aided Design) HFSS application can be mostly split into two families: Application originally designed with MCAD: Antennas, Connector, Wave Guide, filters Application originally designed with ECAD: PCB, RFIC, MMIC, Planar Antenna, Package HFSS original GUI perfectly address MCAD application needs HFSS SoD provides a new interface for ECAD application 2010 ANSYS, Inc. All rights reserved. 4 ANSYS, Inc. Proprietary
5 HFSS SoD Overview Available with Ansoft Designer 6.0 2D layout design entry Import from APD, ODB++ Full custom layout Layers stackup definition Easy of Use with setup automation Easily toggle between FEM and MOM solvers Support scripted footprint HFSS technology for reliable and accurate models Adaptative meshing 3D Objects: wirebonds, arbitrary shaped vias Finite dielectric Support for multimoded wave ports and gap sources 2010 ANSYS, Inc. All rights reserved. 5 ANSYS, Inc. Proprietary
6 HFSS SoD in Detail 2010 ANSYS, Inc. All rights reserved. 6 ANSYS, Inc. Proprietary
7 Stackup Definition Standard HFSS design entry uses 3D Object HFSS in Designer combine 2D drawing with stackup definition Port2 + Port4 = 2010 ANSYS, Inc. All rights reserved. 7 ANSYS, Inc. Proprietary
8 Easy and Automated Port Setup Define port by selecting edge Solver specific properties HFSS gap or wave port available 2010 ANSYS, Inc. All rights reserved. 8 ANSYS, Inc. Proprietary
9 Wave Port Setup Size setup Deembeding available PEC launch allows wave port inside air box 2010 ANSYS, Inc. All rights reserved. 9 ANSYS, Inc. Proprietary
10 Boundaries Setup Radiation Boundary for air box Dielectric size setup Air box size setup 2010 ANSYS, Inc. All rights reserved. 10 ANSYS, Inc. Proprietary
11 HFSS Solution Setup Solution Frequency Adaptive solution Mixed order elements and iterative solver available 2010 ANSYS, Inc. All rights reserved. 11 ANSYS, Inc. Proprietary
12 Y1 Post-Processing Rectangular, smith chart plots Current, far and near field display Meshing Ansoft LLC S11_12_dB spir2_20 ANSOFT Curve Info S12_3D_HFSS Setup HFSS_gap : Sw eep 1 S11_3D_HFSS Setup HFSS_gap : Sw eep F [GHz] Smith Chart Curve spir2_20 Info ANSOFT S(Port1,Port1) Setup HFSS_gap : Sw eep ANSYS, Inc. All rights reserved. 12 ANSYS, Inc. Proprietary
13 Package example From 2D to 3D Finite dielectric definition in stackup Use Bondwire type primitive Quick and easy port setup Display current 2010 ANSYS, Inc. All rights reserved. 13 ANSYS, Inc. Proprietary
14 Package example Current distribution 2010 ANSYS, Inc. All rights reserved. 14 ANSYS, Inc. Proprietary
15 Imported Package Example Import from APD/Allegro.mcm,.sip,.brd,.anx Import stackup and bondwire profile Setup solderball profile Automatically port setup for pin Cutout sub-design 2010 ANSYS, Inc. All rights reserved. 15 ANSYS, Inc. Proprietary
16 Y1 Spirale example 1 project 2 setup Ansoft LLC 0.00 S11_12_dB spir2_20 ANSOFT Curve Info S11_3D_MoM Setup 3D MoM edge : Sw eep S12_3D_MoM Setup 3D MoM edge : Sw eep 1 S12_3D_HFSS Setup HFSS_gap : Sw eep S11_3D_HFSS Setup HFSS_gap : Sw eep F [GHz] 2010 ANSYS, Inc. All rights reserved. 16 ANSYS, Inc. Proprietary
