QUALCOMM MSM6275 Chipset

Transcription

1 QUALCOMM MSM6275 Chipset Functional Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: Fax:

2 Functional Analysis Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 2 Device Identification 2.1 Sierra Wireless AirCard QUALCOMM MSM6275 Package 2.3 QUALCOMM MSM6275 Package Summary 2.4 QUALCOMM MSM6275 Chipset Overview 3 RAVEN Die Overview 3.1 Die Summary 3.2 Observed Critical Dimensions 3.3 RAVEN Die Identification 4 RAVEN Die Process Analysis 4.1 Device Structure 5 RAVEN Die Functional Block Analysis 5.1 Major Functional Blocks 5.2 Functional Block Measurements 6 RAVEN Die Memory Analysis 6.1 Memory Analysis 6.2 Memory Measurements 6.3 SEM Topographical Images 7 RAVEN Die Analog Functional Block Analysis 7.1 Analog Functional Blocks 7.2 Analog Block Measurements 7.3 Optical Topographical Images of Analog Blocks 8 RAVEN Die Standard Cell Analysis 8.1 Annotated Die Photograph Standard Cells 8.2 SEM Topographical Images

3 Functional Analysis 9 PLUTO Die Overview 9.1 Die Summary 9.2 Observed Critical Dimensions 9.3 PLUTO Die Identification 10 PLUTO Die Process Analysis 10.1 Device Structure 11 PLUTO Die Functional Block Analysis 11.1 Major Functional Blocks 11.2 Functional Block Measurements 12 PLUTO Die Analog Functional Block Analysis 12.1 Analog Functional Blocks 12.2 Analog Block Measurements 12.3 Optical Topographical Images of Analog Blocks 13 PLUTO Die Standard Cell Analysis 13.1 Annotated Die Photograph Standard Cells 13.2 SEM Topographical Images 14 References Report Evaluation

4 Overview Overview 1.1 List of Figures 2 Device Identification Sierra Wireless AirCard 850 Top Sierra Wireless AirCard 850 Bottom Sierra Wireless AirCard 850 Main Board Package Top Package Bottom Plan-View X-Ray Chipset Overview 3 RAVEN Die Overview Die Photograph Die Markings A Die Markings B Die Corner A Bond Pads 4 RAVEN Die Process Analysis General Device Structure Minimum Metal 1 Pitch Minimum Transistor Gate Length 5 RAVEN Die Functional Block Analysis Major Functional Blocks 6 RAVEN Die Memory Analysis Annotated Metal 1 Die Photograph Memory Annotated Metal 1 Die Photograph Larger Memory Blocks SRAM Cells Polysilicon SRAM Cells Metal ROM Type 1 Cells Polysilicon ROM Type 1 Cells Metal ROM Type 2 Cells Polysilicon ROM Type 2 Cells Metal 1 7 RAVEN Die Analog Functional Block Analysis Annotated Metal 1 Die Photograph Analog TxDAC Block Metal ARM Processor Die Marking Metal 1 8 RAVEN Die Standard Cell Analysis Annotated Metal 1 Die Photograph Standard Cells NAND Cell

5 Overview PLUTO Die Overview Die Photograph Die Markings A Die Markings B Die Corner A Bond Pads 10 PLUTO Die Process Analysis General Device Structure Minimum Metal 1 Pitch Minimum Transistor Gate Length 11 PLUTO Die Functional Block Analysis Major Functional Blocks 12 PLUTO Die Analog Functional Block Analysis Analog Functional Blocks Audio Processing Block Metal I/O Block Metal PLL Metal Receiver ADC Metal Reference Generator Metal Unknown Analog 1 Metal Unknown Analog 2 Metal 1 13 PLUTO Die Standard Cell Analysis Annotated Metal 1 Die Photograph Standard Cells NAND Cell

6 Overview List of Tables 2 Device Identification QUALCOMM MSM6275 Package Summary 3 RAVEN Die Overview RAVEN Die Summary RAVEN Die Observed Critical Dimensions 5 RAVEN Die Functional Block Analysis Functional Block Measurements 6 RAVEN Die Memory Analysis Memory Measurements Measurements of Memory Blocks 7 RAVEN Die Analog Functional Block Analysis Analog Block Measurements 9 PLUTO Die Overview PLUTO Die Summary PLUTO Die Observed Critical Dimensions 11 PLUTO Die Functional Block Analysis Function Block Measurements 12 PLUTO Die Analog Functional Block Analysis Analog Block Measurements

7 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at: Chipworks 3685 Richmond Rd. Suite 500 Ottawa, Ontario K2H 5B7 Canada T: F: Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com