Craig Rawlings Title or job function

Size: px
Start display at page:

Download "Craig Rawlings Title or job function"

Transcription

1 The Source for Logic Non-Volatile Memory Presenter Name Craig Rawlings Title or job function Director of Marketing

2 Rapid Growing Customer Base Rapid Growing Customer Base 50+ Customers and Counting

3 XPM (X-tra Permanent Memory) Customer Praise After evaluating a number of alternatives, we chose Kilopass XPM memory technology since it provides the best standard logic CMOS solution for our secure software storage, - Rudy Bruce, EVP of Marketing and Sales, "Our engineering team selected Kilopass over other non-standard CMOS technologies such as Flash due to its ease of integration and manufacturing, and low manufacturing cost." -David Auld, VP Technology With this qualification, Kilopass Technology's XPM memory adds a valuable new IP resource for IC designers seeking a low-cost alternative to solutions based on current embedded Flash memory technology. -- Ed Wan, Director Product Marketing, TSMC's Design Services Div.

4 Kilopass Foundry Partners Kilopass is the industry leader in Standard d Logic CMOS Non-Volatile Memory IP called XPM XPM IP supports from 180nm down to 40nm 16-bit to 64-bit OTP Register Product 1K-bit to 1M-bit OTP Memory Product Foundries supported Chartered Dongbu IBM Magnachip SMIC TSMC

5 XPM IP Products Node Eval & HTOL DRB Number Finish Cust. Volume µ, Char µ 1000Hr Customers 1000 Hr in production Lots Date T/O Prod n T-180G TSMC 0.18u Qualification Completed TSMC 0.13u Qualification Completed 2006 T-130G TSMC 90nm LP Qualification 3Completed nm G in qualification phase T-90LP Lot 90nm G HTOL / DRB passed 1000 Hours T-90G Final 2 lots in May 08 T-80GC nm G completed 1 Lot HTOL/DRB passed 1000 Hours est. 7/08 65nm LP completed 1 Lot HTOL/DRB passed 1000 Hours est. 9/08 65nm GP in evaluation/characterization 45nm LP in evaluation/characterization T-65LP In Qualification 3 est. T-65GP In Qualification 3 est. T-45LP R/D T-40LP R/D

6 Logic NVM SoC / ASSP Applications Security Chip ID, Encryption Keys, Anti-piracy codes, Certificates, etc Configuration Tuning, firmware & parameter storage, MUX select, & LUT Manufacturability & Usability LCD Display calibration, and Mixed Signal trim & calibration

7 Customer Applications Customer A Programmable HDCP keys for video processor and control chip Customer B Oscillator calibration for digital clock chip replacement for crystal oscillator Customer C Sensor & ADC calibration for HVAC control chip Customer D Secure ID for Cell Phone including CDRM-based applications

8 Kilopass Advantages & Benefits Reliable & Manufacturable Passed HTOL, DRB, Latch-up, & ESD, Anticipate RH/RT Easy to Integrate Standard Logic CMOS Scalable Technology Verified: 90nm,0.13u,0.15u, 0.18u up to 1Mb Flexible Low Power, Field Programmable, Portable Xtreme Security Economically impractical to reverse-engineer Low Cost Smaller than Flash w/o lagging leading process

9 XPM Embedded in Over 30 Million Customer Product Devices High Temperature Operation Life (HTOL): HTOL A standard accelerated test for both thermal and voltage activated failure mechanisms through the use of high temperature (125C) and elevated voltage (+15%) XPM OTP shows little or no change in cell current after 2KHrs at 125C. FG devices will have decreasing read margin due charge loss and disturb 100k 10k 100k 10k Floating-Gate t Devices show charge loss due to both temperature and voltage activation. Bit Count 1k 100 Bit Count 1k Un-programmed state shows charge gain due to read disturb and IMD Cell Current (a.u.) Cell Current (a.u.)

10 Thank you Explore Kilopass IP at ChipEstimate.com Use Kilopass IP to plan your next chip! Please stay and talk with Craig for more information!

Presenter Name. Larry Morrell Title or job function. Vice President/GM IP Products

Presenter Name. Larry Morrell Title or job function. Vice President/GM IP Products Presenter Name Larry Morrell Title or job function Vice President/GM IP Products AEON Nonvolatile Memory IP Tier 1 customers AEON units shipped 3 6 17 30 11B 1.1B 700M 300M 70M 2005 2006 2007 2008 0.25

More information

OTP & MTP/FRP Non-Volatile Memory IP for Standard Logic CMOS

OTP & MTP/FRP Non-Volatile Memory IP for Standard Logic CMOS OTP & MTP/FRP Non-Volatile Memory IP for Standard Logic CMOS NSCore, Inc. http://www.nscore.com/ Outlines 1. Corporate Overview 2. Program, Read & Erase Mechanism 3. OTP IP Lineups 4. New MTP Technologies

More information

New Mul(- Time Programmable Embedded NVM IP Provides SoC Designers New Architecture Op(ons

