PL-2303HX Edition (Chip Rev D) USB to Serial Bridge Controller Product Datasheet

Transcription

1 PL-2303HX Editin (Chip Rev D) USB t Serial Bridge Cntrller Prduct Datasheet Dcument Revisin: Dcument Release: March 20, 2013 Prlific Technlgy Inc. 7F, N. 48, Sec. 3, Nan Kang Rd. Nan Kang, Taipei 115, Taiwan, R.O.C. Telephne: Fax: sales@prlific.cm.tw Website:

2 March 20, 2013 Disclaimer All the infrmatin in this dcument is subject t change withut prir ntice. Prlific Technlgy Inc. des nt make any representatins r any warranties (implied r therwise) regarding the accuracy and cmpleteness f this dcument and shall in n event be liable fr any lss f prfit r any ther cmmercial damage, including but nt limited t special, incidental, cnsequential, r ther damages. Trademarks The Prlific lg is a registered trademark f Prlific Technlgy Inc. All brand names and prduct names used in this dcument are trademarks r registered trademarks f their respective hlders. Cpyrights Cpyright Prlific Technlgy Inc., All rights reserved. N part f this dcument may be reprduced r transmitted in any frm by any means withut the express written permissin f Prlific Technlgy Inc. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

3 March 20, 2012 Revisin Histry Revisin Descriptin Date Added Andrid USB Hst API Supprt March 20, Mdify Features and OS Driver Supprt List Added QFN32 Reel Tape Infrmatin September 11, Mdify Sectin 12.0 Ordering Infrmatin Part Number June 25, Mdify Reel Tape Packing (MOQ) Infrmatin May 25, Added Windws 8 Driver Supprt Added OTPROM Cnfiguratin Sectin Mdified BaudRate Supprt Table Added Reference Schematic Diagram Added Chip Marking Infrmatin Added Tube Packing Infrmatin Added Wrldwide Distributrs Infrmatin 1.3 Added Windws 7 Lg Driver Infrmatin Mdified Operating Temperature Characteristics Mdified Baud Rate Settings Table March 16, 2012 September 9, Sec. 9.0: Mdified DC & Temperature Characteristics June 27, Added Windws Vista and XP Lg Driver infrmatin Added USB-IF Lg TID infrmatin 1.0B Sec. 4.2: Mdified QFN diagram t add IC bttm PAD infrmatin April 16, 2007 June 30, A PL-2303HX (Chip Rev D) Datasheet Frmal Release Nvember 23, 2005 PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

4 March 20, 2013 Table f Cntents 1.0 FEATURES Ryalty-Free Driver Supprt Prduct Applicatins FUNCTIONAL BLOCK DIAGRAM INTRODUCTION PIN ASSIGNMENT OUTLINE SSOP28 Package QFN32 Package PIN ASSIGNMENT & DESCRIPTION SSOP28 Package QFN32 Package OTPROM CONFIGURATION DATA FORMATS & PROGRAMMABLE BAUD RATE GENERATOR PL2303HXD REFERENCE SCHEMATIC DIAGRAM DC & TEMPERATURE CHARACTERISTICS Abslute Maximum Ratings DC Characteristics Clck Characteristics Temperature Characteristics Leakage Current and Capacitance Pwer-On Reset OUTLINE DIAGRAM SSOP28 Package QFN32 Package PACKING INFORMATION Carrier Tape (SSOP-28) Carrier Tape (QFN32) Reel Dimensin Tube Packing PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

5 March 20, ORDERING AND CHIP MARKING INFORMATION CONTACT INFORMATION PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

