Sample Table of Contents

Transcription

1 Sample Table of Contents from System-on-Chip (SoC) For any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Functional Analysis Table of Contents 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Device Summary 1.5 Observed Critical Dimensions 2 Device Identification 2.1 Package 2.2 Die 3 Process Functional Block Measurements 4.3 Analog, Standard Cell, Memory, and I/O vs Die 5.1 Analog Functional Block Analysis 5.2 Analog Block Measurements 5.3 Plan-View and Functional Analysis 6.1 Memory Block Analysis 6.2 Memory Block Measurements 6.3 Plan View of the 6T SRAM 6.4 Plan View of the Complex Memory Array 6.5 Plan View of the 10T SRAM 7.1 Standard Cell Block Analysis 7.2 Plan View of the 2 Input NAND Gate Cell 7.3 Gate Count Analysis 8 Statement of Measurement Uncertainty and Scope Variation

3 Overview List of Figures 2 Device Identification Digital Media Player Top Digital Media Player Bottom Digital Media Player Front Digital Media Player Back Media Player Main Circuit Board Chip on Main PCB Package Top Package Bottom Package X-Ray Die Photograph Die Markings A Die Markings B Die Corner Minimum Pitch Bond Pads 3 Process General Device Structure Minimum Pitch Metal Minimum Gate Length Transistor Minimum Contacted Gate Annotated Die Photograph Functional Blocks Annotated Die Photograph Analog Blocks Analog Block AN 1 Metal Analog Block AN 2, Left Side Metal Analog Block AN 2, Right Side Metal Analog Block AN 3 Metal Analog Blocks AN 4 Metal Analog Block AN 5 Metal Analog Blocks AN 6 Metal Analog Block AN 7 Metal Analog Block AN 8 Metal Analog Block AN 9 Metal Analog Block AN 10, Left Side Metal Analog Block AN 10, Right Side Metal Analog Block AN 11 Metal 1

4 Overview Annotated Die Photograph Memory Blocks T SRAM Memory Bank Metal T SRAM Memory Cell Metal T SRAM Memory Cell Polysilicon Complex Memory Array Metal Complex Memory Array Memory Cell Metal Complex Memory Array Memory Cell Polysilicon T SRAM Memory Bank Metal T SRAM Memory Cell Metal T SRAM Memory Cell Polysilicon Annotated Die Photograph Standard Cell Blocks Input NAND Gate Cell Metal Sample Standard Cell Area Metal List of Tables Device Identification Device Summary Observed Critical Dimensions Functional Block Measurements Block Type Comparison Measurements Analog Block Measurements Memory Block Measurements Standard Cell Gate Count Analysis

5 Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com