TechSearch International, Inc.

Transcription

1 IoT and the Impact on MEMS and Sensors Packaging E. Jan Vardaman President and Founder TechSearch International, Inc.

2 What is IoT? Internet of Things..Cisco s Internet of Everything IoT means connectivity More than just WiFi Does the growth of IoT increase the demand for MEMs and Sensors? What special packages are required for MEMS and Sensors in Connected Devices?

3 Connected Device Market: It s Growing Market growth for connected devices according to Cisco Morgan Stanley wearable electronics growth rate of 154% Shipments projected to increase from 6 million units in 2013 to 248 million units in 2017

4 Growth Drives MEMS and Sensors MEMS and sensors growth driven by growth in wearable electronics Many different packages for wearable electronics

5 IoT: More Than Just a Watch or Fitness Band! Collection data Monitoring data Storing data (medical record, mobile payment information, industrial info, driving data, insurance data, etc.) Analyzing data Yes, IoT means connectivity Yes, and keeping data secure Progressive Snapshot Morgan Stanley reports over 6 years 10 billion miles worth of driving data (100+ terabytes) collected Source: Progressive.

6 MEMS and Sensors for Connected Devices Accelerometers and Gyroscopes for motion sensing Pressure sensors High precision light sensors to accurately measure blood flow Sensors to accurately calculate heart rate Blood pressure monitors (need higher accuracy) Glucose monitoring Pulse monitors for runners etc. Others.. But, sensors have to function properly!! Many examples of heart rate or blood pressure sensors that don t measure accurately Limits product adoption: Users will stop using the devices and enterprises will not adopt the technology if data is not accurate MEMS Accelerometer STMicroelectronics

7 Low-Power Optimized MCU for Fitness Band MCU Bluetooth LE! transceiver UART System logic Timers GPO Sensor subsystem CPU NVM/! SRAM USB! host/! OTG I 2 C SPI ADC/! DAC ARC and! subsystem IP Other! DesignWare IP Customer/! third-party IP Heart rate! Gyroscope Sensors Accelerometer! Compass Source: Synopsys via Semiconductor Engineering Trade-off in design is power vs. performance Processor is constantly analyzing data from sensor Device does not get to go into sleep mode Improved battery life becomes key to product success

8 Recent MEMS Developments Wafer level technology being adopted Cavendish Kinetics with its RF MEMS tuning solution for LTE smartphones and wearable devices using STATS ChipPAC WLP for small form factor Die thickness after back grinding 0.39 mm Total package height + solder ball 0.55 mm Lead count of 9 2X higher data rates and improved battery life (40%) Future RF antenna developments TSMC developments in MEMS SoC and MEMS in one chip (CMOS integration, deposition of material on top of silicon) Last year accelerometer (motion sensor) This year pressure sensors Future gyroscope Future monolithic microphone

9 Apple s Watch Board and Packages Source: Apple. Almost no leadframe packages Mostly area array packages FBGAs WLPs Expected to use WiFi module with WLP No board space available: Need greater use of WLP or System-in-Package (SiP)

10 Sensor Examples in Apple s Watch STMicroelectronics digital gyroscope and accelerometer Reported by Chipworks to be packaged in 3mm x 3mm LGA 6 axis sensor in a single component MEMS sensor and control ASIC stacked together Wire bonded STMicroelectronics optical emitter/sensor encoder die Knowles microphone Source: Apple.

11 System-in-Package: Key to Connected Devices Apple Watch SiP reported by Chipworks to have >30 components Some multiple die such as PoP Package is only 26 mm x 28 mm Overmolded Renesas and Link Labs radio module for machine-to-machine communication Renesas microcontroller Semtech long distance radio transceiver Applications including security monitoring, agricultural monitoring, home automation, smart meters Samsung Electronics Artik modules Contains processors, memory, communication chips, and software All essential elements for connected gadgets Source: Samsung.

12 Medical Connected Devices Traditional medical implantables From fitness accessory to clinical tool Wearable technology to help senior citizens remain mobile and live independent lives Non-invasive wearable transdermal microsystems for continuous monitoring Textiles for muscle stimulation, continuous ECG monitoring, etc. Wearables with sensors for targeted clinical applications in disease treatment Source: IPDiA.

13 No One Package Solution Fits All! Packaging options (found in today s products) BGA, FBGA Flex circuit CSP LGA (including MCM) Chip-on-board (COB) PoP Stacked die CSP Leadframe packages such as QFN, SOP, TSOP Ceramic packages Integrated passive devices WLP Embedded die SiP Packaging options (emerging) FO-WLP MIS package (leadframe versions with mold compound as underfill and substrate) Cost/Performance trade-off determines adoption, but Cost and Form Factor are key

14 MEMS Package Requirements Specialized interface with outside world and exposure to corrosive gases or fluids such as pressure sensors, fluidic devices Vacuum packaging, hermeticity Protection from moisture-sensitive capacitive devices will get signal errors High-temperature operation, such as in-cylinder pressure sensors operating at 1,000 C Challenging assembly processes, such as wire bonding to vertical surfaces Sensitivity to vibration and shock during processing steps such as grinding or pick-and-place

15 MEMS Packaging Complexity Many options and cost / performance considerations Wire type, loop radius and gage? Molded-in stress? Leaded or not? Stacked die or side-by-side? Wire bond or flip chip? Cavity or overmold? Laminate or leadframe? EMI shielding? Green material? How/what to test? Encapsulation? Die attach method? Source: Amkor Technology

16 Amkor MEMS & Sensor Packaging Evolution MLF -Cavity (in-line or FAM) Transition from Custom Packaging to High Volume Manufacturing ChipArray -Cavity LF-Cavity (pre-mold or FAM) DLP courtesy of TI MLF -Molded ChipArray -Molded WLCSP Broad range of point solutions Focused platforms Source: Amkor Technology

17 MEMS Reliability Failure modes and mechanisms are more complex Number of potential failure modes and mechanisms is larger Some failures, such as collisions or sticking of movable parts, are transient and thus hard to identify or locate Packages contain multiple components and MEMS device failure must be differentiated from an ASIC failure Failure criteria are device- and application-specific Standard destructive failure analysis can result in erroneous conclusions due to sample preparation problems, therefore physical analysis must often b combined with modeling to identify the most probable failure sites Monitoring instruments may be exposed to the loading conditions, such as temperature excursions, mechanical shock, or vibration, and may need to be checked for degradation themselves

18 Connected Device Product Requirements? What are reliability requirements? Lifetime? Environmental exposure (UV light, sweat, stress, washer/dryer, cleaning fluids, mud, dust, wafer, sunscreen, etc.) Fitness activity bands Polymer encased electronics Components must survive mold process temperatures Must withstand twist, bend, flex compression Must not react with bodily and environmental fluids Need special reliability tests Drop test (is it shock proof?) Thermal stress (simulation) Is it moisture resistant?

19 Conductive Fabrics Knitting or weaving conductive threads into textiles Metalized threads with allow of silver, copper, tin, nickel Deposition or coating of conductive polymers Printing conductive inks UK s NPL development of stretch nylon fabric processed using its technology (nano-silver coating of fibers) Source: NPL.

20 Conclusions Many different products Many different package types (traditional MEMS packages vs. new packages required for connected products) May need new reliability tests May need new materials to achieve realization of future product designs