6 March 20, 2013 List f Figures Figure 2-1 Blck Diagram f PL-2303HX (Rev D)... 9 Figure 4-1 Pin Assignment Outline f PL-2303HX (Rev D) SSOP Figure 4-2 Pin Assignment Outline f PL-2303HX (Rev D) QFN Figure 6-1 PL2303 EEPROM Writer Prgram Figure 8-1 PL2303HX (Chip Rev D) Reference Schematic Diagram Figure 9-1 Pwer-On Reset Diagram Figure 10-1 Outline Diagram f PL-2303HX (Rev D) SSOP Figure 10-2 Outline Diagram f PL-2303HX (Rev D) QFN Figure 11-1 SSOP28 Carrier Tape Figure 11-2 IC Reel Placements Figure 11-3 QFN32 Carrier Tape Figure 11-4 Reel Dimensin Figure 11-5 Tube Packing Dimensin Figure 12-1 Chip Part Number Infrmatin (SSOP) List f Tables Table 5-1 Pin Assignment & Descriptin (SSOP28) Table 5-2 Pin Assignment & Descriptin (QFN32) Table 6-1 EEPROM Writer Cnfiguratin Table 7-1 Supprted Data Frmats Table 7-2 Baud Rate Settings (Supprted by Driver) Table 9-1 Abslute Maximum Ratings Table 9-2a Operating Vltage and Suspend Current Table 9-2b 3.3V I/O Pins Table 9-2c VDD_325@3.3V Serial I/O Pins Table 9-2d VDD_325@2.5V Serial I/O Pins Table 9-2e VDD_325@1.8V Serial I/O Pins Table 9-3 Clck Characteristics Table 9-4 Temperature Characteristics Table 9-5 Leakage Current and Capacitance Table 9-6 Pwer-On Reset Table 10-1 Package Dimensin Table 11-1 Reel Part Number Infrmatin Table 12-1 Ordering Infrmatin Table 12-2 Chip Marking Infrmatin PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

7 March 20, Features Single-chip USB t Serial (RS232/RS422/RS485) asynchrnus serial data transfer interface Fully Cmpliant with USB Specificatin v2.0 (Full-Speed) USB-IF Lg Cmpliant with TID UHCI/OHCI (USB1.1), EHCI (USB 2.0), xhci (USB 3.0) Hst Cntrller Cmpatible Integrated USB 1.1 Transceiver and 5V t 3.3V Regulatr Integrated 96MHz clck generatr (N external crystal required) Integrated OTPROM (One-Time Prgramming ROM) n external EEPROM required. Fr writing and string custmer USB VID/PID, Serial Number, Prduct String, and ther device startup cnfiguratins. (uses default settings if OTPROM is empty) Supprts USB t RS232 Serial UART Interface Full-duplex transmitter and receiver (TXD and RXD) Six MODEM cntrl pins (RTS, CTS, DTR, DSR, DCD, and RI) 5, 6, 7 r 8 data bits Odd, Even, Mark, Space, r Nne parity mde One, ne and a half, r tw stp bits Parity errr, frame errr, and serial break detectin Prgrammable baud rate frm 75 bps t 12M bps External RS232 driver pwer dwn cntrl Independent pwer surce fr serial interface Supprts RS-422/RS-485 like serial interface (TXD, DTR_N, and RTS_N pins shuld be externally pulled-up t 5V) Extensive Flw Cntrl Mechanism Adjustable high/lw watermark level Autmatic hardware flw cntrl with CTS/RTS r DSR/DTR Autmatic sftware flw cntrl with XON/XOFF Inbund data buffer verflw detectin Cnfigurable 512-byte bi-directinal data buffer 256-byte utbund buffer and 256-byte inbund buffer; r 128-byte utbund buffer and 384-byte inbund buffer Supprts Remte Wake-up frm RS232 input pin signals (RI, RXD, DSR, DCD, CTS) Fur (4) General Purpse I/O (GP0, GP1, GP2, & GP3) pins and Fur (4) Auxiliary General Purpse I/O (RI_N, DSR_N, DCD_N, & CTS_N) pins. Supprts Windws Selective Suspend by OTPROM cnfiguratin (Enable Remte Wakeup) Suspends pwer f chip when idle (COM prt is clsed) Prvides ryalty-free USB t Virtual COM Prt drivers fr Windws, Mac, Linux, Andrid -40 C t 85 C Operating Temperature Small ftprint 28-pin SSOP r 32-pin QFN IC packages (RHS cmpliant and Pb-free Green Cmpund PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

