IE R-EM. User s Manual. 75X Series Emulation Board 75XL Series Emulation Board Version For IE R IE R

Transcription

1 User s Mnul IE R-EM 75X Series Emultion Bord 75XL Series Emultion Bord Version 1.47 For IE R IE R Document No. U11354EJ3V0UM00 (3rd edition) Dte Published July 1997 N Printed in Jpn 1994

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3 EEPROM is trdemrk of NEC Corportion. The export of this product from Jpn is prohibited without governmentl license. To export or re-export this product from country other thn Jpn my lso be prohibited without license from tht country. Plese cll n NEC sles representtive. The informtion in this document is subject to chnge without notice. No prt of this document my be copied or reproduced in ny form or by ny mens without the prior written consent of NEC Corportion. NEC Corportion ssumes no responsibility for ny errors which my pper in this document. NEC Corportion does not ssume ny libility for infringement of ptents, copyrights or other intellectul property rights of third prties by or rising from use of device described herein or ny other libility rising from use of such device. No license, either express, implied or otherwise, is grnted under ny ptents, copyrights or other intellectul property rights of NEC Corportion or of others. M7A

4 Regionl Informtion Some informtion contined in this document my vry from country to country. Before using ny NEC product in your ppliction, plese contct the NEC office in your country to obtin list of uthorized representtives nd distributors. They will verify: Device vilbility Ordering informtion Product relese schedule Avilbility of relted technicl literture Development environment specifictions (for exmple, specifictions for third-prty tools nd components, host computers, power plugs, AC supply voltges, nd so forth) Network requirements In ddition, trdemrks, registered trdemrks, export restrictions, nd other legl issues my lso vry from country to country. NEC Electronics Inc. (U.S.) Snt Clr, Cliforni Tel: Fx: NEC Electronics (Germny) GmbH Duesseldorf, Germny Tel: Fx: NEC Electronics (UK) Ltd. Milton Keynes, UK Tel: Fx: NEC Electronics Itlin s.r.1. Milno, Itly Tel: Fx: NEC Electronics (Germny) GmbH Benelux Office Eindhoven, The Netherlnds Tel: Fx: NEC Electronics (Frnce) S.A. Velizy-Villcoubly, Frnce Tel: Fx: NEC Electronics (Frnce) S.A. Spin Office Mdrid, Spin Tel: Fx: NEC Electronics (Germny) GmbH Scndinvi Office Teby, Sweden Tel: Fx: NEC Electronics Hong Kong Ltd. Hong Kong Tel: Fx: /9044 NEC Electronics Hong Kong Ltd. Seoul Brnch Seoul, Kore Tel: Fx: NEC Electronics Singpore Pte. Ltd. United Squre, Singpore 1130 Tel: Fx: NEC Electronics Tiwn Ltd. Tipei, Tiwn Tel: Fx: NEC do Brsil S.A. So Pulo-SP, Brsil Tel: Fx: J96. 8

5 Mjor Revisions in This Edition Pge Description Generl Upgrded the IE R-EM to Ver.1.47 Added µpd to trget devices Upgrded informtion ROM (IC79, IC80) nd system setting dt ROM (IC3) p.41 Added 3.4 Differences in Clock Genertion Circuit p.43 Added 3.7 Restrictions p Differences mong Trget Devices Added (5) Seril interfce, nd (6) A/D converter p.47 Chnge in 4.2 Hndling of Pins of IE R-EM (µpd75308, 316, 328, nd 336 Subseries) p.50 Chnge in 5.2 Hndling of Pins of IE R-EM (µpd750008, 0108 Subseries) p.52 Chnge in 6.2 Hndling of Pins of IE R-EM (µpd Subseries) p.54 Chnge in 7.2 Hndling of Pins of IE R-EM (µpd Subseries) p.56 Chnge in 8.2 Hndling of Pins of IE R-EM (µpd Subseries) p.58 Chnge in 9.2 Hndling of Pins of IE R-EM (µpd Subseries) p.60 Chnge in 10.2 Hndling of Pins of IE R-EM (µpd Subseries) p Differences mong Trget Devices Added (2) EEPROM TM p.66 Chnge in 13.2 Hndling of Pins of IE R-EM (µpd Subseries) The mrk shows mjor revised points.

6 INTRODUCTION Product description The IE R-EM, when connected to the seprtely sold IE R Note, is used for debugging of 4-bit single-chip microcomputers of the 75X or 75XL Series. This device cnnot be used with the EVAKIT-75X. Note The IE R comes s n IE R-EM tken from the IE R (mintennce prt). The IE R cn be used in plce of the IE R. Reders This mnul is intended for system debugging engineers who re using the 75X or 75XL Series nd who connect the IE R-EM to the IE R. Purpose This mnul s purpose is to explin methods for connecting the IE R-EM to the IE R nd settings to be mde when debugging vrious devices in the 75X or 75XL Series. Orgniztion This mnul generlly contins the following sections. System configurtion IE R connection methods nd settings How to red this mnul Engineers who red this mnul re ssumed to be cquinted with the functions nd use methods for devices to be debugged nd knowledgeble bout debugging. When using the IE R, you cn consider ll of this mnul s references to the IE R s pplicble to the IE R (see the setting procedures described in CHAPTER 2 INSTALLATION PROCEDURE). The shpe nd connecting methods of versions less thn nd bove the IE R-EM Ver.1.32 differ. When using n IE R-EM erlier thn Ver.1.32, red the user s mnul provided for tht IE R-EM. For brief description of the IE R-EM s functions nd opertion methods: -> See the tble of contents For description of bsic specifictions: -> See the overview description in CHAPTER 1 OVERVIEW. For informtion on setting methods when debugging vrious devices connected to the IE R: -> See CHAPTERS 2 to 13.

7 Legends Min system clock : this mnul ssumes tht the min system clock hs been set to 4.19 MHz. Significnce of dt nottion : left side is most significnt, right side is lest significnt. Symbols inside of boxes : contents of monitor screen or input commnd. Input key description : xxxxx indictes key input. : The symbol indictes the return (ENTER) key. : The symbol indictes spce. JP settings : JP (Jumper Pin) settings re indicted s shown below. Exmple JP3 Indictes short between pins 1 nd 2 in JP3. Switch settings : switch (DIP switch) settings re indicted s shown below. Exmple ON SW1 (1 to 5 re ON) OFF Indictes bits 1 to 5 in SW1 re ON. Note : refers to notes explining contents of text. Cution : refers to contents tht wrrnt specil ttention when reding. Numericl nottion : binry numbers... xxxxb : hexdeciml numbers... xxxxh Relted document IE R/IE R USER S MANUAL (ref. No. EEU-846).

