Literacy for Integrated Circuit Reverse Engineering

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1 Literacy for Integrated Circuit Reverse Engineering Alex Radocea 1

2 Now bringing pain to the adversary at worked security at a large tech company worked security at matasano learned c and unix from swedish people at wargames.unix.se adc@intruded.net 2

3 Thanks John McMaster (siliconpr0n.org, uvicrec.blogspot.com) siliconzoo.org (SRLabs) Andrew Zonenberg Ekoparty Wouldn t be possible without John McMaster 3

4 Integrated Circuits Circuit.htm 5-component oscillator 4

5 Intel First x86 chip > 1 M transistors µm process size Source: John McMaster doku.php?id=mcmaster:intel:80486dx &s[]=map 5

6 Why reverse ICs? 6

7 Go lower level 7

8 Professionals Extracting and selling expensive secrets Security analysis IP Litigation Competitive Research Chip Art Shared Cryptographic Fuses secrets Algorithms Sidechannels Secret functionality Algorithms Fabrication techniques Layout tricks Materials Composition Fun and Mischief Unlocking Modding Simulators Hobbyists 8

9 Communities await you academic resources blogosphere archives: siliconzoo, siliconpr0n, visual6502 open source tools & software below it is physics below that only math 9

10 Decapsulation 10

11 Let s talk packaging 11

12 Single Inline Package 12

13 Double Inline Package 13

14 Surface Mount 14

15 Ball Grid Array Kl_Intel_Pentium_MMX_embedded_BGA_Bottom.jpg/220px- Kl_Intel_Pentium_MMX_embedded_BGA_Bottom.jpg 15

16 More... List_of_integrated_circuit_packaging_types 16

17 Unpackaging red_present_box_wrapped.jpg 17

18 DANGER: Safety Risks 18

19 Heat 19

20 Source: John McMaster uvicrec 20

21 Approaching Boiling Point 21

22 22

23 Friction 23

24 Lots of dremelling... Source: John McMaster uvicrec 24

25 25

26 26

27 27

28 Acid 28

29 Andrew Zonenberg 74LS154N 980s vintage 74LS154 4-to-16 demultiplexer, packaged in a PDIP 29

30 30

31 Gold bonding wires appear 31

32 32

33 This is suitable for live analysis, no damage to die 33

34 Delayering Circuit.htm 34

35 Silicon ingots 35

36 Polycrystaline Silicon Polysilicon Supply.jpg 36

37 Silicon Layer Cake Protective Glass Layer Metal Layers Vias Polysilicon Diff uss ion Lay ers Si Substrate Wells Si Main substrate 37

38 CMOS cross-section 500px-Cmos_impurity_profile.PNG 38

39 Bonding wires Source: John McMaster semipol/ ad534 39

40 Bonding wires Source: John McMaster semipol/ ad534 39

41 Bonding pads Source: John cmaster 24c02 40

42 Bonding pads Source: John cmaster 24c02 40

43 Metal routing Source: John McMaster 24c02 41

44 Cell routing: Metal Source: ohn McMaster Sidoku /03/sidoku-1.html 42

45 Cell routing: Metal Source: ohn McMaster Sidoku /03/sidoku-1.html 42

46 Cell routing: Metal Source: ohn McMaster Sidoku /03/sidoku-1.html 42

47 Cell routing: Polysilicon Source: John McMaster Sidoku 43

48 Cell routing: Polysilicon Source: John McMaster Sidoku 43

49 Cell routing: Vias Source: John McMaster Sidoku 44

50 Cell routing: Vias Source: John McMaster Sidoku 44

51 Cell routing: Vias Source: John McMaster Sidoku 44

52 Cell routing: Vias Source: John McMaster Sidoku 44

53 Cell routing: Vias Source: John McMaster Sidoku 44

54 Diffusion layers Source: John McMaster 24c

55 Diffusion layers Source: John McMaster 24c

56 Diffusion layers Source: John McMaster 24c

57 Background knowledge 46

58 Charge carriers Electrons Holes Negative charge Positive Charge Typically less effective mass Move in direction of current Typically more effective mass Move in opposite direction of current 47

59 Voltage nodes 48

60 Open 49

61 Closed 50

62 No active current between equipotential nodes 51

63 Parallel vs Series

64 PMOS: Gate active low Vin Vout X 53

65 PMOS: Gate active low Vin Vout Vin = X 53

66 PMOS: Gate active low Vin Vout X 53

67 PMOS: Gate active low Vin Vout 0 1 Vin = 1 1 X 53

68 NMOS: Gate active high Vin Vout 0 X

69 NMOS: Gate active high Vin = 0 Vin Vout 0 X

70 NMOS: Gate active high Vin Vout 0 X

71 NMOS: Gate active high Vin = 1 Vin Vout 0 X

72 Combine for CMOS Inverter Vin Vout

73 Silicon zoo inverter 56

74 Metal 57

75 Metal 57

76 Power rails 58

77 Power rails 58

78 Vias 59

79 Vias 59

80 Vias 59

81 Polysilicon 60

82 Polysilicon 60

83 Diffusion 61

84 Diffusion -channel 61

85 Diffusion -channel N- channel 61

86 Silicon zoo inverter A Y 62

87 Silicon zoo inverter A Y 62

88 Silicon zoo inverter A Y 62

89 Silicon zoo inverter A Y 0 62

90 Silicon zoo inverter A Y 0 62

91 Silicon zoo inverter A Y

92 Silicon zoo inverter A Y

93 Silicon zoo inverter A Y

94 Silicon zoo inverter A Y

95 Silicon zoo inverter A Y

96 CMOS NAND 63

97 CMOS NAND Parallel 63

98 CMOS NAND Parallel Series 63

99 Silicon zoo NAND 64

100 Metal 65

101 Metal 65

102 Power rails 66

103 Power rails 66

104 Vias 67

105 Vias 67

106 Polysilicon 68

107 Polysilicon 68

108 Diffusion 69

109 Diffusion 69

110 Diffusion 69

111 Silicon zoo NAND A B Y

112 Silicon zoo NAND A B Y

113 Silicon zoo NAND A B Y

114 Silicon zoo NAND A B Y

115 Silicon zoo NAND A B Y

116 Silicon zoo NAND A B Y

117 Silicon zoo NAND Parallel A B Y

118 Silicon zoo NAND Parallel A B Y Series

119 Silicon zoo flip flop not so easy solvers whiteboarded this one! 71

120 Simulation with Magic CAD Convert image to polygons Simulate siliconzoo.org/tutorial.html 72

121 73

122 74

123 Completed drawing 75

124 Getting real Need a scientist Need tools Need to write software 76

125 DYI Imaging Costs Technology µm Cost Eyes 1000 Free Metallurgical microscope Desktop SEM Used SEM $1,000- $10,000 $25,000- $70,000 $50,000 - $250,000 p3x 22nm FIB - circuit editor $1-5M 77

126 Automated capture Automated stage and image capture Details: leveling fishbowl effect feature detection for stitching 78

127 Image recognition tasks Automated routing Polygon translation 79

128 Open Communities siliconpr0n.org siliconzoo.org visual6502.org opencircuitdesign.com 80

129 Software Magic & IRSIM: opencircuitdesign.com DeGate: degate.org Hugin: KLayout: 81

130 Preguntas? 82

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