17 MMIC application with UMS PH15 design kit 2010 ANSYS, Inc. All rights reserved. 17 ANSYS, Inc. Proprietary
18 UMS Partnership Provide UMS PH15 Design Kit with passive component simulable with HFSS Includes parameterized footprint for MIM capacitor Spirale inductor Tan and TiWSi Resistors Vias Footprint are both valid for GDS export and HFSS simulation CapOnGrid_pF=0.998pF Port ANSYS, Inc. All rights reserved. 18 lint_um=60.5 ANSYS, Inc. Proprietary wint_um=50
19 What is a Design Kit? Technology file loads design kit components, layer definition and stackup Stackup is defined with regards to process technology definition given by foundry 2010 ANSYS, Inc. All rights reserved. 19 ANSYS, Inc. Proprietary
20 What is a Design Kit? (Continued) Components include Symbol, footprint and model 2010 ANSYS, Inc. All rights reserved. 20 ANSYS, Inc. Proprietary
21 Component example MIM capacitor Use parameters C, W, L To set equivalent circuit model parameter values Automatically draw DRC safe layout PHCAPN1 C=0.264pF W=28um CapOnGrid_pF=0.263pF wint_um=28 lint_um=28.5 Source UMS PH15 design guide 2010 ANSYS, Inc. All rights reserved. 21 ANSYS, Inc. Proprietary
22 Challenge Create parameterized footprint With respect to design rules defined for manufacturing With respect to physical design used for HFSS simulation Layer deposition Air bridges. Source UMS PH15 design guide 2010 ANSYS, Inc. All rights reserved. 22 ANSYS, Inc. Proprietary
23 Layer Definition Shape of the same layer is drawn twice User type for manufacturing (GDSII export) Signal, dielectric or ground for HFSS simulation Stackup definition validated with UMS Automatically loaded with the technology file 2010 ANSYS, Inc. All rights reserved. 23 ANSYS, Inc. Proprietary
24 Y1 Simulation results: MIM capacitor 0.26pf Good agreement with UMS model CapOnGrid_pF=0.263pF Port1 wint_um=28 lint_um=28.5 Port Name X Y m m m m Cap_value Cap_0_26pF_merge_nitride Curve Info cap_pf cap_pf_ums_model ANSOFT 0.60 m6 m m4 m Name Delta(Y) d( m4,m5 ) d( m6,m7 ) F [GHz] 2010 ANSYS, Inc. All rights reserved. 24 ANSYS, Inc. Proprietary
25 Y1 Spiral Inductor 1.91nh Port1 Port2 Ldrawn=1.902nH Ndrawn=4 Longdrawn=1760um Ansoft LLC Ind_Value_zoom Curve Info ind_nh_hfss ind_nh_ums_model Self_1_91nh ANSOFT F [GHz] ANSYS, Inc. All rights reserved. 25 ANSYS, Inc. Proprietary
26 Y1 Simple LPF 0.00 S Parameters LPF ANSOFT Curve Info db(s(port1,port1)) db(s(port2,port1)) F [GHz] Coupling between components No need of internal port 2010 ANSYS, Inc. All rights reserved. 26 ANSYS, Inc. Proprietary
27 PA simulation including Package effect 2010 ANSYS, Inc. All rights reserved. 27 ANSYS, Inc. Proprietary
28 Port3 Name=Vtot Name=I_Alim L nH V925 DC=Vcontrol R UMS HB20P V3.2 1uF C887 L912 5nH 5nH L893 PNUM=1 RZ=50ohm IZ=0ohm R R894 10nF 10nF C897 C922 L916 1nH 1nH L pF 120pF C907 C nH L nH L904 PNUM=2 RZ=50ohm IZ=0ohm Where do we start? Power Amplifier MMIC UMS HBT20 process CHA5012 from UMS Simulated in Ansoft Designer with UMS PDK developed in conjunction with UMS Device models include Temperature modification 0 0 Needs high volume packaging for large-scale production 0 V A 0 0 U4 External_Biasing_Ctrl2 0 U3 CHA ANSYS, Inc. All rights reserved. 28 ANSYS, Inc. Proprietary