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9 CONTENTS CHAPTER 1 OVERVIEW Wht is the IE R-EM? IE R-EM Fetures IE R-EM Product Configurtion IE R-EM Prt Nmes List of Trget Devices Cutions Concerning Use of IE R-EM ROMs Provided with IE R-EM Firmwre ROM Informtion ROM nd system setting dt ROM IE R-EM D BOARD CHAPTER 2 INSTALLATION PROCEDURE Method for Connection with Trget System When connecting with trget system When not connecting with trget system When replcing firmwre ROM User Clock Settings Selection of Trget Device Selection of trget device using SW Selection of trget device using STS commnd ROM Checking nd Replcement ROM checking Informtion ROM replcement System setting dt ROM replcement Msk Options Power Supply Setting JP2 nd JP3 Settings JP1 of IE R-EM D BOARD Setting CHAPTER 3 DIFFEREES BETWEEN IE R AND TARGET DEVICES WHEN CONNECTING THE IE R (ALL TARGET DEVICES COMMON VERSION) Differences in Executble Commnds Differences in Progrm Memory Are Differences in Power Supply Voltge Differences in Clock Genertion Circuit Opertion Using Min System Clock or Subsystem Clock Differences between IE R-EM Version s Erlier thn Ver nd Trget Devices Restrictions CHAPTER 4 INSTALLATION (µpd75308, 316, 328, AND 336 SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd75308, 316, 328, nd 336 Subseries) i

10 CHAPTER 5 INSTALLATION (µpd AND 0108 SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd nd 0108 Subseries) CHAPTER 6 INSTALLATION (µpd SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) CHAPTER 7 INSTALLATION (µpd SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) CHAPTER 8 INSTALLATION (µpd SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) CHAPTER 9 INSTALLATION (µpd SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) CHAPTER 10 INSTALLATION (µpd SUBSERIES) FOR IE R Differences Among Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) CHAPTER 11 INSTALLATION (µpd753304) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd753304) CHAPTER 12 INSTALLATION (µpd SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) CHAPTER 13 INSTALLATION (µpd SUBSERIES) FOR IE R Differences mong Trget Devices Hndling of Pins of IE R-EM (µpd Subseries) APPENDIX A IE R-EM SPECIFICATIONS APPENDIX B IE R-EM BLOCK DIAGRAM APPENDIX C PIN TABLES FOR CN1 TO CN APPENDIX D REVISION HISTORY ii

11 LIST OF FIGURES (1/2) Figure No. Title Pge 1-1 Connection with IE R IE R-EM nd Its Product Configurtion Interfce Circuit for Externl Sense Clip SW1 Setting (for shipment of IE R-EM) Connection between IE R nd Trget System Opening Lid of IE R Removl of IE R-BK Connection between IE R-EM nd IE R-BK Connection of IE R-EM, IE R-BK, nd Adpter Bord Screw Fstening of IE R-EM, IE R-BK, nd Adpter Bord Bord Instlltion Bord Position Mounting on Converter Socket Connection between Emultion Probe nd Converter Socket Loction of Firmwre ROM Positions of SX1 nd SX SW1 Setting Positions of Informtion ROM nd System Setting Dt ROM Removl of IE R-EM D BOARD Removl of Informtion ROM Mounting of Informtion ROM Connection of IE R-EM D BOARD Removl of System Setting Dt ROM Mounting of System Setting Dt ROM SW2 Setting JP2 nd JP3 Settings JP1 of IE R-EM D BOARD Setting Hndling of Pins of µpd75304, 304B, 306, 306B, 308, 308B, P308, 312, 312B, 316, 316B, P316, P316A, P316B, 328, P328, 336, nd P Hndling of Pins of µpd750004, 0006, 0008, P0016, 0104, 0106, 0108, nd P Hndling of Pins of µpd750064, 0066, 0068, nd P Hndling of Pins of µpd753012, 3012A, 3016, 3016A, 3017, 3017A, P3018, nd P3018A Hndling of Pins of µpd nd P Hndling of Pins of µpd753104, 3106, 3108, nd P Hndling of Pins of µpd753204, 3206, 3208, nd P iii

12 LIST OF FIGURES (2/2) Figure No. Title Pge 11-1 Hndling of Pins of µpd Hndling of Pins of µpd754202, 4144, 4244, 4264, nd F Hndling of Pins of µpd754302, 4304, nd P B-1 IE R-EM Block Digrm B-2 IE R-EM D BOARD Block Digrm iv

13 LIST OF TABLES Tble No. Title Pge 1-1 Adpter Bords nd Emultion Probes for Vrious Models IE R-EM Prt Nmes Informtion ROM nd System Setting Dt ROM Provision of IE R-EM D BOARD Switching between Internl Clock nd User Clock in Min System Clock Min System Clock Connection Circuit nd SX1 Setting Switching between Internl Clock nd User Clock in Subsystem Clock Trget Device nd Corresponding ROM v

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15 CHAPTER 1 OVERVIEW CHAPTER 1 OVERVIEW 1.1 Wht is the IE R-EM? The IE R-EM is n emultion bord for the (seprtely sold) IE R development system for 4-bit single-chip microcomputers of the 75X or 75XL Series. When the IE R is combined with the IE R-EM nd the EP-75xxxzz-R Note 1 (seprtely sold dpter bord nd emultion probe described (refer to Tble 1-1)), efficient debugging nd opertion checking of the system using vrious devices Note 2 cn be performed. This emultion bord cn execute emultion in the power supply voltge VDD rnge of 2.7 to 5.0 V. Notes 1. The EP-75xxxzz-R is n dpter bord nd emultion probe for vrious devices used with the 75X or 75XL Series. Exmple EP-75328GC-R: probe set for µpd75328gc nd P Refer to 1.5 List of Trget Devices. 1

16 CHAPTER 1 OVERVIEW Tble 1-1. Adpter Bords nd Emultion Probes for Vrious Models No. of Pins Pckge Trget Device Adpter Bord/Emultion Probe 80 QFP (GF) (0.8 mm pitch) WQFN (K) µpd75304, 304B, 306, 306B, 308, 308B, P308, 312, 316, P316, P316A EP-75308GF-R QFP (GC) (0.65 mm pitch) µpd75304b, 306B, 308B, 312B, 316B, P316B µpd753012, 3012A, 3016, 3016A, 3017, 3017A, P3018, P3018A EP-75308BGC-R EP GC-R µpd75328, P328 EP-75328GC-R µpd75336, P336, 3036, P3036 EP-75336GC-R TQFP (GK) (0.5 mm pitch) µpd75304b, 306B, 308B, 312B, 316B, P316B µpd753012, 3012A, 3016, 3016A, 3017, 3017A, P3018, P3018A EP-75308BGK-R EP GK-R µpd75336, P336, 3036, P3036 EP-75336GK-R 64 QFP (GC) (0.8 mm pitch) µpd753104, 3106, 3108, P3116 EP GC-R QFP (GK) (0.65 mm pitch) µpd753104, 3106, 3108, P3116 EP GK-R 48 Shrink SOP (GT) µpd753204, 3206, 3208, P3216 EP GT-R 44 QFP (GB) (0.8 mm pitch) µpd750004, 0006, 0008, P0016, 0104, 0106, 0108, P0116 EP-75008GB-R 42 Shrink DIP (CU) µpd750004, 0006, 0008, P0016, 0104, 0106, 0108, P0116 EP-75008CU-R µpd750064, 0066, 0068, P0076 EP CU-R Shrink DIP (DU) µpd753304notes 1, 2 EP DU-R Shrink SOP (GT) µpd750064, 0066, 0068, P0076 EP GT-R 36 Shrink SOP (GS) µpd754302, 4304, 4308 EP GS-R 20 SOP (GS) (1.27 mm pitch) µpd754202, 4144, 4244, 4264, F4264 Note 2 EP GS-R Shrink SOP (GS) (0.65 mm pitch) µpd754202, 4144, 4244 Notes 1. Supports only ES products (shrink DIP (DU)), but not mss produced products (bre chip). 2. Under development 2