New Mul(- Time Programmable Embedded NVM IP Provides SoC Designers New Architecture Op(ons New Mul(- Time Programmable Embedded NVM IP Provides SoC Designers New Architecture Op(ons Kilopass Corporate Overview Logic NVM Innovator Proven & Patented Embedded NVM in CMOS Broadly Adopted Key Markets

More information

Enabling Intelligent Digital Power IC Solutions with Anti-Fuse-Based 1T-OTP

Enabling Intelligent Digital Power IC Solutions with Anti-Fuse-Based 1T-OTP Enabling Intelligent Digital Power IC Solutions with Anti-Fuse-Based 1T-OTP Jim Lipman, Sidense David New, Powervation 1 THE NEED FOR POWER MANAGEMENT SOLUTIONS WITH OTP MEMORY As electronic systems gain

More information

Reverse Engineering Techniques in CMOS Based Non-Volatile Memory (NVM)

Reverse Engineering Techniques in CMOS Based Non-Volatile Memory (NVM) Reverse Engineering Techniques in CMOS Based Non-Volatile Memory (NVM) EMBEDDED SRAM & NVM LOGIC LIBRARIES EMBEDDED T&R MEMORY DEVELOPMENT SW INTERFACE IP Agenda Applications Requiring Standard CMOS NVM

More information

The ASIC Company. Mixed-Signal ASICs Digital ASICs Standard ICs (ASSPs) Custom IC Design

The ASIC Company. Mixed-Signal ASICs Digital ASICs Standard ICs (ASSPs) Custom IC Design The ASIC Company Mixed-Signal ASICs Digital ASICs Standard ICs (ASSPs) Custom IC Design IP Industrial Automotive Medical Consumer 8/16/32-Bit Microcontroller Cores (ARM, ARC, MSP430, 8051) NVM solutions

More information

Introduction. Chapter 1. Logic Non-Volatile Memory. List of Sections. List of Figures

Introduction. Chapter 1. Logic Non-Volatile Memory. List of Sections. List of Figures Logic Non-Volatile Memory by Charles Ching-Hsiang Hsu, Yuan-Tai Lin, Evans Ching-Sung Yang, Rick Shih-Jye Shen Chapter 1 Introduction List of Sections Section 1.1 What Are Logic NVMs 3 Section 1.2 When

More information

Embedded 28-nm Charge-Trap NVM Technology

Embedded 28-nm Charge-Trap NVM Technology Embedded 28-nm Charge-Trap NVM Technology Igor Kouznetsov Santa Clara, CA 1 Outline Embedded NVM applications Charge-trap NVM at Cypress Scaling Key Flash macro specs 28-nm Flash memory reliability Conclusions

More information

The ASIC Company. Mixed-Signal ASICs Digital ASICs Standard ICs (ASSPs) Custom IC Design

The ASIC Company. Mixed-Signal ASICs Digital ASICs Standard ICs (ASSPs) Custom IC Design The ASIC Company Leading Edge Silicon Proven IP Innovation & Quality Industrial Automotive Medical Consumer Key Facts ASIC CCE4170 Digital Analog 8/16/32-Bit Microcontroller Cores (ARM, ARC, MSP430, 8051)

More information

Challenges for Non Volatile Memory (NVM) for Automotive High Temperature Operating Conditions Alexander Muffler

Challenges for Non Volatile Memory (NVM) for Automotive High Temperature Operating Conditions Alexander Muffler Challenges for Non Volatile Memory (NVM) for Automotive High Temperature Operating Conditions Alexander Muffler Product Marketing Manager Automotive, X-FAB Outline Introduction NVM Technology & Design

More information

20 years of Metering Innovations

20 years of Metering Innovations Teridian Semiconductor October 17, 2007 Metering India Conference Teridian s 20 Year History in Metering 1 st st 3-Phase Metrology Devices Targeted Precision Meters 1 st st System-On-Chip Devices Targeted

More information

New Embedded NVM architectures

New Embedded NVM architectures New Embedded NVM architectures for Secure & Low Power Microcontrollers Jean DEVIN, Bruno LECONTE Microcontrollers, Memories & Smartcard Group STMicroelectronics 11 th LETI Annual review, June 24th, 2009

More information

Applications Emerging to Employ Embedded Non- Volatile Memory

Applications Emerging to Employ Embedded Non- Volatile Memory Applications Emerging to Employ Embedded Non- Volatile Memory May 2011 By: Linh Hong Vice President of Marketing Kilopass Technology Inc. www.kilopass.com To learn more about Kilopass, stop by the Chip

More information

Technology & Manufacturing

Technology & Manufacturing Technology & Manufacturing Kevin Ritchie Senior Vice President Technology and Manufacturing Group Development & Manufacturing Strategy Process Technology Leadership Flexible Development Options Internal

More information

Technology and Manufacturing

Technology and Manufacturing Technology and Manufacturing Executive Vice President Field Trip 2006 - London, May 23rd Field Trip 2006 - London, May 23rd Technology Technology Development Centers and Main Programs CMOS Logic Platform

More information

Mixed-Signal. From ICs to Systems. Mixed-Signal solutions from Aeroflex Colorado Springs. Standard products. Custom ASICs. Mixed-Signal modules