8 March 20, Ryalty-Free Driver Supprt Windws 8, 7, Vista, XP, 2000 (Micrsft Certified WHQL Drivers) Windws Update Driver installatin available in Windws Vista, 7, and 8 (32/64-bit) Dwnlad: Windws Server 2003, 2008, 2008 R2, 2012 Windws XP Embedded (XPe), Pint-f-Service (WEPOS), and POSReady Windws CE 4.2, 5.0, 6.0, and Windws Embedded Cmpact 7 Requires custmer SDK image file fr custmizing WinCE 6.0 and 7.0 drivers. Mac OS 8/9, OS X (supprts latest Mac OS X 10.8 Muntain Lin) Dwnlad: Linux/Andrid kernel and abve includes built-in drivers (pl2303.c) Andrid requires rt permissin fr accessing virtual serial prt (ttyusb) Andrid Java Driver Library (requires Andrid 3.2 and abve with USB Hst r OTG) N rt permissin needed Dwnlad: Andrid device must supprt USB Hst API: Prvides Driver Custmizatin fr Custmer USB VID/PID and special baud rates 1.2 Prduct Applicatins Single-chip upgrade slutin fr Legacy RS232 devices t USB interface USB t RS232/RS422/RS485 cnverters/cables/dngles/adapters Healthcare/Medical USB Interface Data Transfer Cable Persnal Inftainment/Media Player Dcking USB Interface Cellular/PDA USB Interface Data Transfer Cable Serial-ver-IP Wireless Slutin USB Barcde/Smart Card Readers GPS/Navigatin USB Interface Pint-f-Sale (POS) Terminals/Printers PC Dcking Statin/Prt Replicatrs Industrial/Instrumentatin/Autmatin Cntrl USB Interface USB Mdem/Wireless/Zigbee USB Interface Set-Tp Bx (STB) / Hme Gateway USB Interface MCU-based devices t USB interface PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

9 March 20, Functinal Blck Diagram USB Hst 96MHz Clck Generatr USB 1.1 Transceiver 5 t 3.3V Regulatr Pwer Management USB Digital Lck Lp USB t Serial Interface Engine Cntrl Endpint Interrupt Endpint Bulk-in Endpint Bulk-Out Endpint 256-Bytes OTP ROM 256/384Byte Inbund Data Buffer 256/128Byte Outbund Data Buffer Hardware ROM Default Descriptr RS232 / RS-422 / RS-485 Like Serial Interface Engine PL-2303HXD RS-232/RS-422/RS-485 Like Interface Figure 2-1 Blck Diagram f PL-2303HX (Rev D) PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

10 March 20, Intrductin PL-2303HX (Chip Rev D) r PL-2303HXD prvides a cnvenient slutin fr cnnecting an RS232-like full-duplex asynchrnus serial device t any Universal Serial Bus (USB) capable hst. PL-2303HXD highly cmpatible drivers culd simulate the traditinal COM prt n mst perating systems allwing the existing applicatins based n COM prt t easily migrate and be made USB ready. By taking advantage f USB bulk transfer mde, large data buffers, and autmatic flw cntrl, PL-2303HXD is capable f achieving higher thrughput cmpared t traditinal UART (Universal Asynchrnus Receiver Transmitter) prts. When real RS232 signaling is nt required, baud rate higher than bps culd be used fr even higher perfrmance. The flexible baud rate generatr f PL-2303HXD culd be prgrammed t generate any rate between 75 bps t 12M bps. PL-2303HXD is exclusively designed fr mbile and embedded slutins in mind, prviding a small ftprint that culd easily fit in t any cnnectrs and handheld devices. With very small pwer cnsumptin in either perating r suspend mde, PL-2303HXD is perfect fr bus pwered peratin with plenty f pwer left fr the attached devices. Flexible signal level requirement n the RS232-like serial prt side als allws PL-2303HXD t cnnect directly t any 3.3V~1.8V range devices. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

