Silicon Photonics System Integration by Ultra High Precision Photonic Packaging Techniques

Transcription

1 Silicon Photonics System Integration by Ultra High Precision Photonic Packaging Techniques Dr. Henning Schröder, Fraunhofer IZM Dr. Henning Schröder Fraunhofer IZM, Berlin fon: , fax:

2 Outlook Motivation: More than Moore! Challenges Small form factor Sub micron assembly precission Fiber coupling Out of plane coupling using grating couplers Butt coupling using tapered waveguide structures Automation capabilities Summary

3 More than Moore ITRS roadmap update 2008: Optical interconnect on chip and chip to chip within a SiP has been added as a volume technology in 2011

4 Trends in High Performance Computing (HPC) H.J.S. Dorren, P. Duan and O. Raz, COBRA Eindhoven Univ. of Technol., R. P. Luijten, IBM Research GmbH, Rüschlikon, Switzerland

5 Roadmap Copper Optics and Silicon Photonics Source: INTEL Dr. M. Paniccia

6 What is Silicon Photonics? Anthony (Tony) Lentine, Sandia National Labs, PO Box 5800, Albuquerque, NM 87185, Photonics West 2012

7 Silicon Photonics: CMOS Integration Anthony (Tony) Lentine, Sandia National Labs, PO Box 5800, Albuquerque, NM 87185, Photonics West 2012

8 The Problem The fiber-to-chip coupling problem. Optical fiber and nanophotonic SOI waveguide drawn on same scale. (a)grating coupler (b) inverted taper in SOI

9 Grating coupler Schematic of a conventional SOI grating coupler and its main design parameters. SEM image of fabricated gratings Schematic of the layout for the fabrication of the designed SOI grating couplers.

10 Alignment Setup Scheme of the measurement setup.

11 Passive optical chip chip assembly on fiber array

12 Grating coupler a b c Optical micrograph (a) top, (b) front and (c) side views of the SOI chip with the fiber array taken during the alignment procedure..

13 Alignment Setup

14 Passive optical chip before capping

15 Passive optical chip after capping

16 Generic Silicon Photonics Packaging Test bed: g-pack Generic silicon photonics package 32 optical I/Os 64 electrical connections (LF) Suited also for testbed applications Standard PGA

17 Vertical to horizontal using grating couplers?! High profile packaging solution for silicon PICs with vertical coupling fiber array optical interconnection. Subassembly for orientation change. Legenda: a) fiber-array with in/out fibers, b) SOI component, c) ceramic or silicon substrate with metalisation lines and pads. Package design concept with a butterfly package.

18 ElectronicCMOS chip Final aspect of the designd packege concept with a butterfly package Photo on the final fabricated demonstrator. Submount detail of the designd packege concept

19 UV gluing of angled fiber arrays 8 Fiberarray Bond Pads

20 epixnet Silicon Photonic Chip coupling new coupling structure based on the inverted taper Group IV Photonics, th IEEE International Conference on SEM: V-Groove and waveguide SEM: 4 V-Groove

21 Experimental results Silicon- Chip V-Groove with Fibre Assembled with Hexapod Inverted taper Experimental and simulation results for TE polarization. Microscope: 2 V-Groove, 1 Fibre

22 Glass Packaging Concept glasspack TGV glass interposer Single-mode optical high-speed interconnects Platform for photonic integrated circuits (PIC) Embedded glass core layer in the electricaloptical circuit board (EOCB) Fiber Connector EOCB Interposer PIC Lens TGV Interlayer beam Mirror Waveguide Glass Panel Processing for Electrical and Optical Packaging H. Schröder, L. Brusberg, N. Arndt-Staufenbiel, J. Hofmann, S. Marx, Fraunhofer IZM, Berlin, Germany, Technische Universität Berlin, Germany, ECTC 2011 Laser Dia

23 Waveguide Process Flow Single Mode Waveguide Process Waveguide Circuit Design Waveguide Mask Process Waveguide Diffusion Process End-face Preparation Waveguide Characterization Waveguide Waveguide Microscope picture of end-face with two stimulated waveguides having pitch of 250 µm Insertion loss of 9cm waveguide sample

24 Sub-micron automated assembly Assembly unit (courtesy of ficontec GmbH) Pick-up-tool and HPLD during active alignment

25 Silicon Photonics Packaging at Fraunhofer IZM Out-of-plane coupling grating coupler In-of-plane coupling tapered waveguides Assembly Design Simulation passive and active sub-micron fiber coupling fibre lensing microoptical automated assembly SOI chip optical casting by nanodispensing application depending adhesive modification fiber array Optical characterisation of modules System test BERT 10GBit/s reliability test (Telecordia)