17 CHAPTER 1 OVERVIEW Figure 1-1. Connection with IE R IE R-BK IE R-EM Adpter bord for vrious models P1 J1 µpd75000a J2 P1 CN3 CN4 CN1 CN2 CN3 CN4 CN5 CN1 CN2 PC2 P2 PC1 P2 IE R-EM D BOARD Emultion probe for vrious models Emultion probe connector Emultion probe connector Trget system IE R cbinet 3

18 CHAPTER 1 OVERVIEW 1.2 IE R-EM Fetures The IE R-EM hs the following fetures when connected to the IE R-BK. (1) Emultion cn be performed in rel time or in one step for vrious trget devices Note 1. (2) If the trget progrm hs ccessed stck re, dt memory, register, or peripherl I/O which is not incorported in the trget devices, forced termintion of the progrm s execution will be performed (gurd brek function). (3) When using the IE R s on-line ssembler function (ASM commnd), you cn use trget device peripherl hrdwre reserved words Note 2 for opernd input ddresses. (4) The I/O port sttus cn be trced during emultion. (5) The commnd set tht cn be ssembled nd disssembled using the ASM nd DAS commnds is ttched to the trget device Note 1. Notes 1. Refer to 1.5 List of Trget Devices. 2. A reserved word is symbol vlue tht hs been reserved to indicte the ddress ssigned to trget device s peripherl hrdwre by memory mpped I/O. 4

19 CHAPTER 1 OVERVIEW 1.3 IE R-EM Product Configurtion The IE R-EM consists of the products shown in Figure 1-2. Figure 1-2. IE R-EM nd Its Product Configurtion (1/3) CN4 CN3 CN2 CN1 SW1 ON P1 USER IE SW2 P2 IC80 IC79 IC3 IE R-EM D BOARD SX1 SX JP4 1 3 JP3 1 3 JP2 JP1 1 3 IE R-EM 5

20 CHAPTER 1 OVERVIEW Figure 1-2. IE R-EM nd Its Product Configurtion (2/3) CN4 CN3 CN2 CN1 SW1 ON P1 USER IE SW2 P2 IC80 IC79 CN6 ON SW3 ON SW4 ON SW5 ON SW6 CN5 SX1 SX JP4 1 3 JP3 1 3 JP2 JP1 1 3 IE R-EM (With the IE R-EM D BOARD removed) IC3 µpd IE R-EM D BOARD Remrk IE R-EMs lter thn Ver.1.32 do not hve SW3 to SW6 nd JP4 to JP11. Settings performed by users using SW3 to SW6 nd JP4 to JP11 in versions erlier thn Ver.1.32 re performed utomticlly by the IE R-EM D BOARD with versions lter thn Ver.1.32, thus eliminting the need for users to perform the settings. IE R-EM bords lter thn Ver.1.32 lso hve lbels SW3 to SW6 nd JP4 to JP11 becuse the sme bord s versions erlier thn Ver.1.32 re used. 6

21 CHAPTER 1 OVERVIEW Figure 1-2. IE R-EM nd Its Product Configurtion (3/3) E75X IC79 xxx or E75X IC80 xxx Informtion ROM (µpd27c1001a) (Mounted on IE R-EM s IC79 nd IC80 when shipped) D75X IC3 xxx System setting dt ROM (µpd27c1001a) (Mounted on IC3 IE R-EM D BOARD when shipped) Cution The IE R-EM includes dedicted devices for emultion of ech trget devices peripherl function (I/O port, etc.). 7

22 CHAPTER 1 OVERVIEW 1.4 IE R-EM Prt Nmes Tble 1-2. IE R-EM Prt Nmes Nme Function SW1 SW2 JP1 DIP switch for selecting trget device when strting up system Power supply switch Internl clock nd user clock switch for subsystem clock P1, P2 Connector for IE R-BK connection CN1 to CN4 SX1, SX2 IC79 Note, IC80 Note IC3 Note Connector for dpter bord connection Socket for mounting user clock Informtion ROM Ver.3.3 System setting dt ROM Ver.3.3 (Mounted on IE R-EM D BOARD) Note Mounted on IE R-EM prior to shipment. Other thn the bove, the IE R-EM is provided with IC86 (firmwre ROM Ver.1.6), IC79, IC80 (informtion ROM Ver.4.3), nd IC3 (system setting dt ROM Ver.4.3). 1.5 List of Trget Devices In this mnul, the term trget device is used to refer to microcontrollers such s the µpd75308 tht re trgeted for emultion. Also, the term trget system is used to refer to user systems composed of trget devices. The following re trget devices tht cn be emulted using the IE R. µpd75304, 304B, 306, 306B, 308, 308B, P308, 75312, 312B, 316, 316B, P316, P316A, P316B, 75328, P328, 336, P336, , 0006, 0008, P0016, , 0106, 0108, P0116, , 0066, 0068, P0076, , 3012A, 3016, 3016A, 3017, 3017A, P3018, P3018A, , P3036, , 3106, 3108, P3116, , 3206, 3208, P3216, Notes 1, 2, , 4144, 4244, 4264, F4264 Note 2, , 4304, P4308 Notes 1. Supports only ES products (shrink DIP (DU)), but not mss produced products (bre chip). 2. Under development 8