11 March 20, Pin Assignment Outline 4.1 SSOP28 Package 1 TXD 2 DTR_N 3 RTS_N 4 VDD_325 5 RXD 6 RI_N 7 GND 8 NC 9 DSR_N 10 DCD_N 11 CTS_N 12 SHTD_N 13 GP3 RESERVED NC TEST GND NC GP1 GP0 NC VDD_5 RESET_N GND VO_33 DM GP2 PL-2303HX (Rev D) DP 15 Figure 4-1 Pin Assignment Outline f PL-2303HX (Rev D) SSOP28 PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

12 SH T D _N G P 3 G P 2 NC NC DP DM NC R T S_N D T R _N T XD NC NC R ESER VED T EST GN D Revised Date: March 20, QFN32 Package V D D _ R XD R I_N 1 NC G P 1 G P 0 GN D V D D _ 3 3 D SR _N D C D _N C T S_N PL-2303HXD Expsed Die Pad cnnects t VO_33 NC V D D _ 5 R ESET _N GN D V O _ 3 3 Figure 4-2 Pin Assignment Outline f PL-2303HX (Rev D) QFN32 Warning: The expsed center die pad f the PL-2303HX QFN package is cnnected (bnded) t the pin VO_33 s it is very imprtant t design the PCB layut wherein this expsed die pad wn t get grunded n the PCB when munted. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

13 March 20, Pin Assignment & Descriptin Pin Type Abbreviatin: I: Input O: Output B: Bidirectinal I/O P: Pwer/Grund 5.1 SSOP28 Package Table 5-1 Pin Assignment & Descriptin (SSOP28) Pin # Name Type Descriptin 1 TXD O (1) Serial Prt (Transmitted Data) 2 DTR_N O (1) Serial Prt (Data Terminal Ready) 3 RTS_N O (1) Serial Prt (Request T Send) 4 VDD_325 P RS232 VDD. The pwer pin fr the serial prt signals. When the serial prt is 3.3V, this shuld be 3.3V. When the serial prt is 2.5V, this shuld be 2.5V. The range can be frm 1.8V~3.3V. 5 RXD I (2) Serial Prt (Received Data) (2) Serial Prt (Ring Indicatr); r Auxiliary General Purpse I/O 6 RI_N B Prt when enabled (7). 7 GND P Grund 8 NC - N Cnnectin (2) Serial Prt (Data Set Ready); r Auxiliary General Purpse I/O 9 DSR_N B Prt when enabled (7). (2) Serial Prt (Data Carrier Detect); r Auxiliary General Purpse 10 DCD_N B I/O Prt when enabled (7). (2) Serial Prt (Clear t Send); r Auxiliary General Purpse I/O 11 CTS_N B Prt when enabled (7). 12 SHTD_N O (3) RS232 Transceiver Shut Dwn Cntrl 13 GP3 I/O Auxiliary GPIO Pin 3 (Default utput high mde) (6) 14 GP2 I/O Auxiliary GPIO Pin 2 (Default utput high mde) (6) 15 DP B USB Prt D+ signal 16 DM B USB Prt D- signal 17 VO_33 P Regulatr Pwer Output, 3.3V 18 GND P Grund 19 RESET_N I (4) External System Reset (Active Lw) 20 VDD_5 P USB Prt V BUS, 5V Pwer. (6.5V fr OTPROM writing vltage). 21 NC - N Cnnectin 22 GP0 B (5) General Purpse I/O Pin 0 23 GP1 B (5) General Purpse I/O Pin 1 24 NC - N Cnnectin 25 GND - Grund 26 TEST I Test mde cntrl 27 NC - N Cnnectin 28 Reserved - Reserved pin (Must be flating) Ntes: (1) Tri-State, Output Pad. Level and Driving Capability decided by VDD_325. (2) Tri-State, CMOS Input/Output Pad with level shifter. Level and Driving Capability decided by VDD_325. (3) CMOS Output Pad. (4) CMOS Input Pad, 5V tlerant. (5) Tri-State, CMOS Input/Output Pad. (Default mde: Input) (6) Default utput high mde; d nt cnnect t grund. (7) Enabling Auxiliary GPIO requires special custmized driver. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

