INTEGRAL Holding.

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Terence Morrison
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1 INTEGRAL Holding

Advantages : Through the element base and display systems to finished microelectronic products 50 years of experience in design and production of microelectronic

Vertically-integrated production structure - from integrated circuits to electronic devices Manufacture of ICs with minimal design rules 0.

2 Advantages : Through the element base and display systems to finished microelectronic products 50 years of experience in design and production of microelectronic components Complete cycle of design/development and manufacture of integrated circuits and semiconductor devices: from silicon ingots to finished products Vertically-integrated production structure - from integrated circuits to electronic devices Manufacture of ICs with minimal design rules 0.35 µm on Ø200 mm wafers Design/development and manufacture of microelectronic components are certified for compliance with the National and International standards ISO 9000 Highly skilled and experienced personnel

Structure of INTEGRAL Holding JSC INTEGRAL - INTEGRAL Holding Managing Company Grodno Vitebsk Molodechno Minsk Mogilev Branch Semiconductor Device Factory Branch Belmicrosystems R&D Center ICs,

3 Structure of INTEGRAL Holding JSC INTEGRAL - INTEGRAL Holding Managing Company Grodno Vitebsk Molodechno Minsk Mogilev Branch Semiconductor Device Factory Branch Belmicrosystems R&D Center ICs, discrete semiconductor devices, LCD indicators, foundry services, photomasks Branch Transistor Discrete semiconductor devices, ICs JSC TSVETOTRON Diodes, electronics, PCBs Brest Pinsk Gomel Branch ELECTRONICA FACTORY Electronics Branch KAMERTON Silicon wafers, electronics JSC Electromodule Power semiconductor diodes & rectifier modules

4 Milestones 1961 Starting construction of the main administrative building 1963 Launching Semiconductor Device Factory named after Dzerzhinsky F.E. (Minsk) 1963 Starting construction of Transistor factory (Minsk) 1963 First diodes manufactured 1965 First transistors manufactured 1968 Transistor factory was put into operation and first transistors were manufactured (Minsk) 1969 Mass production of ICs started 1971 RPC Integral amalgamated 1972 Special Design Center of RPC Integral launched 1973 First electronic wrist watch Secunda-2 manufactured 1974 Order of October Revolution is awarded for design and manufacture of instruments for space exploration Manufacture of first memory ICs 1978 Manufacture of first microprocessor Electronica Factory launched (Minsk) 1979 Kamerton Factory launched (Pinsk) 1981 The Order of Lenin is awarded for design and manufacture of electronic units for reusable space system ground complex 1982 Manufacture of ALS Logic ICs 1983 Tzvetotron Factory launched (Brest) 1986 Zapad Design Center launched (Brest) 1988 Manufacture of first lap-tops 1990 Telephone ICs 1991 Nemiga Design Center launched (Minsk) 1992 Bank and trade electronic devices 1992 First telephone set made 1993 Calculator ICs

5 Milestones 1994 Logic ICs of HC/HCT, AC/ACT, 4000B series, EEPROM ICs 1995 ICs for one-pcb TV-sets of the 6 generation 1995 Telephone plastic cards 1999 Quality Assurance System is certified for conformance to the requirements of National Standards and International ISO 9001 Standards 2000 Sophisticated VLSI for domestic electronic applications 2001 Development of fast and ultra-fast diodes (FRD and UFRD) 2001 Mastering of special ICs for automotive electronics 2002 Development of ICs for ILA8842 TV processor 2003 Establishment of Integral s Representative Offices in China and India 2005 MOSFET type power field-effect transistors mass production start up 2005 VLSI development for BelKa satellite µm ICs mass production start up 2007 Starting production of sophisticated products for medical equipment 2008 Starting production of special purpose 256К memories µm IL1307/1356 LSI development 2010 Starting production of special purpose 1 Mbit memories 2010 IC mass production start-up on 200mm wafers 2010 Joint Stock Company INTEGRAL established 2011 Start commercial production of 5 products in 0.35μm process node: IN1307, IN1356 real-time clock ICs, IZ1325 high-precision RTC IC with thermocompensation, IZ8563 CMOS timer LSI with 12C-bus RAM, IZ2009 IC for authentication systems with 1-Wire interface with EEPROM 2011 Shipped USD 4.5KK products manufactured at the new submicron production facility 2012 In frames of BKA program, manufactured microassemblies and IC assemblies of photosensitive CCD devices for remote sensing satellites 2013 On June 14, 2013, the Ministry of Economy entered INTEGRAL Holding into the Public Register of holdings # Completion of the design of nonvolatile 1M (128Kx8) FRAM memory 2014 There has been developed and launched into mass production a 16 Mbit CMOS RAM multi-chip module. A set of the 5584-series ICs, 23 types, for space applications has been developed and put into series production. A mobile artificial lung ventilation apparatus has been developed K1643RA014 SRAM IC with the capacity of 1 Mb (128Kx8) manufactured under "silicon on insulator" technology. Software and hardware for identification of reinforced concrete structures. LED lighting system for poultry farms with "sunrise-day-sunset" function.