23 CHAPTER 1 OVERVIEW 1.6 Cutions Concerning Use of IE R-EM The following shows common precutions not specificlly relted to the trget device used. Refer to CHAPTERS 3 to 13 for precutions for ech trget device used. (1) Turn off the power supply to the IE R nd trget system before connecting or removing the IE R- EM nd dpter bord or trget system, or chnging the switch settings on these devices. (2) When connecting the IE R-EM with the IE R to emulte trget device, the opertion will vry in some respects from tht of n ctul device. (3) If the connection between the IE R-EM nd the IE R hs not been mde correctly, No Connect messge is output nd the devices will not operte correctly. (4) If the trget progrm ttempts to ccess memory re, peripherl I/O, stck pointer, or register which is not incorported in the trget devices, forced termintion of the progrm s execution will be performed nd one of the following messges will be displyed on the IE R. Memory re GDM brek terminted Peripherl I/O GDIO brek terminted Stck pointer GDSP brek terminted Register GDR brek terminted (5) When performing mnemonic input using ASM commnds, note tht the dt memory R/W ttributes hve not been checked. (6) Bit 0 (EXT0) on the externl sense clip used for the externl trigger sets up open drin output nd therefore pull-up resistor should be ttched. Externl sense interfce should be used in output mode. Do not use it in input mode. Figure 1-3 shows the interfce circuit for the externl sense clip. Figure 1-3. Interfce Circuit for Externl Sense Clip IE R-BK IE R-EM Adpter bord LS06 Emultion probe on trget system side D Q Y A 9

24 CHAPTER 1 OVERVIEW (7) The DIP switch (SW1) on the IE R-EM is set s follows prior to shipment. When connecting to the IE R, use the STS commnd or SW1 to select the trget device. (Refer to 2.3 Selection of Trget Device) Figure 1-4. SW1 Setting (for shipment of IE R-EM) ON SW1 OFF (Bits 1 to 5 re ON.) 10

25 CHAPTER 1 OVERVIEW 1.7 ROMs Provided with IE R-EM IE R-EMs lter thn Ver.1.32 re provided with the following four ROMs. Firmwre ROM (IC86 Ver.1.6) Informtion ROM (IC79, IC80 Ver.4.3) System setting dt ROM (IC3 Ver.4.3) These ROMs re used when replcing ROMs mounted on the IE R nd IE R-EM prior to shipment to the version of the IE R-EM nd trget device Firmwre ROM The firmwre ROM (IC86 Ver.1.6) is used when connecting IE R-EMs bove Ver.1.32 to the IE R. Replce the firmwre ROM mounted on the IE R prior to shipment with the firmwre ROM (IC86 Ver.1.6) provided with the IE R-EM. For detils, refer to When exchnging firmwre ROM. Cutions 1. The IE R provided with firmwre ROM erlier thn Ver.1.6 cnnot be used for IE R-EMs Ver.1.32 or lter. If used, the messge NO CONNECT will be displyed. 2. Alwys replce the firmwre ROM before turning on the power Informtion ROM nd system setting dt ROM The informtion ROM nd system setting dt ROM (Ver.3.3) mounted on the IE R-EM prior to shipment needs to be replced with the ROM (Ver.4.3) provided with the IE R-EM ccording to the trget device used. For detils, refer to 2.4 ROM Checking nd Replcement. Tble 1-3. Informtion ROM nd System Setting Dt ROM IE R-EM Version Applictions ROM Lbel Mounting Site Device Less thn Ver.1.32 Informtion ROM E75x IC79 socket µpd27c1001a IC79 (On IE R-EM) xxx Ver.1.32 or lter Informtion ROM Note E75x IC79 socket IC79 (On IE R-EM) xxx E75x IC80 xxx IC80 socket (On IE R-EM) System setting dt ROM Note D75x IC3 socket IC3 (On IE R-EM D BOARD) xxx Note Uses ROM Ver.3.1 with IE R-EM Ver.1.32 nd ROM Ver.4.3 with IE R-EM Ver

26 CHAPTER 1 OVERVIEW 1.8 IE R-EM D BOARD IE R-EMs Ver.1.32 or lter re provided with n IE R-EM D75900 BOARD mounted to CN5 nd CN6 (Refer to Figure 1-2. IE R-EM nd Its Product Configurtion). The IE R-EM D BOARD is mounted with n emultion device µpd759000, which utomticlly performs settings of detiled prts required during the emultion of the trget device. This mens tht settings performed by SW3 to SW6 nd JP4 to JP11 for IE R-EMs less thn Ver.1.32 re unnecessry. The IE R-EM D BOARD hs n EEPROM control section, which performs the emultion of trget devices incorporting the EEPROM TM. Tble 1-4 shows the differences mde by whether the device is provided with the IE R-EM D BOARD. Tble 1-4. Provision of IE R-EM D BOARD Item No IE R-EM D BOARD With IE R-EM D BOARD IE R-EM version Less thn Ver.1.32 Ver.1.32 or lter Emultion device µpd75000al, µpd75390r, FPGA µpd75000al, µpd EEPROM control section No Yes (Emultion of devices incorporting EEPROM (Emultion of devices incorporting EEPROM not possible) possible) SW3 to SW6 Yes No (Mounted on IE R-EM, nd requires (IE R-EM D BOARD performs JP4 to JP11 user settings for use.) settings utomticlly. User settings unnecessry.) Other The shpe, weight, CN2 pin connection, etc. differ. Functions other thn those in Tble 1-4 nd IE R-EM opertions re the sme. Remrk IE R-EMs lter thn Ver.1.32 do not hve SW3 to SW6 nd JP4 to JP11. Settings performed by users using SW3 to SW6 nd JP4 to JP11 in versions erlier thn Ver.1.32 re performed utomticlly by the IE R-EM D BOARD with versions bove Ver.1.32, thus eliminting the need for users to perform the settings. IE R-EM bords bove Ver.1.32 lso hve lbels SW3 to SW6 nd JP4 to JP11 becuse the sme bord s versions erlier thn Ver.1.32 re used. 12

27 CHAPTER 2 INSTALLATION PROCEDURE CHAPTER 2 INSTALLATION PROCEDURE 2.1 Method for Connection with Trget System When connecting with trget system When using the IE R for emultion of trget device, use n EP-75xxxzz-R (emultion probe nd dpter bord). Follow the connection procedure described below. Figure 2-1. Connection between IE R nd Trget System IE R-BK IE R-EM Adpter bord for vrious models J1 P1 µpd75000a J2 P1 CN3 CN4 CN1 CN2 CN3 CN4 CN5 CN1 CN2 PC2 P2 PC1 P2 IE R-EM D BOARD Emultion probe connector Emultion probe connector PC2 Motherbord PC1 IE R cbinet 13

28 CHAPTER 2 INSTALLATION PROCEDURE (1) Remove screws from six loctions on the IE R unit to open the lid of the cse. Figure 2-2. Opening Lid of IE R (2) The IE R-BK is connected inside the IE R. If using the IE R insted of the IE R, the IE R-EM fits into the cse when the IE R is screw-fstened to the IE R-BK. Remove the two bords once nd remove the screws. (3) Remove the cble (J1 or J2 cble) connecting the IE R-BK to the control/trce bord, then pull forwrd the two crd pullers on either side of the IE R-BK to completely remove the IE R-BK from its slot. Figure 2-3. Removl of IE R-BK IE R-BK 14