14 March 20, QFN32 Package Table 5-2 Pin Assignment & Descriptin (QFN32) Pin # Name Type Descriptin 1 VDD_325 P RS232 VDD. The pwer pin fr the serial prt signals. When the serial prt is 3.3V, this shuld be 3.3V. When the serial prt is 2.5V, this shuld be 2.5V. The range can be frm 1.8V~3.3V. 2 RXD I (2) Serial Prt (Received Data) (2) Serial Prt (Ring Indicatr); r Auxiliary General Purpse 3 RI_N B I/O Prt when enabled (6). 4 GND P Grund 5 VDD_33 P Primary Pwer (3.3V) (2) Serial Prt (Data Set Ready); r Auxiliary General Purpse 6 DSR_N B I/O Prt when enabled (6). (2) Serial Prt (Data Carrier Detect); r Auxiliary General 7 DCD_N B Purpse I/O Prt when enabled (6). (2) Serial Prt (Clear t Send); r Auxiliary General Purpse 8 CTS_N B I/O Prt when enabled (6). 9 SHTD_N O (3) RS232 Transceiver Shut Dwn Cntrl 10 GP3 I/O Auxiliary GPIO Pin 3 (Default utput high mde) (5) 11 GP2 I/O Auxiliary GPIO Pin 2 (Default utput high mde) (5) 12 NC - N Cnnectin 13 NC - N Cnnectin 14 DP B USB Prt D+ signal 15 DM B USB Prt D- signal 16 NC - N Cnnectin 17 VO_33 P Regulatr Pwer Output, 3.3V 18 GND P Grund 19 RESET_N I External System Reset (Active Lw) 20 VDD_5 P USB Prt V BUS, 5V Pwer. 21 NC - N Cnnectin 22 GP0 B (4) General Purpse I/O Pin 0 23 GP1 B (4) General Purpse I/O Pin 1 24 NC - N Cnnectin 25 GND P Grund 26 TEST I Test mde cntrl 27 Reserved - Reserved pin (Must be flating) 28 NC - N Cnnectin 29 NC - N Cnnectin 30 TXD O (1) Serial Prt (Transmitted Data) 31 DTR_N O (1) Serial Prt (Data Terminal Ready) 32 RTS_N O (1) Serial Prt (Request T Send) IC Bttm PAD P Cnnects t VO_33 (Regulatr Pwer Output, 3.3V) Ntes: (1) Tri-State, Output Pad. Level and Driving Capability decided by VDD_325. (2) Tri-State, CMOS Input/Output Pad with level shifter. Level and Driving Capability decided by VDD_325. (3) CMOS Output Pad. (4) Tri-State, CMOS Input/Output Pad. (Default mde: Input) (5) Default utput high mde; d nt cnnect t grund. (6) Enabling Auxiliary GPIO requires special custmized driver. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

15 March 20, OTPROM Cnfiguratin The default cnfiguratin descriptrs are stred in the chip internally which will be laded during pwer-n reset r USB bus reset whenever OTPROM (One-Time Prgrammable ROM) is empty. Several f the USB descriptrs culd be mdified and stred t the PL2303HXD OTPROM during device startup like Vendr ID (VID), Prduct ID (PID), Serial Number, Prduct String, and ther cnfiguratin descriptrs. The OTPROM can be prgrammed twice using the Prlific PL2303 EEPROM Writer utility sftware which can be requested frm Prlific r authrized distributrs. Figure 6-1 PL2303 EEPROM Writer Prgram Table 6-1 EEPROM Writer Cnfiguratin Descriptrs Default Value Descriptin Vendr ID (VID) 067B (hex) USB unique Vendr ID f Cmpany r Manufacturer. This ID is applied and registered frm USB-IF. Prduct ID (PID) 2303 (hex) Rel. N. (BCD) 0400 Refer t this website fr applying VID: USB Prduct ID assigned by Cmpany r Manufacturer. This field reprts the release number f USB the device. This item is fixed and cannt be mdified. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