Mixed-Signal. From ICs to Systems. Mixed-Signal solutions from Aeroflex Colorado Springs. Standard products. Custom ASICs. Mixed-Signal modules A passion for performance. Mixed-Signal solutions from Aeroflex Colorado Springs Standard products Custom ASICs Mixed-Signal modules Circuit card assemblies Mixed-Signal From ICs to Systems RadHard ASICs

More information

New Silicon Frontiers: Physically Flexible System-on-a-Chip

New Silicon Frontiers: Physically Flexible System-on-a-Chip New Silicon Frontiers: Physically Flexible System-on-a-Chip Richard L. Chaney, Douglas R. Hackler, Kelly J. DeGregorio, Dale G. Wilson This work sponsored in part by the Rapid Response Technology Office

More information

Configuring DDR Interface IP to Enhance Speed and Minimize Design Footprint

Configuring DDR Interface IP to Enhance Speed and Minimize Design Footprint Configuring R Interface IP to Enhance Speed and Minimize esign Footprint Bruce Luo, VP Product Solutions Shanghai Event September 14, 2017 2017 What Limits R Performance? PCB SoC Package PCB traces Rx

More information

High Performance Mixed-Signal Solutions from Aeroflex

High Performance Mixed-Signal Solutions from Aeroflex High Performance Mixed-Signal Solutions from Aeroflex We Connect the REAL World to the Digital World Solution-Minded Performance-Driven Customer-Focused Aeroflex (NASDAQ:ARXX) Corporate Overview Diversified

More information

Improved Circuit Reliability/Robustness. Carey Robertson Product Marketing Director Mentor Graphics Corporation

Improved Circuit Reliability/Robustness. Carey Robertson Product Marketing Director Mentor Graphics Corporation Improved Circuit Reliability/Robustness Carey Robertson Product Marketing Director Mentor Graphics Corporation Reliability Requirements are Growing in all Market Segments Transportation Mobile / Wireless

More information

AEC-Q100F Qualification Results Summary

AEC-Q100F Qualification Results Summary AEC-Q100F Qualification Summary Objective: To qualify NPI 9S08DZ60 M74K in a 64 LQFP Package Freescale PN: 9S08DZ60 Customer Name(s): Multiple Part Name: Longhorn PN(s): Technology: 0.25um Embedded Flash

More information

Place Your Logo Here. K. Charles Janac

Place Your Logo Here. K. Charles Janac Place Your Logo Here K. Charles Janac President and CEO Arteris is the Leading Network on Chip IP Provider Multiple Traffic Classes Low Low cost cost Control Control CPU DSP DMA Multiple Interconnect Types

More information

IO & ESD protection 1.8V & 3.3V capable general purpose digital IO pad based on 1.8V devices for TSMC 28nm CMOS technology

IO & ESD protection 1.8V & 3.3V capable general purpose digital IO pad based on 1.8V devices for TSMC 28nm CMOS technology Data sheet IO & ESD protection 1.8V & 3.3V capable general purpose digital IO pad based on 1.8V devices for TSMC 28nm CMOS technology Sofics has verified its TakeCharge ESD protection clamps on TSMC 28nm

More information

More Course Information

More Course Information More Course Information Labs and lectures are both important Labs: cover more on hands-on design/tool/flow issues Lectures: important in terms of basic concepts and fundamentals Do well in labs Do well

More information

Design Solutions in Foundry Environment. by Michael Rubin Agilent Technologies

Design Solutions in Foundry Environment. by Michael Rubin Agilent Technologies Design Solutions in Foundry Environment by Michael Rubin Agilent Technologies Presenter: Michael Rubin RFIC Engineer, R&D, Agilent Technologies former EDA Engineering Manager Agilent assignee at Chartered

More information

Conference paper ESD Design Challenges in nano-cmos SoC Design

Conference paper ESD Design Challenges in nano-cmos SoC Design Conference paper ESD Design Challenges in nano-cmos SoC Design SoC conference 2008 The Silicon Controlled Rectifier ( SCR ) is widely used for ESD protection due to its superior performance and clamping

More information

2017 American Semiconductor, Inc. All rights reserved. 1

2017 American Semiconductor, Inc. All rights reserved. 1 1 Advances in Flexible Hybrid Electronics Reliability This work sponsored in part by the Air Force Research Laboratory, Wright-Patterson AFB and Rapid Response Technology Office, under the programs Enabling

More information

Advances in Flexible Hybrid Electronics Reliability

Advances in Flexible Hybrid Electronics Reliability Advances in Flexible Hybrid Electronics Reliability This work sponsored in part by the Air Force Research Laboratory, Wright-Patterson AFB and Rapid Response Technology Office, under the programs Enabling

More information

Performance & Reliability Driven Memory solution. MacronixInternational Co., Ltd.