29 CHAPTER 2 INSTALLATION PROCEDURE (4) Connect the IE R-EM to the IE R-BK. <1> Remove the screws from the two spcers on the IE R-BK. <2> Connect connectors P1 nd P2 on the IE R-BK to connectors P1 nd P2 on the IE R- EM. <3> Use the screws removed t step <1> to fsten the IE R-EM. Figure 2-4. Connection between IE R-EM nd IE R-BK 15

30 CHAPTER 2 INSTALLATION PROCEDURE (5) Connect the emultion probe s dpter bord to the bords fstened t step (4) bove. <1> Connect connectors CN1 to CN4 on the IE R-EM to connectors CN1 to CN4 on the dpter bord. Figure 2-5. Connection of IE R-EM, IE R-BK, nd Adpter Bord Adpter bord IE R-EM IE R-BK 16

31 CHAPTER 2 INSTALLATION PROCEDURE <2> Insert flt-hed screw, spring, wsher, nd flt wsher to ttch one spcer between the IE R-EM nd dpter bord. Figure 2-6. Screw Fstening of IE R-EM, IE R-BK, nd Adpter Bord (6) Instll the bords connected t step (5) inside the IE R s cse. Figure 2-7. Bord Instlltion Adpter bord IE R-BK IE R-EM 17

32 CHAPTER 2 INSTALLATION PROCEDURE (7) Insert the IE R-BK s connectors PC1 nd PC2 to connectors PC1 nd PC2 inside the cse. (8) Connect the cbles from J1 nd J2 to the IE R-BK. Check the position of the bord. Figure 2-8. Bord Position Screw hole IE R-BK IE R-EM Adpter bord Control/trce bord (9) Solder n pproprite converter socket, etc. Note suiting with shpe of the top of the probe t the mounting site on the trget system s trget device. Figure 2-9. Mounting on Converter Socket WQFN converter socket Pin 1 mrk Trget system Note Depending on the probe used, the converter socket, converter dpter, or flexible bord my be required. Use the items provided with the probe intended for the trget device. The bove shows cse using the WQFN converter socket. For detils of the converter dpter nd flexible bord, refer to the User s Mnul of the respective probe. 18

33 CHAPTER 2 INSTALLATION PROCEDURE (10) Connect the emultion probe s plug to the converter socket tht ws soldered t step (9). Figure Connection between Emultion Probe nd Converter Socket Emultion probe Pull-up br WQFN converter socket Align the emultion probe s mrk to the Pin 1 mrk of the converter socket when connecting. Cution Use the pull-up br to remove the emultion probe s plug from the converter socket When not connecting with trget system Among the pins left open for connectors CN1 to CN4 on the IE R-EM, the input nd input/output ports hve 1 MΩ pull-down resistors. Accordingly, when not connecting with trget system, the connection pins cn be used in open condition. 19

34 CHAPTER 2 INSTALLATION PROCEDURE When replcing firmwre ROM When using IE R-EMs Ver.1.32 or lter to perform the emultion of trget device, replce the IE R firmwre ROM with the ROM IC86 Ver.1.6 provided with the IE R-EM. Follow the replcement procedure described below. (1) Remove the firmwre ROM mounted on the IE R t shipment from the socket. The firmwre ROM is locted next to the RTS SELECT switch in the RS-232C setting section t the side of the IE R. Figure Loction of Firmwre ROM (2) Insert the firmwre ROM IC86 Ver.1.6 provided with the IE R-EM in the socket. Cutions 1. IE Rs provided with firmwre ROM erlier thn Ver.1.6 cnnot be used for IE R-EMs Ver.1.32 or lter. If used, the messge NO CONNECT will be displyed. 2. Alwys replce the firmwre ROM before turning on the power. 20

35 CHAPTER 2 INSTALLATION PROCEDURE 2.2 User Clock Settings When the IE R is ctivted, the min system clock nd subsystem clock re set to the sttus selecting the internl clock. When using only the user clock from the min system clock nd subsystem clock, you must chnge the settings. When using the user clock, the mounting positions for the prts bords (SX1, SX2) re s follows. Figure Positions of SX1 nd SX2 CN4 CN3 CN2 CN1 SW1 ON P1 USER IE SW2 P2 IC80 IC79 IC3 IE R-EM D BOARD SX1 SX JP4 1 3 JP3 1 3 JP2 JP1 1 3 SX1 SX2 21

36 CHAPTER 2 INSTALLATION PROCEDURE (1) Switching between internl clock nd user clock in min system clock The min system clock cn be switched between internl clock nd user clock. The settings for using the user clock re s follows. <1> Setting of SX1 (prts bord) on IE R-EM <2> Use of CLK commnd to select U Tble 2-1. Switching between Internl Clock nd User Clock in Min System Clock Min System Clock Selection Set using CLK commnd Note Internl Clock CLK I Select internl clock CLK If the opernd is omitted, the current setting is displyed. IE Disply when internl clock hs been selected User Clock CLK U Select user clock (clock in trget system) CLK If the opernd is omitted, the current setting is displyed. User Disply when user clock hs been selected Note After selecting the clock source, be sure to use the RES commnd to reset the emultion device. If the opernd hs been omitted, the currently selected clock source nme will be displyed. When the IE R is ctivted, the internl clock is utomticlly selected. Cution If you execute the CLK U commnd without first setting SX1, the error messge E-CPU ERROR will be output. This occurs becuse the clock is not being supplied to the emultion device. 22

37 CHAPTER 2 INSTALLATION PROCEDURE Tble 2-2. Min System Clock Connection Circuit nd SX1 Setting (1/2) Min System Clock Selection Connection circuit during setting Internl Clock SX1 setting User Clock (1) When using n oscilltor Crystl resontor MHz Emultion device X1 X2 VCC GND CLOCK OUT (Crystl oscilltor) (Socket) Crystl oscilltor pin GND CLOCK OUT VCC Socket No (Connection) Crystl resontor Emultion device X1 X2 (2) When using resontor (Prts bord) Cermic resontor or crystl resontor Resistor Rx (normlly 0 Ω Note ) Cpcitor CA Cpcitor CB Led (No. between prts bord pins) (Connection) MΩ Emultion device Rx X1 X2 CA CB Prts bord Note If using low frequency such s 1 MHz, connect limiting resistnce. 23

38 CHAPTER 2 INSTALLATION PROCEDURE Tble 2-2. Min System Clock Connection Circuit nd SX1 Setting (2/2) Min System Clock Selection Connection circuit during setting Internl Clock User Clock (3) When using externl clock (No. between prts bord pins) Led (Prts bord) (Connection) Emultion device Emultion probe X1 pin X1 X2 Use oscilltion circuit output for externl clock. Leve the X2 pin open. Remrk The SX1 peripherl circuits re shown below. This should be used s reference when mounting cermic oscilltor with internl cpcitor to SX1 nd selecting the user clock. CLOCK IN SX CLOCK OUT 24