16 March 20, 2013 Serial N. (8 hex characters) Prduct String Descriptr Disabled Nne This field sets the prduct USB serial number. Entering a unique serial number allws the device t be assigned the same COM Prt number even when plug t ther USB prts f the same PC. This field when entered will be the string displayed by Windws and ther OS when device is first detected and befre driver is laded r driver nt installed. Enable fr RS422/RS485 Disabled Enable this fr RS422 r RS485 supprt. Remains 2 PL2303HXD has an integrated OTPROM which allws t write EEPROM settings withut the use f an external ne. Hwever, the OTPROM can nly be written twice and cannt be erased. PL2303HXD des nt supprt external EEPROM. Functins Default Value Descriptin Serial Prt Output USB Lad Mde Flw Cntrl Setting Wakeup Trigger Pin Shutdwn Pin Mde Disable Light Lad (100mA) N Flw Cntrl Wakeup trigger n RI Output LOW during suspend This ptin allws setting the serial prt utput pin signals (TXD, RTS, DTR) t HIGH during suspend mde. This ptin sets the USB device maximum pwer if 100mA (lw-pwer) r 500mA (high pwer). This ptin allws t set the flw cntrl initial setting t nne, H/W, r S/W cntrl. Nte: H/W and S/W flw cntrl can als be set and cnfigured n custmer/user serial cmmunicatin sftware. This ptin allws setting the trigger pin fr remte wakeup functin. When in suspend mde, changes n the enabled serial prt input signals culd trigger a wakeup event. NOTE: T supprt Selective Suspend functin, yu need t write and enable this ptin in OTPROM. This ptin allws setting the Shutdwn pin mde t Output HIGH r LOW n nrmal mde r Suspend mde. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

17 March 20, Data Frmats & Prgrammable Baud Rate Generatr The PL-2303HXD cntrller supprts versatile data frmats and has a prgrammable baud rate generatr. The supprted data frmats are shwn n Table 7-1. The prgrammable baud rate generatr supprts baud rates up t 12M bps and standard driver already supprts several baud rate settings as shwn in Table 7-2. Table 7-1 Supprted Data Frmats Stp bits Parity type Nne Odd Even Mark Space Data bits 5, 6, 7, 8 Descriptin Table 7-2 Baud Rate Settings (Supprted by Driver) Baud Rates (bps) Baud Rates (bps) Baud Rates (bps) Baud Rates (bps) Baud Rates (bps) Nte: Fr special baud rate requirements, please cntact Prlific FAE fr driver custmizatin supprt. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

18 March 20, PL2303HXD Reference Schematic Diagram Belw is an example f using the PL-2303HX (Chip Rev D) as a USB t RS232 cnverter (with RS485 ptin) where a RS232 transceiver (Sipex SP213EHCA) is used t cnvert the TTL levels serial interface f the PL2303TA t RS232 levels as well as cnverting the +5V nminal VCC t the ±9V required by RS232. The SP213EHCA transceiver prvides up t 500Kbps data rate transmissin which is ideal fr many designs requiring high speed perfrmance. Cntact Prlific FAE fr mre PCB design supprt. Figure 8-1 PL2303HX (Chip Rev D) Reference Schematic Diagram PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

19 March 20, DC & Temperature Characteristics 9.1 Abslute Maximum Ratings Table 9-1 Abslute Maximum Ratings Items Pwer Supply Vltage - VDD_5 Input Vltage f 3.3V I/O Input Vltage f 3.3V I/O with 5V Tlerance I/O Output Vltage f 3.3V I/O Strage Temperature Ratings -0.3 t 6.5 V -0.3 t VO_ V -0.3 t VDD_5+0.3V -0.3 t VDD_ V -40 t 150 C 9.2 DC Characteristics Operating Vltage and Suspend Current Table 9-2a Operating Vltage and Suspend Current Parameter Symbl Min Typ Max Unit Operating Vltage Range VDD_ V Output Vltage f Regulatr VO_ V Operating Current (1) (Pwer Cnsumptin) I DD ma Suspend Current I SUS A Nte: (1) N device cnnected V I/O Pins Table 9-2b 3.3V I/O Pins Parameter Symbl Min Typ Max Unit Output Driving Capability I DD 4 ma Pwer Supply fr 3.3V I/O Pins VO_ V Input Vltage (CMOS) Lw High Input Vltage (LVTTL) Lw High Output Vltage, 3.3V Lw High V IL V IH V IL V IH V OL V OH 0.7* VO_33 0.3* VO_33 V V 0.8 V 2.0 V 0.4 V 2.4 V PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

