Practical BEAMER Applications for the Heidelberg DWL 66 +

Transcription

1 Practical BEAMER Applications for the Heidelberg DWL 66 + Gerald Lopez, PhD Lithography Manager Penn Engineering School of Engineering Singh Center and for Applied Nanotechnology Science Singh Center for Nanotechnology EIPBN 2016 BEAMeeting

2 Outline Singh Center for Nanotechnology About the Heidelberg at Penn BEAMER and the Heidelberg DWL 66+ Applied Best Known Methods Summary

3 Singh Center for Nanotechnology Cleanroom Quattrone Nanofabrication Facility Scanning Probe Scanning & Local Probe Facility Electron Microscopy Nanoscale Characterization Facility

4 Heidelberg DWL 66 + at Penn Brief Tool Overview

5 Introduction Windows 7 Workstation DWL 66+ Additional Write heads and Chucks Accepted: May 2015 Single 355nm laser with 3 write modes

6 Heidelberg DWL 66+ Power Filter Stage Chuck Write Head

7 Heidelberg DWL 66+ Lens [mm] Feature Size [μm] Stripe Width [μm] 2 < 1μm > 1μm > 10μm 600

8 Heidelberg DWL or 7 photomask AZ1505 TOK IP3500 Direct write on samples Resist: SPR220, S1800, SU-8 Substrates Si/SOI wafers/pieces Diamond Glass slides More Filters

9 Heidelberg DWL 66 + and BEAMER Data Prep Overview

10 BEAMER and the Heidelberg DWL 66 + Lens [mm] Feature Size Stripe Width [μm] Resolution [μm] (Pixel Size) Number of Pixels per Stripe 2 < 1μm > 1μm > 10μm

11 Exposure Strategy

12 1. Import the GDSII 2. Extract the layers to expose (optional) 3. Heal the pattern if there are overlaps (optional) 4. Transform Center the pattern Flip about Y (for mask writing) 5. Export to the Heidelberg HIMT (DWL 66+ format) Basic BEAMER Flow (SOP) Users are instructed to create this default flow from our SOP.

13 Possibilities Are Endless

14 and sometimes fun.

15 Best Known Methods Multipass Tolerate Stitching Reduce Line Edge Roughness Optimize CD Uniformity Write Time Optimization Long Write Times = Smaller Write Lens Short Write Time Larger Write Lens Fewer Stripes

16 Multipass (n-over) + BEAMER Extending the Capabilities of the 40mm Write Head

17 Multipass (n-over) + BEAMER Lens [mm] Feature Size [μm] Stripe Width [μm] 2 < 1μm > 1μm > 10μm 600

18 Why Multipass? Stripe Boundary Last (rightmost) line in first stripe First (leftmost) line in second stripe

19 2X Multipass: CD Uniformity

20 3X Multipass: CD Uniformity Stripe boundaries are virtually undetectable

21 4X Multipass: 40mm Write Head MicroChem S1805 Resist 450 4X Multipass Contrast Curves S um Line-Space Exposure Latitude Resist Height [nm] % 20% 30% 40% 50% 60% 70% 80% 90% 100% Intensity Line Width [microns] Intensity [%]

22 4X Multipass: 40mm Write Head Lens [mm] Feature Size [μm] Stripe Width [μm] 2 < 1μm > 1μm > 10μm 600 >4um MicroChem S1805 Resist Line Width [microns] um Line-Space Exposure Latitude Intensity [%]

23 Write Time Optimization Extending the Capabilities of the Heidelberg DWL 66 +

24 Write Time Optimization Lens [mm] Feature Size Stripe Width [μm] 5 Mask Write Time 2 < 1μm 30 ~4 days 10 > 1μm hours 40 > 4μm minutes Write Time Optimization (WTO) Intelligent Stripe Management (ISM) Bulk-Sleeve

25 Intelligent Stripe Management

26 Intelligent Stripe Management

27 10mm WH Job Estimate: 3 hrs 10mm WH ISM Actual: 1.25 hrs Intelligent Stripe Management Exposure time reduction: 58%

28 Dark Field Mask: 10mm WH 15 minute write time

29 Bright Field Mask: 10mm WH 3 hour write time

30 Bulk-Sleeve

31 Bulk-Sleeve 10mm Write Head 40mm Write Head 300um Overlap

32 Result Write Time 10mm: 3 hours Bulk-Sleeve: 35 minutes 10mm: 20 min 40mm: 15 min Exposure time reduction: 81%

33 Heidelberg DWL 66+ at Penn Lens [mm] Feature Size Stripe Width [μm] Resolution [μm] (Pixel Size) BEAMER extends the capabilities of the Heidelberg DWL 66 + Optimized CD uniformity through multipass Optimized minimum CD for the 40mm write head Optimized write time via intelligent data-prep (by as much as 80%) Number of Pixels per Stripe 2 < 1μm > 1μm > 4μm Summary 33