39 CHAPTER 2 INSTALLATION PROCEDURE (2) Switching between internl clock nd user clock in subsystem clock Use JP1 to switch between internl clock nd user clock in the subsystem clock. When using the user clock, be sure to set SX2 (prts bord) on the IE R-EM. If the trget device does not hve subsystem clock, the subsystem user clock cnnot be used. In ddition, if using something other thn fxt = khz, connect n (4.19 x fxt/32.768) MHz resontor to SX2. fxt: clock to be used Tble 2-3. Switching between Internl Clock nd User Clock in Subsystem Clock (1/2) Subsystem Clock Selection JP1 nd JP2 connection positions Internl Clock JP1 (1 nd 2 shorted) (Shipped setting) User Clock JP1 (2 nd 3 shorted) Cution To select the user clock, the CLK U commnd is effective only in the min system clock. Connection circuit for setting Crystl resontor khz Emultion device XT1 XT2 SX2 setting (1) When using n oscilltor VCC GND CLOCK OUT (Crystl oscilltor) (Socket) Crystl oscilltor pin Socket No. GND CLOCK OUT VCC (Connection) Crystl resontor Emultion device XT1 XT2 XT1 XT2 25

40 CHAPTER 2 INSTALLATION PROCEDURE Tble 2-3. Switching between Internl Clock nd User Clock in Subsystem Clock (2/2) Subsystem Clock Selection Internl Clock User Clock Connection circuit for setting (2) When using resontor (No. between prts bord pins) (Prts bord) Cermic resontor or crystl resontor Resistor Rx Cpcitor CA Cpcitor CB Led (Connection) MΩ Rx 1 MΩ Emultion device XT1 XT2 CA CB 1 MΩ XT1 XT2 (3) When using externl clock (No. between prts bord pins) Led (Prts bord) (Connection) Emultion probe XT1 pin 1 MΩ Emultion device XT1 XT2 1 MΩ XT1 XT2 Use oscilltion circuit output for externl clock. Leve the XT2 pin open. 26

41 CHAPTER 2 INSTALLATION PROCEDURE Remrk The SX2 peripherl circuits re shown below. This should be used s reference when using frequency other thn khz. CLOCK IN SX CLOCK OUT 27

42 CHAPTER 2 INSTALLATION PROCEDURE 2.3 Selection of Trget Device When connecting to the IE R, you cn select the trget device either by using the DIP switch (SW1) on the IE R-EM or by using the IE R s STS commnd. These two methods re described below Selection of trget device using SW1 If you use SW1 on the IE R-EM to set the trget device in dvnce, the selected trget device will lwys be set whenever the IE R s power is turned on. You cn chnge the trget device setting by using the IE R s STS commnd. Figure SW1 Setting (1/4) µpd75304, 306, 308, P308, 312, 316, P316, 304B, 306B, 308B µpd75312b, 316B, P316A, P316B ON ON SW1 SW1 OFF OFF (Bits 1 to 5 re ON.) (Bits 2 to 5 re ON.) µpd75328, P328 µpd75336, P336 ON ON SW1 SW1 OFF OFF (Bits 1 nd 3 to 5 re ON.) (Bits 3 to 5 re ON.) µpd750004, 0006, 0008, P0016 (Mk I) µpd750004, 0006, 0008, P0016 (Mk II) ON ON SW1 SW1 OFF (Bits 1, 2, 4, nd 5 re ON.) OFF (Bits 2, 4, nd 5 re ON.) 28

43 CHAPTER 2 INSTALLATION PROCEDURE Figure SW1 Setting (2/4) µpd750104, 0106, 0108, P0116 (Mk I) µpd750104, 0106, 0108, P0116 (Mk II) ON ON SW1 SW1 OFF (Bits 1, 4, nd 5 re ON.) OFF (Bits 4 nd 5 re ON.) µpd750064, 0066, 0068, P0076 (Mk I) µpd750064, 0066, 0068, P0076 (Mk II) ON ON SW1 SW1 OFF (Bits 1, 2, nd 5 re ON.) OFF (Bits 2 nd 5 re ON.) µpd753012, 3016, 3017, P3018 (Mk I) µpd753012a, 3016A, 3017A, P3018A (Mk I) µpd753012, 3016, 3017, P3018 (Mk II) µpd753012a, 3016A, 3017A, P3018A (Mk II) ON ON SW1 SW1 OFF (Bits 1, 4, nd 5 re ON.) OFF (Bits 4 nd 5 re ON.) µpd753036, P3036 (Mk I) µpd753036, P3036 (Mk II) ON ON SW1 SW1 OFF OFF (Bits 1 nd 5 re ON.) (Bits 5 is ON.) 29

44 CHAPTER 2 INSTALLATION PROCEDURE Figure SW1 Setting (3/4) µpd753104, 3106, 3108, P3116 (Mk I) µpd753104, 3106, 3108, P3116 (Mk II) ON ON SW1 SW1 OFF (Bits 1 to 3 nd 5 re ON.) OFF (Bits 2, 3, nd 5 re ON.) µpd753204, 3206, 3208, P3216 (Mk I) µpd753204, 3206, 3208, P3216 (Mk II) ON ON SW1 SW1 OFF (Bits 1 to 4 re ON.) OFF (Bits 2 to 4 re ON.) µpd (Mk I) µpd (Mk II) ON ON SW1 SW1 OFF (Bits 1, 2, nd 4 re ON.) OFF (Bits 2 nd 4 re ON.) µpd (Mk I) µpd (Mk II) ON ON SW1 SW1 OFF (Bits 1 to 5 re ON.) OFF (Bits 2 to 5 re ON.) 30

45 CHAPTER 2 INSTALLATION PROCEDURE Figure SW1 Setting (4/4) µpd754144, 4244 (Mk I) µpd754144, 4244 (Mk II) ON ON SW1 SW1 OFF (Bits 1, 3, nd 5 re ON.) OFF (Bits 3 nd 5 re ON.) µpd (Mk I) µpd (Mk II) ON ON SW1 SW1 OFF (Bits 1 nd 3 to 5 re ON.) OFF (Bits 3 to 5 re ON.) µpd75f4264 (Mk I) µpd75f4264 (Mk II) ON ON SW1 SW1 OFF (Bits 1, 2, 4, nd 5 re ON.) OFF (Bits 2, 4, nd 5 re ON.) µpd754302, 4304, P4308 (Mk I) µpd754302, 4304, P4308 (Mk II) ON ON SW1 SW1 OFF (Bits 1, 3, nd 4 re ON.) OFF (Bits 3 nd 4 re ON.) 31