20 March 20, Serial I/O Pins Table 9-2c Serial I/O Pins Parameter Symbl Min Typ Max Unit Output Driving Capability I DD 8 ma Pwer Supply fr Serial I/O Pins VDD_ V Input Vltage Lw High Output Vltage Lw High V IL V IH V OL V OH 0.7* VDD_ * VDD_325 V V 0.4 V 2.4 V Table 9-2d VDD_325@2.5V Serial I/O Pins Parameter Symbl Min Typ Max Unit Output Driving Capability I DD 5.2 ma Pwer Supply fr Serial I/O Pins VDD_ V Input Vltage Lw High Output Vltage Lw High V IL V IH V OL V OH 0.7* VDD_ * VDD_325 V V 0.4 V 1.85 V Table 9-2e VDD_325@1.8V Serial I/O Pins Parameter Symbl Min Typ Max Unit Output Driving Capability I DD 4.4 ma Pwer Supply fr Serial I/O Pins VDD_ V Input Vltage Lw High Output Vltage Lw High V IL V IH V OL V OH 0.7* VDD_ * VDD_325 V V 0.4 V 1.25 V 9.3 Clck Characteristics Table 9-3 Clck Characteristics Parameter Min Typ Max Units Frequency f Operatin MHz Clck Perid ns Duty Cycle % PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

21 March 20, Temperature Characteristics Table 9-4 Temperature Characteristics Parameter Symbl Min Typ Max Unit Operating Temperature Junctin Operatin Temperature T J C C 9.5 Leakage Current and Capacitance Table 9-5 Leakage Current and Capacitance Parameter Symbl Min Typ Max Unit Input Leakage Current *1 I L A Tri-state Leakage Current I z A Input Capacitance C IN 2.8 pf Output Capacitance C OUT pf Bi-directinal Buffer Capacitance C BID pf *1. N pull-up r pull-dwn resistr. 9.6 Pwer-On Reset Figure 9-1 Pwer-On Reset Diagram Table 9-6 Pwer-On Reset Parameter Symbl FF@70 C TT@25 C SS@0 C Unit VO_33=3.63V VO_33=3.3V VO_33=2.97V Output Delay Time Td sec Nte: The delay time is simulated with VIN ramp f 1V/ sec. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

22 March 20, Outline Diagram 10.1 SSOP28 Package Table 10-1 Package Dimensin Symbl Millimeter Inch Min Nm Max Min Nm Max b E E L R D A e L A A Figure 10-1 Outline Diagram f PL-2303HX (Rev D) SSOP28 PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

23 March 20, QFN32 Package Figure 10-2 Outline Diagram f PL-2303HX (Rev D) QFN32 PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

24 March 20, Packing Infrmatin 11.1 Carrier Tape (SSOP-28) Figure 11-1 SSOP28 Carrier Tape Ntes: 10 sprcket hle pitch cumulative tlerance 0.2 Camber nt t exceed 1mm in 100mm. Material: Black Plystyrene. A and B measured n a plane 0.3mm abve the bttm f the pcket. K measured frm a plane n the inside bttm f the pcket t the tp surface f the carrier. Pcket psitin relative t sprcket hle measured as true psitin f pcket, nt pcket hle. IC quantity per ne reel: 2,000 pieces (MOQ) Figure 11-2 IC Reel Placements PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

25 March 20, Carrier Tape (QFN32) Figure 11-3 QFN32 Carrier Tape Ntes: 10 sprcket hle pitch cumulative tlerance 0.2 Camber in cmpliance with EIA 481. Pcket psitin relative t sprcket hle measured as true psitin f pcket, nt pcket hle. IC quantity per ne reel: 2,000 pieces (MOQ) PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