Performance & Reliability Driven Memory solution. MacronixInternational Co., Ltd. Performance & Reliability Driven Memory solution MacronixInternational Co., Ltd. About Macronix A Leading Non-Volatile Memory Solutions Provider Founded in 1989 Headquarters Hsin-Chu, Taiwan Total5280

More information

Oberon M2M IoT Platform. JAN 2016

Oberon M2M IoT Platform. JAN 2016 Oberon M2M IoT Platform JAN 2016 www.imgtec.com Contents Iot Segments and Definitions Targeted Use Cases for IoT Oberon targeted use cases IoT Differentiators IoT Power Management IoT Security Integrated

More information

Soitec ultra-thin SOI substrates enabling FD-SOI technology. July, 2015

Soitec ultra-thin SOI substrates enabling FD-SOI technology. July, 2015 Soitec ultra-thin SOI substrates enabling FD-SOI technology July, 2015 Agenda FD-SOI: Background & Value Proposition C1- Restricted July 8, 2015 2 Today Ultra-mobile & Connected Consumer At Any Time With

More information

EMBEDDED VISION AND 3D SENSORS: WHAT IT MEANS TO BE SMART

EMBEDDED VISION AND 3D SENSORS: WHAT IT MEANS TO BE SMART EMBEDDED VISION AND 3D SENSORS: WHAT IT MEANS TO BE SMART INTRODUCTION Adding embedded processing to simple sensors can make them smart but that is just the beginning of the story. Fixed Sensor Design

More information

FLASH DATA RETENTION

FLASH DATA RETENTION FLASH DATA RETENTION Document #AN0011 Viking Rev. B Purpose of this Document This application note was prepared to help OEM system designers evaluate the performance of Viking solid state drive solutions

More information

Put on the Future: Wearable Technology

Put on the Future: Wearable Technology Put on the Future: Wearable Technology.Press Contact Andes Technology Corporation Marcom Manager Janine Hsu ext. 614 Mobil: 886-932-315015 E-mail: Janine@andestech.com Web: Sep. 2013 1. Introduction While

More information

SOLVING MANUFACTURING CHALLENGES AND BRINGING SPIN TORQUE MRAM TO THE MAINSTREAM

SOLVING MANUFACTURING CHALLENGES AND BRINGING SPIN TORQUE MRAM TO THE MAINSTREAM SEMICON Taipei SOLVING MANUFACTURING CHALLENGES AND BRINGING SPIN TORQUE MRAM TO THE MAINSTREAM Joe O Hare, Marketing Director Sanjeev Aggarwal, Ph.D., VP Manufacturing & Process Everspin Company Highlights

More information

Golam R Chowdhury Will Rogers Lane phone: cell Austin, TX 78727

Golam R Chowdhury Will Rogers Lane phone: cell Austin, TX 78727 Golam R Chowdhury 13501 Will Rogers Lane phone: 512 587 9237 cell golamc@gmail.com Austin, TX 78727 Objective: Seeking an Adjunct Faculty Position in Electrical Engineering. Profile With a combined experience

More information

Versatile RRAM Technology and Applications

Versatile RRAM Technology and Applications Versatile RRAM Technology and Applications Hagop Nazarian Co-Founder and VP of Engineering, Crossbar Inc. Santa Clara, CA 1 Agenda Overview of RRAM Technology RRAM for Embedded Memory Mass Storage Memory

More information

September 4, MoSys, Inc.

September 4, MoSys, Inc. MoSys, Inc. Corporate Overview September 4, 2008 KAUFMAN BROS. 11 TH ANNUAL INVESTOR CONFERENCE 2008 MoSys, Inc. Safe Harbor Statement This presentation may contain forward-looking statements about the

More information

Commercial Qualification Plan/Results Summary

Commercial Qualification Plan/Results Summary Objective: New Package Qualification for ER48 in a 40 pin Plastic Land Grid Array Freescale PN: SC9S08ER48 Customer Name(s): Insulet Part Name: "ER48, Eros-ASIC" PN(s): Commercial Qualification Plan/ Summary

More information

STM8 platform 8-bit microcontrollers

STM8 platform 8-bit microcontrollers STM8 platform 8-bit microcontrollers We shoot for better performance & price MCD market vision 2 Flash size (bytes) 1 MB High performance and ultra-low-power STM32F (2.0 to 3.6 V) STM32L Ultra-low-power

More information

Layout Analysis Embedded Memory

Layout Analysis Embedded Memory Sample Report For any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414

More information

Mixed Signal IP Design Guide

Mixed Signal IP Design Guide Mixed Signal IP Design Guide Vol13 Iss2 v3, Nov. 5, 2013 The Leading Provider of High-Performance Silicon-Proven Mixed-Signal IP BENEFITS Integrate Mixed-Signal Content into Your SoC Improve Performance

More information

PEX8619 (Vehicle: PEX 8619 BA50BC Green & non-green) Reliability Product Qualification Report

PEX8619 (Vehicle: PEX 8619 BA50BC Green & non-green) Reliability Product Qualification Report PEX8619 (Vehicle: PEX 8619 BA50BC Green & non-green) Reliability Product Qualification Report Family Qualification: PEX8619 BA50BC (Green & non-green) PEX8618 BA50BC (Green & non-green) PEX8617 BA50BC

More information

DesignWare IP for IoT SoC Designs

DesignWare IP for IoT SoC Designs DesignWare IP for IoT SoC Designs The Internet of Things (IoT) is connecting billions of intelligent things at our fingertips. The ability to sense countless amounts of information that communicates to