46 CHAPTER 2 INSTALLATION PROCEDURE Selection of trget device using STS commnd The IE R s STS commnd (STS C) cn be used to chnge the trget device setting regrdless of the SW1 setting on the IE R-EM. After entering the commnd, select the number for the trget device from the menu screens to select new trget device. The list of trget devices is divided into two screens. After executing the STS C commnd, press the RETURN key to switch screens. When the power is switched on, the trget device will be tht selected vi SW1 on the IE R-EM. Enter STS D to disply the selected trget device. In ddition to the trget device nme, this disply shows the progrm memory re ddress nd other device-relted informtion. Exmple of disply following STS C commnd: () When informtion ROM nd system setting dt ROM re Ver.3.3 brk:0>sts c (1) Trget CPU upd75304/304b/306/306b/308/308b/p308/312/316/p316 (2) Trget CPU upd75312b/316b/p316a/p316b (3) Trget CPU upd75328/p328 (4) Trget CPU upd75336/p336 (5) Trget CPU upd750004/0006/0008/p0016(mki) (6) Trget CPU upd750004/0006/0008/p0016(mkii) (7) Trget CPU upd753017/3017a/3016/3016a/3012/3012a/p3018/p3018a(mki) (8) Trget CPU upd753017/3017a/3016/3016a/3012/3012a/p3018/p3018a(mkii) (9) Trget CPU upd753108/3106/3104/p3116(mki) (10) Trget CPU upd753108/3106/3104/p3116(mkii) (11) Trget CPU upd754144/4244(mki) (12) Trget CPU upd754144/4244(mkii) (13) Trget CPU upd750064/0066/0068/p0076(mki) (14) Trget CPU upd750064/0066/0068/p0076(mkii) (15) Trget CPU upd753036/p3036(mki) (16) Trget CPU upd753036/p3036(mkii) (17) Trget CPU upd753208/3206/3204/p3216(mki) (18) Trget CPU upd753208/3206/3204/p3216(mkii) (19) Trget CPU upd754304/4302/p4308(mki) (20) Trget CPU upd754304/4302/p4308(mkii) (21) Trget CPU upd753304(mki) (22) Trget CPU upd753304(mkii) Trget CPU No. 11(cr:next pge /.:end)= <1> <2> <3> <1> Chnge trget device <2> Selectble trget device Select the trget device used ccording to the number in prentheses. The device nme displyed differs ccording to the version of the informtion ROM nd system setting dt ROM. <3> Select trget device 32

47 CHAPTER 2 INSTALLATION PROCEDURE (b) When informtion ROM nd system setting dt ROM re Ver.4.3 brk:0>sts c (1) Trget CPU upd754102/4202(mki) (2) Trget CPU upd754102/4202(mkii) (3) Trget CPU upd754264(mki) (4) Trget CPU upd754264(mkii) (5) Trget CPU upd75f4264(mki) (6) Trget CPU upd75f4264(mkii) (7) Trget CPU upd750104/0106/0108/p0116(mki) (8) Trget CPU upd750104/0106/0108/p0116(mkii) Trget CPU No. 1(cr:next pge /.:end)= <1> <2> <3> <1> Chnge trget device <2> Selectble trget device Select the trget device used ccording to the number in prentheses. The device nme displyed differs ccording to the version of the informtion ROM nd system setting dt ROM. <3> Select trget device Exmple of disply following STS D commnd: brk:0>sts d Trget CPU upd75304/304b/306/306b/308/308b/p308/312/316/p316 Progrm Memory 0-FFFFH Dt Memory 00H-1FFH, F80H-FFFH Memory Bnk 0-1, 15 Register Bnk 0-0 <1> <1> Disply trget device for debugging Cution On the trget device, the SBS.3 setting cn be used to select between Mk I (2-byte stck opertion) nd Mk II (3-byte stck opertion), but note tht the selection mde using the STS commnd is in effect. 33

48 CHAPTER 2 INSTALLATION PROCEDURE 2.4 ROM Checking nd Replcement ROM checking With the Ver.1.47 IE R-EM, it is necessry to replce the informtion ROM nd system setting dt ROM mounted t shipment (Ver.3.3) with the ROM (Ver.4.3) provided ccording to the trget device used. Tble 2-4 shows the trget device nd corresponding ROM. Tble 2-4. Trget Device nd Corresponding ROM Trget Device Corresponding ROM µpd75304, 304B, 306, 306B, 308, 308B, P308, ROMs mounted t shipment 75312, 312B, 316, 316B, P316, P316A, P316B, Informtion ROM 75328, P328, 336, P336, IC79, IC80 (Ver.3.3) , 0006, 0008, P0016, System setting dt ROM , 0066, 0068, P0076, IC3 (Ver.3.3) , 3012A, 3016, 3016A, 3017, 3017A, P3018, P3018A, , P3036, , 3106, 3108, P3116, , 3206, 3208, P3216, Notes 1, 2, , 4244, , 4304, P4308 µpd750104, 0106, 0108, P0116, ROMs provided with IE R-EM , 4264, F4264 Note 2 Informtion ROM IC79, IC80 (Ver.4.3) System setting dt ROM IC3 (Ver.4.3) Notes 1. Supports only ES products (shrink DIP (DU)), but not mss produced products (bre chip). 2. Under development Before use, check tht the versions of the informtion ROM nd system setting dt ROM mounted on the IE R-EM correspond to the trget device used. 34

49 CHAPTER 2 INSTALLATION PROCEDURE Figure Positions of Informtion ROM nd System Setting Dt ROM CN4 CN3 CN2 CN1 SW1 ON P1 USER IE SW2 Informtion ROM P2 IC80 IC79 IC3 System setting dt ROM IE R-EM D BOARD SX1 SX JP4 1 3 JP3 1 3 JP2 JP1 1 3 IE R-EM 35

50 CHAPTER 2 INSTALLATION PROCEDURE Informtion ROM replcement Replce the informtion ROM s follows. (1) Remove the IE R-EM D BOARD from the IE R-EM. The IE R-EM D BOARD is inserted into CN5 nd CN6 of the IE R-EM. Figure Removl of IE R-EM D BOARD (2) Remove the informtion ROMs IC79 nd IC80 from the IC79 nd IC80 sockets on the IE R-EM. Figure Removl of Informtion ROM 36

51 CHAPTER 2 INSTALLATION PROCEDURE (3) Insert the informtion ROMs IC79 nd IC80 for replcement into the IC79 nd IC80 sockets. Figure Mounting of Informtion ROM (4) Insert the IE R-EM D BOARD into CN5 nd CN6 of the IE R-EM. Figure Connection of IE R-EM D BOARD 37

52 CHAPTER 2 INSTALLATION PROCEDURE System setting dt ROM replcement Replce the system setting dt ROM s follows. (1) Remove the system setting dt ROM from the IC3 socket on the IE R-EM D BOARD. Figure Removl of System Setting Dt ROM (2) Insert the system setting dt ROM IC3 for replcement into the IC3 socket. Figure Mounting of System Setting Dt ROM 38

