SiP Modules Application Driven Integration. Eelco Bergman ASE Group November 14, 2016 San Jose, CA
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1 SiP Modues Appication Driven Integration Eeco Bergman ASE Group November 14, 2016 San Jose, CA
2 ASE Group at a Gance Estabished 1984, production commenced at fagship factory in Kaohsiung, Taiwan. IC Assemby, Test & Materias (ATM) achieved goba market eadership in 2004, surpassing a payers in OSAT industry. Competed acquisition of Universa Scientific Industria Co. (USI) to expand DMS modue & system manufacturing capabiity. Operations now at 18 faciities wordwide, serving mutipe markets, appications, & geographies. >60K empoyees: Goba team comprises operations, engineering, R&D, saes & marketing. ASE Group overa revenue of $8.95B in 2015, 5% over 2014 ASE Group. A rights reserved. 2
3 ASE s Roe in the Manufacturing Vaue Chain IC Design Foundry OSAT EMS/ODM ODM/OEM IC Design Radio Design Software Deveopment Marketing Technica Support Siicon Sourcing Wafer Fabrication Wafer Test Package Design Bumping / WLCSP Packaging Assemby Package Leve Testing Substrate Manufacturing Modue Design Component Sourcing Modue Assemby Modue Testing FAE Support System Design System Assemby System Test Software Deveopment Product Marketing Logistic Service Saes & Support Unique Turnkey Soution Bridging OSAT & EMS/ODM ASE Group. A rights reserved. 3
4 Group Synergy Fu turnkey soution from design to deivery ASE Group. A rights reserved. 4
5 SiP Modue Overview ASE Group. A rights reserved. 5
6 50 Years - Revisiting Moore s Vision The future of integrated eectronics is the future of eectronics itsef. The advantages of integration wi bring about a proiferation of eectronics, pushing this science into many new areas. Gordon Moore, Apri 19, 1965 Today s reaity everages compementary and parae integration paths SoC integration continues for advanced products requiring Moore s Law performance & density SiP heterogeneous device integration for rapid NPI and cost sensitive appications ASE Group. A rights reserved. 6
7 Industry Dynamics Driving SiP Modues Moore s Law sowing & divergence Increasing SoC deveopment eadtime and cost (4X from 28nm to 14/16mn) Need for aternative to SoC integration - higher cost/transistor for advanced process nodes Vaue chain consoidation suppy chain re-verticaization Content providers deveoping hardware systems to differentiate ecosystems Need for rapid NPI - BOM simpification, ower cost and reduced time to market Goba connectivity acceeration Mobie, wearabe and IoT systems driving miniaturization Need for re-configurabiity - rapidy changing standards and appication requirements Ø SiP modues provide aternative soutions for functiona integration, miniaturization, optimization and cost reduction ASE Group. A rights reserved. 8
8 System in Package / Modue SiP / SiM are package or modue based soutions that contain an appication focused functiona eectronic system or sub-system that is integrated and miniaturized through IC assemby technoogies Miniaturized Modue Package Eectronic System Functionaity IC Assemby Technoogy ASE Group. A rights reserved. 8
9 Integration & Miniaturization SiP SoC 3D IC Memory Siicon Die Based Connectivity RF / FEM 2.5D IC FPGA, GPU, NPU Device System Package Modue PMU Appication driven Bridging OSAT & EMS Sensor Fusion IoT Fitness IC Package Based Camera Touch Sensor SmartWatch VR Headset SiM Biometric SSD ASE Group. A rights reserved. 9
10 System Miniaturization SiP is an IC package that incudes active die and SMT components SiM is stand aone or connector based modue utiizing IC and SMT miniaturization technoogies System Miniaturization and Moduarization Exampes Wearabe IoT devices NUC (Next Unit of Computing) Compute stick System everaged sub systems Connectivity modues WiFi, BT/BLE, Zigbee Storage modues - SSD Sensor modues Biometric, IMU, Pressure, Light/Proximity ASE Group. A rights reserved. 10
11 SiP Modue Benefits Die1 28nm/Fab1 Digita + Die2 40nm/Fab2 Anaog + + SAW Fiter + Die4 14nm/Fab4 Power Die3 20nm/Fab3 Memory + MEMS Sensor Die1 28nm/Fab1 Digita Die3 20nm/Fab3 Memory Die2 40nm/Fab2 Anaog SAW Fiter MEMS Sensor Die4 14nm/Fab4 Power Die/Package, Components System-in-Package (SiP) Highy heterogeneous integration - incuding different wafer technoogies Miniaturized by SiP core technoogies Performance optimized - signa integrity and power Decreased deveopment time rapid NPI Lower cost aternative to SoC Simpified system PCB & BOM improved reiabiity Fexibe, re-usabe & re-configurabe One step coser to stand-aone system ASE Group. A rights reserved. 11