More information

TABLE OF CONTENTS III. Section 1. Executive Summary

TABLE OF CONTENTS III. Section 1. Executive Summary Section 1. Executive Summary... 1-1 Section 2. Global IC Industry Outlook and Cycles... 2-1 IC Insights' Forecast Methodology... 2-1 Overview... 2-1 Worldwide GDP... 2-1 Electronic System Sales... 2-2

More information

Trend-1 Vibration Data Logger. User Manual

Trend-1 Vibration Data Logger. User Manual Trend-1 Vibration Data Logger User Manual Copyright College of Engineering-University of Basrah 2013 1 1. General Specifications 1.1 Features Thank you for being interested in purchasing Trend-1 Vibration

More information

Chapter 0 Introduction

Chapter 0 Introduction Chapter 0 Introduction Jin-Fu Li Laboratory Department of Electrical Engineering National Central University Jhongli, Taiwan Applications of ICs Consumer Electronics Automotive Electronics Green Power

More information

L2: FPGA HARDWARE : ADVANCED DIGITAL DESIGN PROJECT FALL 2015 BRANDON LUCIA

L2: FPGA HARDWARE : ADVANCED DIGITAL DESIGN PROJECT FALL 2015 BRANDON LUCIA L2: FPGA HARDWARE 18-545: ADVANCED DIGITAL DESIGN PROJECT FALL 2015 BRANDON LUCIA 18-545: FALL 2014 2 Admin stuff Project Proposals happen on Monday Be prepared to give an in-class presentation Lab 1 is

More information

Digital Audio Broadcasting. Xilinx Solutions for DAB Receiver Systems

Digital Audio Broadcasting. Xilinx Solutions for DAB Receiver Systems Digital Audio Broadcasting Xilinx Solutions for DAB Receiver Systems Portable DAB Receiver Issues Adding DAB functionality to existing units Interfacing DAB chipsets to processors Adding other features

More information

Content courtesy of Wikipedia.org. David Harrison, CEO/Design Engineer for Model Sounds Inc.

Content courtesy of Wikipedia.org. David Harrison, CEO/Design Engineer for Model Sounds Inc. Content courtesy of Wikipedia.org David Harrison, CEO/Design Engineer for Model Sounds Inc. Common FLASH Memory SD cards + mini, micro versions serial interface slower Compact Flash - parallel interface

More information

Designing for Low Power with Programmable System Solutions Dr. Yankin Tanurhan, Vice President, System Solutions and Advanced Applications

Designing for Low Power with Programmable System Solutions Dr. Yankin Tanurhan, Vice President, System Solutions and Advanced Applications Designing for Low Power with Programmable System Solutions Dr. Yankin Tanurhan, Vice President, System Solutions and Advanced Applications Overview Why is power a problem? What can FPGAs do? Are we safe

More information

Improving the Reliability of Chip-Off Forensic Analysis of NAND Flash Memory Devices. Aya Fukami, Saugata Ghose, Yixin Luo, Yu Cai, Onur Mutlu

Improving the Reliability of Chip-Off Forensic Analysis of NAND Flash Memory Devices. Aya Fukami, Saugata Ghose, Yixin Luo, Yu Cai, Onur Mutlu Improving the Reliability of Chip-Off Forensic Analysis of NAND Flash Memory Devices Aya Fukami, Saugata Ghose, Yixin Luo, Yu Cai, Onur Mutlu 1 Example Target Devices for Chip-Off Analysis Fire damaged

More information

NAND Flash: Where we are, where are we going?

NAND Flash: Where we are, where are we going? NAND Flash: Where we are, where are we going? Pranav Kalavade Intel Corporation Outline Introduction 3D NAND Floating Gate 3D NAND Technology CMOS Under Array Cell Characteristics Summary Cell Size [um

More information

IN-SIGHT 1740 SERIES WAFER READER

IN-SIGHT 1740 SERIES WAFER READER IN-SIGHT 1740 SERIES WAFER READER Automatic Identification for Wafer Traceability The intensely competitive global semiconductor industry demands ever more rigorous control of increasingly complex processes

More information

SLC vs MLC: Considering the Most Optimal Storage Capacity

SLC vs MLC: Considering the Most Optimal Storage Capacity White Paper SLC vs MLC: Considering the Most Optimal Storage Capacity SLC vs MLC: Considering the Most Optimal Storage Capacity P. 1 Introduction Proficiency should be a priority for the storage in computers.