6 Integral product structure Die in Wafer Silicon substate IC in Package Electronic Products

7 Company profiles INTEGRATED CIRCUITS SEMICONDUCTOR DEVICES SPECIAL PROCESS EQUIPMENT AND TOOLING/ ACCESSORIES FOUNDRY BUSINESS DESIGN/ DEVELOPMENT/ MANUFACTURE FABLESS BUSINESS ELECTRONIC PRODUCTS and CONCUMER GOODS

8 Integrated Circuits

9 Semiconductor devices Diodes Pulse Zener Rectifier, medium frequency Varicaps Schottky, power Rectifier-limiter (Zener) Noise generators Noise diodes generators Arrays Pulse diodes Varicaps Power diodes Medium-power transistors High-frequency complementary Pulse complementary SHF generator MOS switches Low power transistors High frequency complementary Pulse complementary Unijunction Low-voltage, high-frequency, low-noise Power transistors Field, N-channel, high voltage Bipolar, complementary, high-voltage Complementary, Darlington Field, high-current, N and P-channel Thyristors and triacs

10 Foundry business Foundry business Semiconductor ICs and Discrete Devices- Manufacturing on the base of Customer's Design (delivery on the base of on-chip testing) Semiconductor and Discrete Devices - Manufacturing on the base of Customer's Design (delivery on the base of wafer PCM testing) Wafer Fab Service execution of separate Process Flow Steps or bloks (Metal sputtering, film deposition, EPI-growing, back grinding, wafers testing and so on) Production Capacities used for Foundry Business: Production line for 8'' wafers with ( ) µm Design Rule Production line for 6'' wafers with ( ) µm Design Rule Production line for 4'' wafers with ( ) µm Design Rule Basic Process Flows available: Discrete devices: D-MOS ( 1000V) Raw Si substrate manufacturing by Customer's Specs Process Flows available: Integrated Circuits: n-mos CMOS BiCMOS CDMOS BiCDMOS, DMOS Bipolar (TTL, TTL/ALS) IGBT-bipolar transistor with isolated gate ( 1500V) Multi-Epi ( 700V) Bipolar High-frequency devices ( 300V) MOSFET Fabless-business starting from 0.18 µm design rules («Belmicrosystems» Research and Design Center Branch)

8µm BiCMOS technology, 3 poly, 2 Ме High-voltage 0.

5 5 μm, 1-2 Ме 0,8 2 μm BCD, DMOS technologies, 1 Ме

Planar thyristor technology with separation by

11 Technological Capabilities 0.35µm CMOS technology, 2 poly, 3 Ме 0.8µm BiCMOS technology, 3 poly, 2 Ме High-voltage 0.8µm CMOS technology, 2 poly, 1 Ме Bipolar technologies, μm, 1-2 Ме 0,8 2 μm BCD, DMOS technologies, 1 Ме Microwave bipolar transistor technology Schottky technology Planar thyristor technology with separation by interdiffuision Epitaxial planar and diffusion planar technologies for manufacturing silicon semiconductor devices, including high-voltage transistors

12 Technological Capabilities IC packaging: SO, DIP, P-SOT , P-SOT , P-TO-5-11, P-TO-5-12, TO-220AB/5, TO-220AB/7, P-TO , P-TO , SIL-3P, SIL-9P, SIL-9MPF, DBS-9P, DBS-9MPF, SOT523-1, SIL-13P, SIL-15P, QFP-80, QFP-100 Semiconductor device assembly: - plastic packages: TO-92, TO-126, TO-218, TO-220, DPACK, D2PACK, IPACK, SOT-23, - metal-glass packages: TO-3, TO-18, TO-72, Case 22A-01.

Industrial Electronics Automation, instrument engineering, energy flow meters, electric drives, electronic start-control devices.

13 Hardware components application Household appliances: LCD TV, monitors, microwave ovens, fridges, washing machines. Networking & Telecommunications Telephones, modems, fax machines, electronic dial exchange. Industrial Electronics Automation, instrument engineering, energy flow meters, electric drives, electronic start-control devices. Access Control & Identification RFID-tags, smart key, contactless cards. Space Electronics Satellite-borne electronic equipment, optoelectronic systems, satellite launch control. Payment Systems Plastic bank cards, payment cards, phone cards, prepaid cards for public transport. Agriculture Automated control systems and devices for agriculture and agricultural machinery. Automotive Electronics Fuel injection and ignition systems, turn-indicator systems, wiper systems, lighting equipment.

14 INTEGRAL Holding

15 INTEGRAL Holding

16 International background The products are exported to 34 countries of the world

ECE 261: Full Custom VLSI Design

ECE 261: Full Custom VLSI Design Prof. James Morizio Dept. Electrical and Computer Engineering Hudson Hall Ph: 201-7759 E-mail: jmorizio@ee.duke.edu URL: http://www.ee.duke.edu/~jmorizio Course URL: http://www.ee.duke.edu/~jmorizio/ece261/261.html