Broadcom BCM7405 HD Video/Audio System-on-Chip (SoC)

Transcription

1 Broadcom BCM7405 HD Video/Audio System-on-Chip (SoC) For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Incorporated This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. FAR CYRKJC Revision 1.0 Published: March 4, 2009

3 Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Device Summary 1.6 Observed Critical Dimensions 2 Device Identification 2.1 Package 2.2 Die 3 Process 3.1 Overview Overview 4.2 Functional Block Measurements 4.3 Analog, Standard Cell, Memory, and I/O vs Die 5 Analog 5.1 Analog Functional Block Analysis 5.2 Analog Block Measurements 5.3 Plan-View and 6 I/O Analysis 6.1 I/O Block Analysis 6.2 I/O Block Measurements 6.3 Plan-View and 7 Memory Analysis 7.1 Memory Block Analysis 7.2 Memory Block Measurements 7.3 Plan View of the 6T SRAM 7.4 Plan View of the Complex Memory Array 7.5 Plan View of the 10T SRAM

4 8 Standard Cell Analysis 8.1 Standard Cell Block Analysis 8.2 Plan View of the 2 Input NAND Gate Cell 8.3 Gate Count Analysis 9 Inductor 9.1 Inductor Measurement 10 References 11 Statement of Measurement Uncertainty and Scope Variation Report Evaluation

5 Overview Overview 1.1 List of Figures 2 Device Identification WIRE MediaPoint Digital Media Player Front View WIRE MediaPoint Digital Media Player Bottom View WIRE MediaPoint Digital Media Player Frontside View WIRE MediaPoint Digital Media Player Backside View WIRE MediaPoint Digital Media Player Main Circuit Board BCM7405 Chip on Main PCB Package Top Package Bottom Package X-Ray Die Photograph Die Markings A Die Markings B Die Corner Minimum Pitch Bond Pads 3 Process General Device Structure Minimum Pitch Metal Minimum Gate Length Transistor Minimum Contacted Gate Annotated Die Photograph Functional Blocks 5 Analog Annotated Die Photograph Analog Blocks Analog Block AN 1 Metal Analog Block AN 2, Left Side Metal Analog Block AN 2, Right Side Metal Analog Block AN 3 Metal Analog Blocks AN 4 Metal Analog Block AN 5 Metal Analog Blocks AN 6 Metal Analog Block AN 7 Metal Analog Block AN 8 Metal Analog Block AN 9 Metal Analog Block AN 10, Left Side Metal Analog Block AN 10, Right side Metal Analog Block AN 11 Metal 1

6 Overview I/O Analysis Annotated Die Photograph I/O Blocks I/O Block Type I/O 1 Metal I/O Block Type I/O 2 Metal I/O Block Type I/O 3 Metal I/O Block Type I/O 4 Metal I/O Block Type I/O 6 Metal I/O Block Type I/O 7 Metal I/O Block Type I/O 8 Metal I/O Block Type I/O 8 Metal 1 7 Memory Analysis Annotated Die Photograph Memory Blocks T SRAM Memory Bank Metal T SRAM Memory Cell Metal T SRAM Memory Cell Polysilicon Complex Memory Array Metal Complex Memory Array Memory Cell Metal Complex Memory Array Memory Cell Polysilicon T SRAM Memory Bank Metal T SRAM Memory Cell Metal T SRAM Memory Cell Polysilicon 8 Standard Cell Analysis Annotated Die Photograph Standard Cell Blocks Input NAND Gate Cell Metal Sample Standard Cell Area Metal 1 9 Inductor BLK 15 Tuner Circuit with Inductor Top Metal Layer Inductor Top Metal Layer

7 Overview List of Tables 1 Overview Device Identification Device Summary Observed Critical Dimensions Functional Block Measurements Block Type Comparison Measurements 5 Analog Analog Block Measurements 6 I/O Analysis I/O Block Measurements 7 Memory Analysis Memory Block Measurements 8 Standard Cell Analysis Standard Cell Gate Count Analysis