More information

New CC430 combines leading MCU and RF technology

New CC430 combines leading MCU and RF technology New CC430 combines leading MCU and RF technology Brings personal and industrial wireless networking to the mass market Kevin Belnap MSP430 Marketing Mark Grazier Low Power RF Marketing Embargo date: November

More information

Freescale s Next Generation 8-bit LCD Solutions

Freescale s Next Generation 8-bit LCD Solutions Freescale s Next Generation 8-bit LCD Solutions When most consumers think of LCD, they probably envision a flat panel television or computer monitor. However, there are millions more LCDs out there that

More information

technology Leadership

technology Leadership technology Leadership MARK BOHR INTEL SENIOR FELLOW, TECHNOLOGY AND MANUFACTURING GROUP DIRECTOR, PROCESS ARCHITECTURE AND INTEGRATION SEPTEMBER 19, 2017 Legal Disclaimer DISCLOSURES China Tech and Manufacturing

More information

envm in Automotive Modules MINATEC Workshop Grenoble, June 21, 2010 May Marco 28, 2009 OLIVO, ST Automotive Group

envm in Automotive Modules MINATEC Workshop Grenoble, June 21, 2010 May Marco 28, 2009 OLIVO, ST Automotive Group envm in Automotive Modules MINATEC Workshop Grenoble, June 21, 2010 May Marco 28, 2009 OLIVO, ST Automotive Group envm in automotive: Outline marketing requirements

More information

Portable Instrumentation Applications w/ the RL78

Portable Instrumentation Applications w/ the RL78 Portable Instrumentation Applications w/ the RL78 Bill Pratt, VP of Engineering Nu Horizons Electronics Class ID: CL21B Renesas Electronics America Inc. Renesas Technology & Solution Portfolio 2 Bill Pratt:

More information

White Paper. The Case for Developing Custom Analog. Custom analog SoCs - real option for more product managers.

White Paper. The Case for Developing Custom Analog. Custom analog SoCs - real option for more product managers. The Case for Developing Custom Analog Custom analog SoCs - real option for more product managers. White Paper The contents of this document are owned or controlled by S3 Group and are protected under applicable

More information

FPGA VHDL Design Flow AES128 Implementation

FPGA VHDL Design Flow AES128 Implementation Sakinder Ali FPGA VHDL Design Flow AES128 Implementation Field Programmable Gate Array Basic idea: two-dimensional array of logic blocks and flip-flops with a means for the user to configure: 1. The interconnection

More information

MRAM Developer Day 2018 MRAM Update

MRAM Developer Day 2018 MRAM Update MRAM Developer Day 2018 MRAM Update Barry Hoberman August 2018 1 Disclaimer Observations and opinions >35 years experience in wide variety of memory >12 years experience in MRAM 2012-2017 CEO/Chairman

More information

Flash ( p.531)

Flash ( p.531) Introduction to CMOS VLSI Design Flash (12.4.3.531) J. J. Nahas and P. M. Kogge Modified from slides by Jay Brockman 2008, 2015,2018 [Including slides from Harris & Weste, Ed 4, Adated from Mary Jane Irwin

More information

Physical IP Solutions

Physical IP Solutions Physical IP Solutions Bryan Lawrence Solutions Marketing 1 Physical IP Product Focus Library platforms Standard cells Embedded memory I/O functionality High-speed interfaces Serial PHYs DDR DDR Pervasive

More information

Product / Process Change Notice

Product / Process Change Notice Product / Process Change Notice PCN No.: Z200-DM201408-01-B Date : September 4, 2014 Change Title : W25Q32FW F-Series (58nm) to replace W25Q32DW D-Series (90nm) 32Mb 1.8V SpiFlash Memories Change Classification:

More information

ECEN 449 Microprocessor System Design. Memories. Texas A&M University

ECEN 449 Microprocessor System Design. Memories. Texas A&M University ECEN 449 Microprocessor System Design Memories 1 Objectives of this Lecture Unit Learn about different types of memories SRAM/DRAM/CAM Flash 2 SRAM Static Random Access Memory 3 SRAM Static Random Access

More information

12v Power Controller Project Board

12v Power Controller Project Board 12v Power Controller Project Board 12 Volt Power Controller Introduction This board provides three functions... DC power gate Low voltage disconnect Voltage / current display The typical usage for this

More information

N E W S R E L E A S E

N E W S R E L E A S E Chartered Semiconductor Manufacturing Ltd. (Regn. No.: 198703584-K ) www.charteredsemi.com 880 N. McCarthy Blvd., Ste. 100 Milpitas, California 95035 Tel: (1) 408.941.1100 Fax: (1) 408.941.1101 60 Woodlands

More information

PLAs & PALs. Programmable Logic Devices (PLDs) PLAs and PALs

PLAs & PALs. Programmable Logic Devices (PLDs) PLAs and PALs PLAs & PALs Programmable Logic Devices (PLDs) PLAs and PALs PLAs&PALs By the late 1970s, standard logic devices were all the rage, and printed circuit boards were loaded with them. To offer the ultimate

More information

Flexible architecture to add Bluetooth 5 and to your next SoC

Flexible architecture to add Bluetooth 5 and to your next SoC Flexible architecture to add Bluetooth 5 and 802.15.4 to your next SoC Prithi Ramakrishnan Senior Manager Product Marketing, Wireless Business Unit, ARM ARM Tech Symposia India December 7 th 2016 Faster

More information

How Safe is Anti-Fuse Memory? IBG Protection for Anti-Fuse OTP Memory Security Breaches

How Safe is Anti-Fuse Memory? IBG Protection for Anti-Fuse OTP Memory Security Breaches How Safe is Anti-Fuse Memory? IBG Protection for Anti-Fuse OTP Memory Security Breaches Overview A global problem that impacts the lives of millions daily is digital life security breaches. One of the