12 SiP Modue Vaue Map In many cases, systems are made of a weighted mix of SoC, SiP and SoB ASE Group. A rights reserved. 12
13 Exampe Smart Phone Evoution System miniaturization enabed by SiP ASE Group. A rights reserved. 13
14 Enabing Technoogies & Exampes ASE Group. A rights reserved. ASE Confidentia 14
15 Heterogeneous Integration FanOut Bridging the Interconnect Density Gap SiP HD FOSiP PoP 2.5D Embedded LD FOSiP HD FOCoS PoP HD FOWLP Die Die FC CSP LD FOWLP Muti-Die Pkg L/S (um) ASE Group. A rights reserved. 15
16 Fan Out Based Soutions ewlb BB, RF, Codec, PMIC, Car Radar. FOCLP BB, RF, Codec, PMIC. FOCoS Networking, Server. FO PoP AP & Memory Integration... FO SiP AP & Memory Integration, RF Modue. Max. Pkg size ~10x10 RDL L/S > 8/8um 2L RDL Max. Pkg size ~12x12 RDL L/S > 12/12um 1L RDL Max. Pkg size ~45x45 RDL L/S > 2/2um 3L RDL Max. Pkg size ~15x15 RDL L/S > 5/5um 3L RDL Max. Pkg size ~15x15 RDL L/S > 5/5um 3L RDL Chip first Wafer FO High I/O WLP Substrate-ess Sma form factor KGD Chip ast Coreess substrate Cu piar fip on ETS (40um) Lower cost FO Sma form factor Chip first FCBGA assemby Die partition High I/O connect (>1000) Good eectrica Aternative to 2.5D Chip first Wafer FO Thin package height Package on package High bandwidth performance Passive integrated Chip ast Wafer FO Known good RDL Sma & ow profie modue Fuy functiona system ASE Group. A rights reserved. 16
17 SiP Enabing Technoogies 1 Interconnection Wire Bond Fip Chip TSV 8 Shieding / Antenna Conforma Shieding Compartment Shieding Antenna on/in package 7 MEMS / Sensor Motion Environmenta Image / Optica 2 Encapsuation Exposed Die Irreguar Shape Seective Area Doube Sided IPD Memory APU / MPU MEMS 6 System Assemby HD-SMT Rigid / Fex Mechanica Assy AFE EPS 3 Wafer Leve Process IPD WLP / Fan-Out FOCoS 4 Embedded Technoogy TDK SESUB aeasi 5 Die / Pkg Stacking Muti-die stack 2.5D, 3DIC PoP, PiP ASE Group. A rights reserved. 15
18 Wireess Connectivity - WiFi Appication: WiFi a/b/g/n 2x2 + BT4.0 for mobie and wearabe Passive 50 Pcs Substrate : 2+2+2, 0.30 mm MUF C/S, um SMT cearance SI Substrate Conforma Shieding (Option) SI Mod Underfi (MUF) Soder Ba LGA Pinout Now : Singe Sided Modue Modue Size : 10.0x6.6x1.1 mm Soution : Doube Sided Moding Modue Modue Size : 7.75 x 5.4 x 1.3 mm Services Provided : Modue Design & Manufacturing Technoogies Leveraged : Doube Side SMT Doube Side Moding & Exposed Moding Conforma Shieding Benefit Reaized : 30 % modue XY size reduction ASE Group. A rights reserved. 18
19 Wireess Connectivity BLE Appication : Buetooth Low Energy (BLE) for Wearabe Product BLE 4.0 (2.4 GHz) Singe Chip (Nordic n51822) RF Passive 20 Pcs Substrate : 4 ayer, 0.3 mm Meta Lid, 0201 Current : Singe Sided Modue with Chip Antenna Modue Size : 15.0 x 15.0 x 2.0 mm Meta Stamped Antenna BLE Soution : AoP (Antenna on Package) Modue Size : 6.5 x 6.5 x 1.2 mm Services Provided: Modue Design & Mfg. BLE AoP Modue For Wearabe Beacon Product Technoogies Leveraged: AoP ( Antenna on Package) Benefit : 82 % modue XY size reduction AoP Modue (6.5 x 6.5 x 1.2 mm) ASE Group. A rights reserved. 19
20 Sensor Optica HRM Appication : Body motion & physioogica sign sensing in mobie/wearabe Passive PD LED LED AFE MCU Services Provided: Modue design and manufacturing, system-eve testing & firmware co-quaification Technoogies Leveraged : Now : Discrete on PCBA Modue Size : 15.0 x 15.0 x 1.7 mm Embedded Die Substrate Cear compound moding with micro-structure enhancement Benefit : Now : Integrated Sensor Modue Size : 6.6 x 2.4 x 0.78 mm 84 % modue XY size reduction Better optica signa interference isoation Less parasitic resistance & capacitance ASE Group. A rights reserved. 20
21 Summary COMPUTING PORTABLE WEARABLE CONSUMER NETWORKING / IoT AUTOMOTIVE Appication focused SiP advanced technoogy & fu turnkey suppy soutions Design Wafer Bumping Assemby Test System MEDICAL Substrate Design Manufacturing Service Modeing & Simuation 6 / 8 / 12 wafer Re-passivation Sputter or Pating UBM / RDL Ba Drop, Printing, PB-free, Cu Piar Standard IC Packages Advanced Fip Chip Hybrid (WB/FC) MEMS / Optica Sensor Modue Automotive Grade-0 Wafer Probing IC & Modue Test Anaog/Power/RF /Mixed-Signa Test Program Deveopment SiP (system in package) DMS (Modue, Board Assemby and Test) Hybrid & Eectronic Packaging ASE Group. A rights reserved. 22
22 ASE Group. A rights reserved.
23 Thank You ASE Group. A rights reserved. 23
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