29 db(gp) Y1 V2656 DC=Vbias A Name=Ibias PA Die Properties Ansoft LLC S21_Narrow CHA5012_Ext_biasing Curve Info S21 S11 S12 s22 ANSOFT Name X Y m m m m2 Curve Info PAE Pout Linear gain in db m m F [GHz] MX1: freq_in [GHz] Name X Y m Sweeptemp Curve Info temperac='-40' temperac='25' temperac='80' ANSOFT m1 CHA5012_Ext_biasing L2670 Port1 Port3 Port2 L nH 0.3nH PNUM=1 RZ=50ohm IZ=0ohm PNUM=2 RZ=50ohm IZ=0ohm F [GHz] 2010 ANSYS, Inc. All rights reserved. 29 ANSYS, Inc. Proprietary
30 PA Design using HFSS SOD This package is a dummy package created for this presentation 2010 ANSYS, Inc. All rights reserved. 30 ANSYS, Inc. Proprietary
31 Setup HFSS SOD simulation 2010 ANSYS, Inc. All rights reserved. 31 ANSYS, Inc. Proprietary
32 Y1 Y1 Package results XY Plot 2 finite_moldsize ANSOFT XY Plot 1 finite_moldsize Curve Info db(s(port4,port3)) HFSS Setup 1 : Sweep 1 db(s(port2,port1)) HFSS Setup 1 : Sweep 1 ANSOFT Curve Info db(s(port1,port1)) HFSS Setup 1 : Sweep 1 db(s(port2,port2)) HFSS Setup 1 : Sweep 1 db(s(port3,port3)) HFSS Setup 1 : Sweep 1 db(s(port4,port4)) HFSS Setup 1 : Sweep F [GHz] F [GHz] 2010 ANSYS, Inc. All rights reserved. 32 ANSYS, Inc. Proprietary
33 Port3 Name=Vtot Name=I_Alim L nH V925 DC=Vcontrol R UMS HB20P V3.2 1uF C887 L912 5nH 5nH L893 PNUM=1 RZ=50ohm IZ=0ohm R R894 10nF 10nF C897 C922 L916 1nH 1nH L pF 120pF C907 C nH L nH L904 PNUM=2 RZ=50ohm IZ=0ohm PA/Package cosimulation Link this HFSS model with Designer to determine packaged S-parameters 0 0 V A U4 External_Biasing_Ctrl2 0 U3 CHA ANSYS, Inc. All rights reserved. 33 ANSYS, Inc. Proprietary
34 Y1 Packaged Die 25 C Die was designed to take advantage of bondwire inductance Slightly lower gain and worse matching Ideal inductance used to model package bondwire does not correspond to dummy package use for this presentation. Ansoft LLC S parameters PA_nominal_package Curve Info S21 S11 S12 s22 ANSOFT Ansoft LLC PAE and and Linear Gain ANSOFT Name X Y m m m m2 Curve Info PAE Pout Linear Gain m F [GHz] MX1: freq_in [GHz] m ANSYS, Inc. All rights reserved. 34 ANSYS, Inc. Proprietary
35 Conclusion Target ECAD application 2D layout design entry Import from APD, ODB++ Full custom layout Easy and quick setup of an HFSS project HFSS technology for reliable and accurate models Adaptative meshing 3D Objects: wirebonds, arbitrary shaped vias Finite dielectric Support for multimoded wave ports and gap sources Availability of scripted footprint For UMS Design Kit Parameterized footprints combine physical and DRC safe layout HFSS 3D accuracy using 2D layout and physical stackup definition Extend passive model range using HFSS integrated in Ansoft Designer Include comprehensive component coupling analysis Automatic port setup and de-embedding 2010 ANSYS, Inc. All rights reserved. 35 ANSYS, Inc. Proprietary
36 Thank you 2010 ANSYS, Inc. All rights reserved. 36 ANSYS, Inc. Proprietary
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