More information

Advanced Heterogeneous Solutions for System Integration

Advanced Heterogeneous Solutions for System Integration Advanced Heterogeneous Solutions for System Integration Kees Joosse Director Sales, Israel TSMC High-Growth Applications Drive Product and Technology Smartphone Cloud Data Center IoT CAGR 12 17 20% 24%

More information

Synopsys Design Platform

Synopsys Design Platform Synopsys Design Platform Silicon Proven for FDSOI Swami Venkat, Senior Director, Marketing, Design Group September 26, 2017 2017 Synopsys, Inc. 1 Synopsys: Silicon to Software Software Application security

More information

Optimizing Embedded SSDs: One size doesn t fit all Prevention-Report-Analysis. Flash Memory Summit 2016 ATP Electronics, Inc.

Optimizing Embedded SSDs: One size doesn t fit all Prevention-Report-Analysis. Flash Memory Summit 2016 ATP Electronics, Inc. Optimizing Embedded SSDs: One size doesn t fit all Prevention-Report-Analysis ATP Electronics, Inc. 1 Agenda Overview Embedded Applications Moving to 3D NAND The Power of Synergy - Integration - Scenario

More information

Volterra Semiconductor

Volterra Semiconductor Silicon Power Solutions Volterra Semiconductor Jefferies 2013 Conference May 7, 2013 Mike Burns, CFO Nasdaq: VLTR Safe Harbor Statements This presentation contains forward-looking statements based on current

More information

FYSE420 DIGITAL ELECTRONICS. Lecture 7

FYSE420 DIGITAL ELECTRONICS. Lecture 7 FYSE420 DIGITAL ELECTRONICS Lecture 7 1 [1] [2] [3] DIGITAL LOGIC CIRCUIT ANALYSIS & DESIGN Nelson, Nagle, Irvin, Carrol ISBN 0-13-463894-8 DIGITAL DESIGN Morris Mano Fourth edition ISBN 0-13-198924-3

More information

CircuitsMulti-Projets

CircuitsMulti-Projets From layout to chips CircuitsMulti-Projets MPW Services Center for ICs, Photonics & MEMS Prototyping & Low Volume Production mycmp.fr Grenoble - France From layout to chips STMicroelectronics Standard

More information

2009 International Solid-State Circuits Conference Intel Paper Highlights

2009 International Solid-State Circuits Conference Intel Paper Highlights 2009 International Solid-State Circuits Conference Intel Paper Highlights Mark Bohr Intel Senior Fellow Soumyanath Krishnamurthy Intel Fellow 1 2009 ISSCC Intel Paper Summary Under embargo until February,

More information

SoC Memory Interfaces. Today and tomorrow at TSMC 2013 TSMC, Ltd

SoC Memory Interfaces. Today and tomorrow at TSMC 2013 TSMC, Ltd SoC Memory Interfaces. Today and tomorrow at TSMC 2013 TSMC, Ltd 2 Agenda TSMC IP Ecosystem DDR Interfaces for SoCs Summary 3 TSMC Highlights Founded in 1987 The world's first dedicated semiconductor foundry

More information

Disks and RAID. CS 4410 Operating Systems. [R. Agarwal, L. Alvisi, A. Bracy, E. Sirer, R. Van Renesse]

Disks and RAID. CS 4410 Operating Systems. [R. Agarwal, L. Alvisi, A. Bracy, E. Sirer, R. Van Renesse] Disks and RAID CS 4410 Operating Systems [R. Agarwal, L. Alvisi, A. Bracy, E. Sirer, R. Van Renesse] Storage Devices Magnetic disks Storage that rarely becomes corrupted Large capacity at low cost Block

More information

WinStream Corp.

WinStream Corp. 1 Introduction Highlights of DSP Cores Full Harvard DSP Architecture Extremely Small Gate Counts Standard ADSP 218X Development Environment Powerful Scalar DSP Performance On-the-fly Reconfigurable Architecture

More information

8. SED1565 Series. (Rev. 1.2)

8. SED1565 Series. (Rev. 1.2) 8. (Rev. 1.2) Contents GENERAL DESCRIPTION...8-1 FEATURES...8-1 BLOCK DIAGRAM...8-3 PIN DIMENSIONS...8-4 PIN DESCRIPTIONS...8-2 DESCRIPTION OF FUNCTIONS...8-24 COMMANDS...8-48 COMMAND DESCRIPTION...8-57

More information

ST Sitronix ST7565P. 65 x 132 Dot Matrix LCD Controller/Driver

ST Sitronix ST7565P. 65 x 132 Dot Matrix LCD Controller/Driver ST Sitronix ST7565P 65 x 132 Dot Matrix LCD Controller/Driver FEATURES Direct display of RAM data through the display data RAM. RAM capacity : 65 x 132 = 8580 bits Display duty selectable by select pin

More information

Energy Harvesting Reference Design

Energy Harvesting Reference Design www.silabs.com Energy Harvesting Reference Design Sustainable, Ultra-Low-Power Solution for Wireless Sensor Node Applications Embargo Until May 25, 2011 Dramatic Growth Ahead in Energy Harvesting Energy