26 March 20, Reel Dimensin Figure 11-4 Reel Dimensin Package Table 11-1 Reel Part Number Infrmatin Part Number Nrmal Hub Width W1 +0.3mm -0.2mm W2 Max QFN32 RD33008SW-T + RD33004SW-T 12mm 12.8mm 18.2mm SSOP28 RD33008SW-T + RD33008SW-T 16mm 16.8mm 22.2mm PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

27 March 20, Tube Packing Figure 11-5 Tube Packing Dimensin PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

28 March 20, Ordering and Chip Marking Infrmatin Table 12-1 Ordering Infrmatin Part Number PL-2303HXD LF PL-2303HXD QFN32 LF Package Type 28-pin SSOP (Lead Free r Pb-Free) 32-pin QFN (Lead Free r Pb-Free) Figure 12-1 Chip Part Number Infrmatin (SSOP) Table 12-2 Chip Marking Infrmatin Line Marking Descriptin First Line PL-2303HX Chip Prduct Name Secnd Line (LFYYWWXX) LF YY WW Lead-Free (Pb-free) packing material Last tw digits f the manufacturing year Week number f the manufacturing year XX HX Chip Versin (Rev D) Third Line TXXXXXXXX Manufacturing LOT cde Example: LF08451D means Lead-Free packing + Year Week n D chip versin. PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

29 March 20, Cntact Infrmatin Taiwan Headquarter 7F, N.48, Sec. 3, Nan Kang Rd., Nan Kang, Taipei, Taiwan 115, R.O.C. Tel: Fax: Website: Shenzhen Office Rm 1908, Building, N.A. jiahehuaqiang Building, Shennanzhng Rd. Futian District, Shenzhen, China Tel: Distributrs Cntact: Taiwan Distributrs Maxtek Technlgy C., Ltd. 5F, N , Sec. 6, Ming-Chuang E.RD., Nei-Hu, Taipei, Taiwan, R.O.C. Tel: Ext.662 Fax: Website: Mrrihan Internatinal Crp. 4F, N. 3-2, YuanCyu Street, NanKang District, Taipei 115, Taiwan, R.O.C. Tel: Fax: Website: U-CHEER Cmpany C., Ltd. 4F, N. 48, Chw-Tze ST., Nei-Hu, Taipei, Taiwan, R.O.C. Tel: Fax: USA and Canada PrlificUSA.cm / Tectna Electrnics Inc. 250 Wyecrft Rad, Unit 6, Oakville, Ontari, Canada L6K 3T7 Tel: Fax: Crprate Website: Prduct Website: Japan Hitachi High-Tech Trading Crpratin , Nishi-Shimbashi, Minat-ku, Tky, Japan Dept.: Electrnic Devices 4th Dept., Electnic Devices Sales Div Tel: Fax: Website: PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4

30 March 20, 2013 China Lacewd Internatinal Crp. Hng Kng Office Unit B1-B3, 21/F, Blck B, Kng Nam Industrial Building, Castle peak Rad, Tsuen Wan N.T, Hng Kng Tel: Fax: Shenzhen Office Rm401-3,East, CEC Infrmatin Building, N.1 Xin Wen Rad, Shenzhen, P.R.C., Tel: Fax: Shanghai Office Rm 208,District B, Building 3,NO.7,Guiqin Rd, Xuhui Area, Shanghai Tel : ~6 Fax: China Freelink Asia Limited Rm 307, 3F Blck6, AnHua Industrial Zne, Tairan 8th Rad, CheGngMia, Futian District, Shenzhen, China Tel: China Shenzhen Shiqixinji Science and Technlgy C., Ltd. Rm 1908, Building NO.A, Jiahehuaqiang Building, Shennanzhng Rd., Futian District, Shenzhen, China Tel: Krea Nevra Technlgy Rm 502, Citylife, 441, Amsa-Dng, Kangdng-Gu, Seul, , Krea Tel: Fax: Website: T&C Semitech C.,LTD #703 J-dng, Gngku-sangga, , Kur-dng, Kur-ku, Seul. Krea Tel: Fax: Website: PL-2303HX (Rev D) Prduct Datasheet Dcument Versin 1.4.4