53 CHAPTER 2 INSTALLATION PROCEDURE 2.5 Msk Options For detils of msk options, see the user s mnul for the trget emultion probe. 2.6 Power Supply Setting Two types of power supply cn be set for emultion using the IE R-EM: the IE R s internl power supply or user power supply. Use SW2 to mke the power supply setting. SW2 s shipped setting is for use of the IE R s internl power supply. Figure SW2 Setting USER SW2 USER SW2 IE IE IE: sets IE R s internl power supply USER: sets user power supply If you use SW2 to set user power supply, emultion cn be performed in the power supply voltge VDD rnge of 2.7 to 5.0 V. However, if you use the IE R s internl power supply, emultion cn only be performed t VDD = 5.0 V. Cutions 1. When performing low-voltge emultion, mke sure tht the power supply is pplied to VDD. 2. When performing emultion with user power supply, mke sure tht the RESET pin is pulledup. Remrk IE R-EMs Ver.1.32 or lter do not hve SW3 to SW5 nd JP4 to JP11, therefore settings re not necessry. IE R-EM D BOARD hs the functions of SW3 to SW5 nd JP4 to JP11, nd utomticlly performs the settings. 39

54 CHAPTER 2 INSTALLATION PROCEDURE 2.7 JP2 nd JP3 Settings JP2 nd JP3 re jumper pins (JP) to select IE R-EM D BOARD. Therefore, their settings do not need to be chnged. The fctory-shipped jumpers re instlled between 2 nd 3 on both JP2 nd JP3. Figure JP2 nd JP3 Settings JP2 JP3 2.8 JP1 of IE R-EM D BOARD Setting JP1 of IE R-EM D BOARD is jumper pin to select the version of µpd which is the emultion device of IE R-EM D BOARD. Therefore, its setting does not need to be chnged. The fctory-shipped jumpers re instlled s shown below depending on the version. Figure JP1 of IE R-EM D BOARD Setting (1) When version of IE R-EM is 1.32 to JP1 (2) When version of IE R-EM is 1.46 or lter JP1 40

55 CHAPTER 3 DIFFEREES BETWEEN IE R AND TARGET DEVICES WHEN CONNECTING THE IE R (ALL TARGET DEVICES COMMON VERSION) CHAPTER 3 DIFFEREES BETWEEN IE R AND TARGET DEVICES WHEN CONNECTING THE IE R (ALL TARGET DEVICES COMMON VERSION) When combining the IE R-EM with the IE R-BK to emulte vrious trget devices, the executble commnds, progrm memory re, pin tretment, nd other fctors vry in some respects from the opertion of n ctul device. These differences should be noted, nd re described below. 3.1 Differences in Executble Commnds The emultion CPU (µpd75000a Note 1 ) for the IE R-BK cn execute the entire commnd sets of the 75X nd 75XL Series even when it is connected to the IE R-EM. Accordingly, this includes commnds tht re not supported by the trget device or tht hve different use rnges from the trget device s commnds. This should be noted when developing progrms Note 2. Notes 1. The IE R-BK uses µpd75000a s dedicted device for executing emultion of common functions of the 75X nd 75XL Series. 2. The trget device cn be specified using the reloctble ssembler (RA75X) for the 75X Series to enble progrm development within the trget device s instruction set. 3.2 Differences in Progrm Memory Are The IE R-BK hs 64 Kbytes of progrm memory re, ll of which cn be used even when the IE R-BK is connected to the IE R-EM. When using this re, be sure to note the internl ROM cpcity of the trget device. 3.3 Differences in Power Supply Voltge Although ctul devices operte with power supply voltges VDD = 2.7 V to 6.0 V, 2.0 V to 6.0 V, or 1.8 V to 6.0 V, the IE R-EM cn perform emultion with power supply voltge VDD = 2.7 V to 5.0 V. 3.4 Differences in Clock Genertion Circuit When emulting device which hs RC oscilltion, use the internl clock (4.19 MHz) or the user clock. Oscillion with n externl resistor (R) nd cpcitor (C) is not possible. 41

56 CHAPTER 3 DIFFEREES BETWEEN IE R AND TARGET DEVICES WHEN CONNECTING THE IE R (ALL TARGET DEVICES COMMON VERSION) 3.5 Opertion Using Min System Clock or Subsystem Clock Min system clock oscilltion stop (SCC.3 = 1) The following re differences when the min system clock s oscilltion is stopped. Min system clock Bsic intervl timer opertion Emultion Does not stop Operble vi divided clock of X1 input (32 khz x1, x2, x16) Trget Device Stops Stops After switching to subsystem clock oscilltion, the clock supplied to the peripherl hrdwre differs until the min system clock s oscilltion is stopped. Supplied clock Emultion 32 khz x1, x2, x16 Trget Device 4.19 MHz divided clock As shown bove, the emultion opertes differently from the trget device, nd the following cution points should be noted. (1) Bsic intervl timer opertion Before switching to 32 khz (SCC.0 = 1), set the BT interrupt to disbled mode. When the clock returns to the min system clock (SCC.0 = 0), be sure to use the strt commnd to cler the interrupt request flg nd counter before using the BT. (2) Peripherl hrdwre opertion Before switching to 32 khz (SCC.0 = 1), set the peripherl hrdwre for internl clock opertion to interrupt disbled mode or opertion stop mode. (3) When using trget device subsystem clock with frequency other thn fxt = khz, connect (4.19 x fxt/32.768) MHz resontor to SX2. fxt: clock to be used 42

57 CHAPTER 3 DIFFEREES BETWEEN IE R AND TARGET DEVICES WHEN CONNECTING THE IE R (ALL TARGET DEVICES COMMON VERSION) 3.6 Differences between IE R-EM Version s Erlier thn Ver nd Trget Devices While IE R-EMs erlier thn Ver.1.32 hve the following differences with the trget device, the Ver.1.47 do not hve such restrictions nd cn crry out the sme opertions s the device. Restrictions of IE R-EMs erlier thn Ver.1.32 Emultion Trget Device Opertion when using the P02/SO/ Low-voltge emultion is possible Opertes regrdless of the power SB0 nd P03/SB7/SI pins s seril only with some devices voltge interfce I/O port Buzzer output frequency 2 khz only Selectble 2 khz, 4 khz, nd 32 khz 3.7 Restrictions When using SPR commnd of the control progrm, the mnipultion of the system clock control register (SCC) is mde illegl. Do not mnipulte SCC, SCC.0, nd SCC.3 with SPR commnd. The following methods re tken to bypss the problem. When reding (checking the vlue) Check the trce result nd mke sure the mnipultion instruction hs been executed. When writing Describe the mnipultion instruction on the progrm. 43