More information

Set Up a PLL Loop Filter on the ez80f91 MCU

Set Up a PLL Loop Filter on the ez80f91 MCU Application Note Set Up a PLL Loop Filter on the ez80f91 MCU AN017504-0108 Abstract This document provides information that will help an application developer effectively use the ez80f91 MCU s on-chip

More information

High-Voltage Structured ASICs for Industrial Applications - A Single Chip Solution

High-Voltage Structured ASICs for Industrial Applications - A Single Chip Solution High-Voltage Structured ASICs for Industrial Applications - A Single Chip Solution Yipin Zhang, Cor Scherjon Institut für Mikroelektronik Stuttgart Allmandring 30 a 70569 Stuttgart This paper presents

More information

Outline. Field Programmable Gate Arrays. Programming Technologies Architectures. Programming Interfaces. Historical perspective

Outline. Field Programmable Gate Arrays. Programming Technologies Architectures. Programming Interfaces. Historical perspective Outline Field Programmable Gate Arrays Historical perspective Programming Technologies Architectures PALs, PLDs,, and CPLDs FPGAs Programmable logic Interconnect network I/O buffers Specialized cores Programming

More information

Zynq-7000 All Programmable SoC Product Overview

Zynq-7000 All Programmable SoC Product Overview Zynq-7000 All Programmable SoC Product Overview The SW, HW and IO Programmable Platform August 2012 Copyright 2012 2009 Xilinx Introducing the Zynq -7000 All Programmable SoC Breakthrough Processing Platform

More information

Common Platform Ecosystem Enablement

Common Platform Ecosystem Enablement Joe Abler Common Platform Ecosystem Enablement IBM provides a complete Foundry solution Innovative technology Leadership road map with advanced SiGe & RF offerings Leading-edge CMOS process development

More information

Semiconductors. Overweight. Sector Note. Samsung Electronics bets on 14nm FinFET

Semiconductors. Overweight. Sector Note. Samsung Electronics bets on 14nm FinFET Sector Note April 18, 2014 Semiconductors Overweight Samsung Electronics bets on 14nm FinFET Company Rating TP (KRW) Samsung Electronics BUY 1,800,000 Samsung Electronics and Globalfoundries announce One

More information

Solving Integration Challenges for Printed and Flexible Hybrid Electronics

Solving Integration Challenges for Printed and Flexible Hybrid Electronics Solving Integration Challenges for Printed and Flexible Hybrid Electronics SEMICON West 16 July 2015 Proprietary Information www.americansemi.com What are Flexible Hybrid Electronics 2 Flexible Hybrid

More information

Advances in Flexible Hybrid Electronics Reliability

Advances in Flexible Hybrid Electronics Reliability Advances in Flexible Hybrid Electronics Reliability LOPEC Smart & Hybrid Systems Munich 3/29/17 This work sponsored in part by Air Force Research Laboratory, Wright-Patterson AFB, for supporting reliability

More information

Trends and Challenges

Trends and Challenges Trends and Challenges High accuracy is required in characterization, verification & signoff Increasing design complexities: -scale design ( ) using nano-scale technologies ( ) Shrinking design margins

More information

NAND Controller Reliability Challenges

NAND Controller Reliability Challenges NAND Controller Reliability Challenges Hanan Weingarten February 27, 28 28 Toshiba Memory America, Inc. Agenda Introduction to NAND and 3D technology Reliability challenges Summary 28 Toshiba Memory America,

More information

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their

Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their S08 Highlighted Features Why Do I Need a Slave LIN Interface Controller (SLIC)? Design Challenges Slave synchronization Slave synchronizing to LIN messaging requires a cost versus resource trade-off. Your

More information

LSN 6 Programmable Logic Devices

LSN 6 Programmable Logic Devices LSN 6 Programmable Logic Devices Department of Engineering Technology LSN 6 What Are PLDs? Functionless devices in base form Require programming to operate The logic function of the device is programmed

More information

STM32F429 Overview. Steve Miller STMicroelectronics, MMS Applications Team October 26 th 2015

STM32F429 Overview. Steve Miller STMicroelectronics, MMS Applications Team October 26 th 2015 STM32F429 Overview Steve Miller STMicroelectronics, MMS Applications Team October 26 th 2015 Today - STM32 portfolio positioning 2 More than 30 product lines High-performance 398 CoreMark 120 MHz 150 DMIPS

More information

Photonics Integration in Si P Platform May 27 th Fiber to the Chip

Photonics Integration in Si P Platform May 27 th Fiber to the Chip Photonics Integration in Si P Platform May 27 th 2014 Fiber to the Chip Overview Introduction & Goal of Silicon Photonics Silicon Photonics Technology Wafer Level Optical Test Integration with Electronics

More information

If It s Electronic, It Needs a Clock

If It s Electronic, It Needs a Clock REAL-TIME CLOCKS MIXED-SIGNAL DESIGN GUIDE Data Sheets Application Notes Free Samples If It s Electronic, It Needs a Clock 8th EDITION No matter what you design, you need your system to accurately keep

More information